1. 製品の概要: What Is a Cooker Hood Mother Board PCB?
A cooker hood mother board PCB (プリント基板) serves as the central hardware backbone of a range hood control system. This rigid printed circuit board handles all electrical connections and signal transmission tasks for motor driving, touch sensing, LED lighting control, airflow adjustment, and delayed shut‑off functions.
UGPCB presents this cooker hood motherboard PCB manufactured with Kingboard KB6165G high-end laminate. This double-sided rigid printed circuit board is specifically engineered for long‑term reliable operation in harsh kitchen environments. The プリント基板 対策 82.63 × 46.7 mm with a standard 1.6 板厚mm. Its double‑sided routing structure delivers excellent electrical performance and mechanical strength for medium‑complexity control circuits.
Industry data shows that China’s range hood control board shipments reached 38.60 百万単位 2024, marking a 5.7% year‑over‑year growth. Smart control boards now account for 58.7% of total shipments. Given this substantial market demand, selecting a reliable and well‑manufactured cooker hood PCB directly impacts the end product’s quality and user experience.
2. 製品定義と技術仕様
2.1 Basic Parameters
| パラメーター | 仕様 |
|---|---|
| 製品名 | レンジフードマザーボードPCB |
| Laminate Material | Kingboard KB6165G (Halogen‑Free TG150 Glass Fiber Copper‑Clad Laminate) |
| 板厚 | 1.6 mm |
| レイヤー数 | 2 レイヤー (Double‑Sided Board) |
| 完成したサイズ | 82.63 × 46.7 mm |
| 最小穴の直径 | 0.296 mm |
| 最小線幅 / 行間 | 0.342 mm / 0.37 mm |
| 銅箔の厚さ | 1/1 オズ (35 μm per layer) |
| 表面仕上げ | 無電解ニッケル / イマージョンゴールド (同意する / Gold Plating Process) |
| はんだマスク / 伝説 | Black Solder Mask / 白いシルクスクリーンの伝説 |
2.2 Laminate Material: Kingboard KB6165G
This product uses KB6165G, a halogen‑free TG150 glass fiber copper‑clad laminate from Kingboard Laminates Holdings Ltd. This industrial‑grade high‑performance laminate delivers the following key properties:
- ガラス転移温度 (TG) : 150℃ (155‑158°C measured by DSC method). The material withstands three lead‑free reflow soldering cycles with a peak temperature of 260°C.
- 比較追跡指数 (CTI) : 600 V. This represents a threefold improvement over the base model KB‑6165F (CTI ≥ 175 V), offering exceptional resistance to tracking failure.
- Z‑axis Coefficient of Thermal Expansion (CTE) : アルファ 1 で 41 ppm/°C, アルファ 2 で 235 ppm/°C.
- T288 Delamination Time : > 60 分, several times higher than standard FR‑4 materials.
- 熱分解温度 (TD, 5% 減量) : 370℃.
- 可燃性評価 : UL94 V‑0.
- 表面抵抗率 : 5.2 ×10⁸MΩ.
- 体積抵抗率 : 6.1 × 10⁹ MΩ‑cm.
- はく離強度 : 1.4 N/mm (のために 1 オンスの銅箔).
This laminate passes 96‑hour salt spray testing and is free of halogens, antimony, and red phosphorus, fully complying with RoHS environmental directives.
3. Design Principles and Operating Principles
3.1 Design Standard Compliance
This product’s design strictly followsIPC‑2221C, プリント基板設計に関する一般規格 (released August 18, 2025). IPC‑2221C serves as the foundation design standard for all documents in the IPC‑2220 series. It establishes generic requirements for printed board design, covering material selection, copper foil selection, minimum electrical clearance, impedance tolerances, and other core design specifications.
3.2 Engineering Basis for Line Width and Spacing Design
This product features a design line width of 0.342 mm and line spacing of 0.37 mm. These parameters are determined based on the current‑carrying capacity formula from the IPC‑2221 standard:
I = k × ΔT^0.44 × A^0.725
どこ:
- 私 = Maximum allowable current (Amperes, あ)
- k = Correction factor (0.048 for outer layer traces, 0.024 for inner layer traces)
- Δt = Temperature rise (℃)
- あ = Conductor cross‑sectional area (ミル平方)
For this product with 1 オンスの銅箔 (約 35 μm thickness), outer layer traces can carry approximately 1.5‑2 A per millimeter of width at a 10°C temperature rise. The 0.342 mm line width sufficiently meets the current‑carrying demands of range hood control circuits (typically including motor drive currents of 3‑5 A and touch/logic circuit currents below 1 あ), while providing adequate process windows for subsequent PCBA soldering operations.
3.3 動作原理
The cooker hood motherboard PCB functions as the physical carrier of the control system, operating at three levels:
Electrical Connection Level : The copper traces on the PCB electrically connect the MCU (main control chip), touch sensing modules, motor driver ICs, LED driver circuits, and power management modules according to the schematic diagram, enabling orderly signal transmission.
Signal Processing Level : User commands entered through the touch panel (power on/off, airflow adjustment, lighting control, 等) travel via touch traces on the PCB to the MCU. 処理後, the MCU outputs corresponding control signals through the driver traces on the PCB to activate motors, LEDライト, and other actuating components.
Power Management Level : Power traces on the PCB convert the input AC or DC power to the operating voltages required by each component. Proper power/ground plane layout ensures power supply stability.
4. 製品分類
Based on printed circuit board industry classification standards, この製品は次のカテゴリに分類されます:
| 分類次元 | カテゴリ |
|---|---|
| 構造によって | Rigid Printed Circuit Board |
| レイヤーカウントごとに | Double‑Sided Board (2‑Layer Board) |
| By Laminate Material | FR‑4.1 Grade Halogen‑Free Glass Fiber Copper‑Clad Laminate (KB6165G) |
| 表面仕上げによる | 無電解ニッケル / イマージョンゴールド (同意する) |
| アプリケーションによって | Home Appliance Control Board (Cooker Hood Mother Board) |
| 可燃性評価による | UL94 V‑0 |
| By Environmental Compliance | Halogen‑Free, ROHS準拠 |
あたりIPC‑6012F, リジッドプリント基板の認定および性能仕様 (released September 2023), this product meetsクラス 2 – Dedicated Service Electronic Products 要件. クラス 2 applies to products where extended life is expected and uninterrupted service is desired, but the operating environment is not extreme—perfectly matching home appliance applications.
5. 使用材料
5.1 基板: KB6165G Copper‑Clad Laminate
As detailed above, this product uses Kingboard KB6165G halogen‑free TG150 glass fiber copper‑clad laminate with the following material composition:
- 強化 : Electronic‑grade glass fabric
- Matrix Resin : Halogen‑free epoxy resin (ガラス転移温度150℃)
- 銅箔 : 1 oz Electrolytic Copper Foil (ED銅)
- 難燃システム : Halogen‑free flame retardant (UL94 V‑0)
5.2 表面仕上げ: 無電解ニッケル / イマージョンゴールド (同意する)
This product uses the Electroless Nickel / イマージョンゴールド (同意する) surface finish process. あたりIPC‑4552B, Specification for Electroless Nickel/Immersion Gold (同意する) プリント基板用めっき (published May 2021), ENIG deposit thickness requirements are:
- Nickel Layer Thickness : 3‑6 μm (per IPC‑4552B Class 1/2/3)
- Gold Layer Thickness : 0.05‑0.10 μm (typical range: 0.075‑0.125 μm)
ENIG surface finish offers these advantages:
- 優れたはんだ付け性, meeting the highest coating durability rating per IPC‑J‑STD‑003
- Superior oxidation and corrosion resistance
- Flat surface suitable for fine‑pitch component soldering
- Suitable for wire bonding and contact finish applications
5.3 はんだマスクと凡例
- はんだマスク : Black ink offering excellent insulation and heat resistance
- 伝説 : White silkscreen providing high contrast for SMT placement and repair identification
6. 製品の構造と性能特性
6.1 構造的特徴
Double‑Sided Design (2 レイヤー) : Both the Top Layer and Bottom Layer contain circuit traces, with electrical connections between layers made through Plated Through‑Holes (PTH). The double‑sided structure balances routing density with cost‑effectiveness.
Precision Hole Diameter Control : Minimum hole diameter of 0.296 mm meets the strict requirements of IPC‑6012F for plated through‑holes. Copper plating on hole walls ensures reliable interlayer connections and conductivity.
Compact Dimensions : The 82.63 × 46.7 mm compact size is specifically tailored for the limited internal space of range hoods, facilitating overall product mechanical design.
標準 1.6 mm Board Thickness : This thickness maintains mechanical strength while matching standard component lead lengths, 促進する プリント基板 組み立て.
6.2 性能特性
Superior Heat Resistance : With Tg of 150°C and Td of 370°C, the board withstands the high‑temperature impact of lead‑free reflow soldering (ピーク260℃).
Excellent Insulation Performance : Surface resistivity of 5.2 × 10⁸ MΩ and volume resistivity of 6.1 × 10⁹ MΩ‑cm ensure reliable signal transmission in high‑humidity kitchen environments.
High CTI Tracking Resistance : The CTI 600 V rating effectively prevents tracking failure in high‑pollution environments (kitchen fume environments fall under Pollution Degree 2‑3).
Good Anti‑CAF Performance : The laminate offers strong resistance to Conductive Anodic Filament (CAF) formation, reducing the risk of CAF failure in moist‑heat environments.
UL94 V‑0 Flammability Rating : Meets the highest fire safety requirements for home appliances.
7. 製造工程の流れ
UGPCB manufactures this cooker hood motherboard PCB in strict compliance with IPC‑6012F requirements:
ステップ 1: 着信品質管理 (IQC) → Inspect KB6165G copper‑clad laminate, 銅箔, ドライフィルム, solder mask ink, and other raw materials
ステップ 2: 切断 → Cut large copper‑clad laminate sheets to working panel size
ステップ 3: 掘削 → CNC drilling machines process the 0.296 mm minimum hole diameter along with other mounting holes and vias
ステップ 4: 無電解銅めっき / パネルメッキ → Metallize hole walls to create conductive through‑holes
ステップ 5: パターン転写 → Apply dry film → Expose → Develop to form the circuit pattern
ステップ 6: エッチング → Remove unprotected copper to create the designed circuit traces
ステップ 7: はんだマスク → Print black solder mask ink → Expose → Develop to expose pads
ステップ 8: 同意する (無電解ニッケル / イマージョンゴールド) → Electroless nickel plating (3‑6 μm) + イマージョンゴールド (0.05‑0.10 μm)
ステップ 9: 凡例の印刷 → Print white silkscreen legend identifiers
ステップ 10: ルーティング / V‑Cut → CNC routing to final dimensions of 82.63 × 46.7 mm
ステップ 11: 電気テスト → Flying probe testing / fixture testing to verify open/short circuit integrity
ステップ 12: 最終的な品質管理 (FQC) → Visual inspection and dimensional inspection per IPC‑6012F Class 2 標準
ステップ 13: Packaging and Shipping → Vacuum packaging + anti‑static bags, に準拠 IPC packaging specifications
8. Application Scenarios and Market Applications
8.1 主なアプリケーション シナリオ
This cooker hood motherboard PCB is widely used in:
- Residential Range Hoods : Main control circuit boards for touch‑control or button‑type range hoods
- Integrated Cooktop Control Boards : Core control units for integrated cooking appliances
- Smart Kitchen Appliances : Control modules for smart range hood and cooktop integrated systems
- Commercial Kitchen Equipment : Control boards for large commercial exhaust systems
8.2 市場の見通し
China’s small appliance control board market is projected to reach approximately RMB 45 10億インチ 2025, with year‑over‑year growth of 10.3%. Smart control boards now account for over 60% of the market. The Chinese home appliance control board market is in a critical stage of smart transformation and upgrade, driving sustained demand for high‑performance, high‑reliability cooker hood motherboard PCBs.
8.3 Typical Operating Environment
The cooker hood motherboard PCB operates under these conditions:
- Temperature Range : ‑10°C to +85°C (kitchen environment)
- Humidity Range : 20% に 90% rh (significant steam generated during cooking)
- 汚染度 : Pollution Degree 2‑3 (fume and dust)
- 振動 : Continuous vibration from motor operation
9. Why Choose UGPCB for Your Cooker Hood Mother Board PCB?
✅International Standard Compliance : Full adherence to IPC‑2221C and IPC‑6012F international standards throughout design, 製造業, そして検査
✅Premium Laminate Materials : Kingboard KB6165G industrial‑grade laminate with Tg 150°C, CTI 600 V, and UL94 V‑0 rating
✅精密な製造能力 : Minimum hole diameter of 0.296 mm、最小線幅は 0.342 mm
✅優れた表面仕上げ : ENIG finish compliant with IPC‑4552B, offering excellent solderability
✅環境コンプライアンス : Halogen‑free materials meeting RoHS and REACH directives
✅Customization Services : Flexible customization of dimensions, レイヤー数, ラミネート材, そして表面仕上げ
✅迅速な配達 : Quick‑turn capability from prototypes to volume production
見積もりを依頼する
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UGPCB is committed to providing high‑quality cooker hood motherboard プリント基板の製造 services to customers worldwide. Whether you need prototype samples or volume production, we offer professional technical support and competitive pricing.
📞 Contact us for a free PCB prototype quote
📧 Email: sales@ugpcb.com
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💡 Please provide the following information for an accurate quote:
- PCB dimensions, レイヤー数, and laminate material requirements
- Minimum line width/spacing and minimum hole diameter
- Surface finish requirements
- Copper foil thickness requirements
- Quantity requirements (prototype / small batch / 量産)
- ガーバーファイル (利用可能な場合)
Send your requirements today, そして UGPCB professional team will respond with a detailed quote and technical recommendations within 24 時間!
データソース宣言
The technical data and standards cited in this article are sourced from the following authoritative organizations and publicly available materials:
- IPC‑6012F : リジッドプリント基板の認定および性能仕様, 9月 2023, IPC International, Inc.
- IPC‑2221C : プリント基板設計に関する一般規格, 8月 18, 2025, IPC International, Inc.
- IPC‑4552B : Specification for Electroless Nickel/Immersion Gold (同意する) プリント基板用めっき, May 2021, IPC International, Inc.
- KB‑6165G / KB‑6165GMD Technical Data Sheet : キングボード・ラミネート・ホールディングス株式会社. official product technical documentation
- UL94 : 機器・家電部品のプラスチック材料の燃焼性試験に関する規格, Underwriters Laboratories Inc.
- IPC-TM-650 : 試験方法マニュアル, IPC International, Inc.
