Rogers PCB RO4350Bプリント回路基板

Professional 8-Layer Rogers 4350B High-Frequency PCB for Demanding RF & Microwave Applications

In the rapidly advancing fields of wireless communications, 航空宇宙, and high-end test instrumentation, 標準のPCB fall short of meeting extreme demands for signal integrity, 低損失, and thermal stability. UGPCB leverages deep technical expertise to present this 8-Layer High-Frequency PCB built on Rogers 4350B laminate. Engineered to address core challenges in RF applications, it is more than an interconnect—it’s a critical foundation ensuring stable performance and signal purity in advanced electronic systems.

製品の概要 & 意味

この製品は、 8-layer rigid high-frequency Printed Circuit Board (プリント基板), utilizing the industry-recognized premium RF material—ロジャース4350b. Through precision multilayer lamination and specialized processing, it achieves high-density integration of complex RF circuits within a 1.65mm board thickness, delivering superior electrical performance control. It is specifically designed for applications requiring 低損失, 安定した誘電率, 優れた熱管理.

Detailed Specifications & 設計上の考慮事項

A high-quality プリント基板 starts with precise control over every detail. Below are the core specifications and their design significance:

Alt tag for suggested technical diagram: Cross-section diagram of 8-layer PCB stackup showing blind vias and step-down milling.

それがどのように機能するか & 主要なアプリケーション

作業原則:

高周波数で (MHz to GHz range), electrical signal transmission behaves more like electromagnetic wave propagation. This PCB leverages the stable dielectric properties of Rogers 4350B to provide a “smooth highway” for these waves, minimizing energy loss (挿入損失) and waveform distortion during transmission. Its precise 8-レイヤースタックアップ そして blind via design ensure controlled characteristic impedance (例えば。, 50Ω or 75Ω) for transmission lines while mitigating interlayer signal reflection and crosstalk.

Key Applications:

• Wireless Infrastructure: 5G/6G base station antennas, パワーアンプ (PAs), フィルター, LNAs.

• Satellite Comms & 航空宇宙: Satellite transceiver modules, レーダーシステム, RF front-ends.

• ハイエンドテスト & 測定: Core boards for network analyzers, スペクトラムアナライザ, signal generators.

• カーエレクトロニクス: Millimeter-wave radar boards for ADAS.

• 医療機器: RF control modules in high-precision imaging systems (例えば。, MRI).

Scientific Classification

Per industry and IPC standards, this product is classified as a 高周波, Multilayer Rigid Printed Circuit Board. More specifically, それはです 8-Layer Metal Core PCB with Blind Vias, fabricated on ceramic-filled hydrocarbon/glass weave reinforced laminate (Rogers 4350B series).

工事 & Key Performance Features

Structural Analysis:

This PCB employs a classic symmetrical stack-up, comprising multiple signal layers with dedicated power and ground planes. ブラインドバイアス connect the surface to adjacent inner layers, while through-holes provide interconnection through the entire board. Depth-controlled milling creates mechanical recesses for shield can installation or special assembly requirements.

Outstanding Performance Features:

1. Ultra-Low Signal Loss: The low dissipation factor of ロジャース4350b at GHz frequencies ensures high-efficiency signal transmission.

2. Exceptional Electrical Stability: Excellent thermal coefficient of dielectric constant (TCDk) guarantees consistent performance across a wide temperature range.

3. 優れた熱管理: 熱膨張係数が低い (CTE) and high thermal conductivity enhance reliability in high-power RF circuits.

4. High-Precision Impedance Control: Achievable tolerance of ±5% or better, thanks to material stability and UGPCB’s advanced process control.

5. High-Reliability Interconnects: Robust 2μ” ENIG finish and precision blind via technology ensure durable connections in harsh environments.

6. Enhanced Design Flexibility: The combination of 8 レイヤー, ブラインドビア, and step milling supports highly complex and compact RF system design.

Core Manufacturing Process Flow

1. 材料の準備 & Inner Layer Fabrication: Rogers 4350B clad laminates are sheared, ドリル (for blind vias), メッキ, patterned, and etched to form inner layer circuits.

2. Layup & ラミネート加工: Etched inner layer cores and prepreg sheets are aligned in the designed stack-up and bonded under high temperature and pressure.

3. Mechanical Drilling & メッキ: Through-holes are drilled, followed by electroless and electrolytic copper plating to metallize all holes (PTH and blind vias).

4. Outer Layer Imaging & メッキ: Outer layer circuit pattern is applied, followed by pattern plating to build up trace and hole copper thickness.

5. 表面仕上げ: エレクトロレスニッケルイマージョンゴールド (同意する) process applied to form a 2-microinch nickel-gold protective layer on pads and hole walls.

6. CNC Routing & Step Milling: The board outline is routed, そして depth-controlled milling creates step-down areas as per design.

7. 電気試験 & 検査: 100% electrical test (flying probe or fixture) for continuity and isolation, followed by final QA inspection (including impedance coupon testing).

Typical Use Case Scenarios

• Scenario 1: 5G Massive MIMO Antenna Array Board

  In such array boards, densely packed RF channels require minimal mutual interference. This PCB’s stable Dk and blind via design ensure channel isolation and phase coherence, while its superior thermal performance supports prolonged stable operation of PA chips.
  Alt tag: 8-layer Rogers 4350B PCB assembly for a 5G Massive MIMO antenna unit.

• Scenario 2: Airborne Radar Signal Processing Front-End

  Airborne environments involve large temperature swings and vibration. This PCB’s low TCDk ensures consistent radar performance across altitudes and temperatures, while the 1.65mm thick, robust construction resists vibrational stress.

Why Choose UGPCB for Your High-Frequency PCB?

• 物質的な専門知識: We possess in-depth knowledge of processing high-frequency materials like Rogers, ensuring material integrity from storage through fabrication.

• 高度なプロセス能力: Mature processes for blind via registration そして depth-controlled milling ensure first-pass success for complex designs.

• Performance Validation: We provide critical impedance test reports そして S-parameter data support using high-end network analyzers, bridging simulation and measurement.

• エンドツーエンドのサポート: We offer full-cycle technical collaboration—from stack-up & impedance design, DFM分析, to volume production—accelerating your time to market.

Ready to Power Your Next RF Project?

Contact a UGPCB engineer today for a comprehensive DFM review and a competitive quote. Submit your stack-up and impedance requirements to start the conversation.