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2-Layer Rigid PCB 1.6mm | FR-4 TG150 Lead-Free HASL | UGPBC Manufacturing - UGPCB

Standard PCB board/

2-Layer Rigid PCB 1.6mm | FR-4 TG150 Lead-Free HASL | UGPBC Manufacturing

Layer Count: 2 Layers Rigid PCB

Board Thickness: 1.60mm

Material: FR-4 TG150

Surface Finish: Lead-Free Hot Air Solder Leveling (HASL), White Solder Mask, Black Legend

  • Product Details

UGPCB Standard 2-Layer Rigid PCB: Reliable 1.6mm FR-4 Circuit Boards for Demanding Applications

At the heart of modern electronics, the Printed Circuit Board (PCB) acts as the foundational platform, interconnecting components and routing signals with precision. UGPCB’s Standard 2-Layer Rigid PCB, built with a robust 1.60mm thickness and high-performance FR-4 TG150 material, represents the optimal balance of durability, electrical performance, and cost-effectiveness for a wide range of applications. This double sided PCB is a proven solution for prototypes and medium-complexity electronic devices.

UGPCB Standard 2-Layer Rigid PCB

Product Definition & Classification

Technical Classification:

  • By Layer Count: Double-Sided PCB / Two Layer PCB

  • By Substrate Rigidity: Rigid PCB

  • By Base Material: Glass Epoxy (FR-4) PCB

  • By Flammability Rating: UL94 V-0 (inherent to FR-4)

  • By Assembly Compatibility: Through-Hole Technology (THT) and Surface-Mount Technology (SMT) capable PCB.

This product is a double sided circuit board constructed with copper clad laminate on both sides of an insulating FR-4 core. Electrical connection between layers is achieved via plated through-holes (PTH). The 1.60mm (approximately 1/16 inch) board thickness is an industry-standard, offering excellent mechanical stability.

Construction & Material Specifications

Layer Stack-Up:

This 2 layer rigid PCB structure is as follows (top to bottom):

  1. Top Solder Mask (White): Insulating layer to prevent solder bridges.

  2. Top Copper Layer (1 oz, ~35µm): Etched to form conductive traces and pads.

  3. Insulating Core Substrate (FR-4, Tg150): Provides mechanical support and electrical insulation.

  4. Bottom Copper Layer (1 oz, ~35µm): Etched to form bottom-layer circuitry.

  5. Bottom Solder Mask (White): Insulating protective layer.

  6. Silkscreen Legend (Black): Component designators, logos, and markings.

Key Materials:

  • Base Laminate: FR-4 TG150. This denotes a flame-retardant glass-reinforced epoxy laminate with a Glass Transition Temperature (Tg) of 150°C. It offers superior mechanical strength, electrical insulation, and thermal reliability for a rigid printed circuit board, making it the industry’s most cost-effective choice.

  • Copper Foil: Standard 1-ounce (oz) Electro-Deposited copper for optimal conductivity and current carrying capacity.

  • Surface Finish: Lead-Free Hot Air Solder Leveling (HASL). A cost-effective and reliable PCB surface finish that provides excellent solderability, good shelf life, and robust protection against oxidation.

  • Inks: High-quality photo-imageable white solder mask ink and durable black epoxy silkscreen ink.

(Image Suggestion: Cross-sectional diagram of the PCB stack-up)
Alt Tag: Detailed cross-sectional diagram of a 2 layer rigid PCB showing copper, FR-4 core, and solder mask layers.

Design Guidelines & Operational Principle

Critical Design Considerations:

  1. Via Design: Maximize the routing space of your double sided PCB design by strategically placing Plated Through-Holes (PTHs) for inter-layer connections.

  2. Trace Width/Spacing: For 1oz copper, a standard minimum trace/space is 6mil/6mil (~0.15mm) to ensure reliable manufacturability and current capacity.

  3. Pad & Hole Annular Ring: Ensure adequate pad size relative to the drill hole to guarantee a strong connection for PCB assembly and reliability.

  4. Solder Mask & Silkscreen: White solder mask aids visual inspection during SMT assembly, while clear black silkscreen is crucial for PCB prototyping and repair.

Operational Principle:

A PCB does not generate function but enables it through its predefined conductive pathways. The etched copper traces replace discrete wiring, providing electrical connections between components. The insulating FR-4 substrate prevents short circuits. Plated through-holes (PTHs) serve as vertical conduits, connecting the top and bottom PCB copper layers, thereby doubling the available routing area compared to a single-sided board and increasing design flexibility.

Performance Characteristics & Advantages

  • High Reliability: The FR-4 TG150 substrate ensures stable performance in environments below its Tg, offering excellent thermal and mechanical stability for a rigid circuit board.

  • Excellent Electrical Properties: Low dielectric constant and dissipation factor support the signal integrity requirements of most digital and analog circuits.

  • High Manufacturability: The 1.6mm standard PCB thickness and Lead-Free HASL process are mature, ensuring high yield, cost control, and fast lead times.

  • Superior Solderability: The HASL finish offers a flat, wettable surface ideal for both through-hole soldering and SMT soldering processes.

  • Clear Identification: High-contrast white solder mask with black legend facilitates efficient PCBA inspection, testing, and rework.

  • Environmental Compliance: Lead-Free HASL finish complies with RoHS and other environmental directives.

Standard Manufacturing Process Flow

UGPCB adheres to IPC standards throughout our PCB fabrication process:
Panelization → Drilling → Electroless Copper Deposition → Dry Film Lamination & Imaging → Copper Plating → Etching → Solder Mask Application & Curing → Silkscreen Printing → Surface Finish (Lead-Free HASL) → Profiling/Routing → Electrical Testing (Flying Probe) → Final Automated Optical Inspection (AOI) → Packaging & Shipment.

Primary Applications & Use Cases

This versatile two layer rigid PCB is widely used in industries that demand a balance of reliability and value:

  • Industrial Controls: PLC interfaces, sensor modules, motor drives, HMI controller boards.

  • Consumer Electronics: Smart appliance controllers, audio amplifiers, power supplies, educational kits.

  • Telecommunications: Router/switch peripheral boards, RF antenna modules, network monitoring units.

  • Automotive Electronics: Infotainment systems, lighting control modules, body control modules (non-safety critical).

  • Power Electronics: Smart meter PCBs, UPS control boards, solar inverter circuitry.

  • Test & Measurement: Data acquisition cards, instrument control panels, handheld tester boards.

 

Double-Layer FR-4 PCB Applications in Industrial Control

Why Choose UGPCB for Your 2-Layer PCB Needs?

Choosing UGPCB means partnering with a reliable PCB manufacturer committed to quality. We specialize in PCB prototype and medium-volume production, implementing rigorous Electrical Testing and IPC-A-600 based inspection on every board. From simple 2 layer boards to complex multi-layer designs, we provide expert PCB design for manufacturing (DFM) support and a streamlined supply chain.

Contact us today for a competitive quote and swift lead time on your 1.6mm FR-4 2-Layer PCB project!

(Image Suggestion: Gallery of finished PCBs with different designs)
Alt Tag: Gallery of various 2 layer rigid PCB examples manufactured by UGPCB with white solder mask.

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