UGPCB 18-Layer Server PCB Solution | High-Performance Computing PCB for Data Centers

UGPCB 18-Layer Server PCB: Engineered for High-Performance Computing & Data Centers

In the era of data centers and cloud computing, server stability and performance are critical to digital business operations. As the fundamental hardware carrier, the precision design and exceptional quality of Server مركبات ثنائي الفينيل متعدد الكلور (لوحات الدوائر المطبوعة) are paramount. Leveraging deep industry expertise and cutting-edge technology, UGPCB provides high-performance, highly reliable 18-layer server PCBs to meet the most demanding requirements of next-generation data center applications.

Product Overview & Definition

A server PCB is the core component of server motherboards, storage backplanes, and various functional daughter cards. It hosts critical components like CPUs, ذاكرة, and chipsets, facilitating high-speed signal transmission, توزيع الطاقة, and system interconnection. Designed specifically for high-performance application servers, this UGPCB product utilizes an 18-layer high multilayer structure and an enhanced board thickness of 2.4mm ±10%, serving as a robust hardware foundation for processing massive datasets and supporting high-speed computations.

Core Design Highlights & Technical Analysis

To address server platforms’ extreme demands for signal integrity, power integrity, and thermal management, this product integrates several key technologies:

1. Advanced Stack-up & مواد:

   • صفح: Utilizes ITEQ IT968G high-speed, low-loss material. Its high Tg (درجة حرارة انتقال الزجاج) ensures dimensional stability and consistent electrical performance under prolonged high-temperature server operation, effectively reducing signal transmission loss.

   • طبقات & Copper Weight: An 18-layer complex stack-up with a meticulously designed hybrid copper weight scheme (featuring 2Oz thick copper foil on select inner layers). This optimizes the current-carrying capacity and thermal performance of power planes while enabling fine-line routing on high-speed signal layers.

2. Precision Routing & Interconnection:

   • Line Capability: Achieves ultra-fine line width/space of 0.1mm/0.1mm, meeting the fan-out and interconnection requirements for high-density BGA packages (على سبيل المثال, وحدة المعالجة المركزية, GPU, FPGA).

   • ميكروفيا تكنولوجيا: Supports a minimum mechanical drill diameter of 0.20mm, enhancing routing density and space utilization.

3. Key Technologies for Signal Integrity:

   • الحفر الخلفية: For high-speed differential signals (على سبيل المثال, بكيي, SAS, إيثرنت), the back-drilling process removes unused copper stubs from through-holes, significantly reducing signal reflection and attenuation. This is a core process for ensuring signal quality in مركبات ثنائي الفينيل متعدد الكلور عالية السرعة.

   • RTF Copper Foil: Uses Reverse Treated Foil, which provides a smoother copper surface. This effectively reduces skin effect loss for high-frequency signals, improving signal transmission efficiency.

4. Reliable Surface Finish:

   • Electroless Nickel Immersion Gold (يوافق) is applied as the final surface treatment. ENIG provides a flat surface, excellent solderability, a reliable contact interface, and long-term oxidation resistance, making it ideal for soldering dense, fine-pitch عناصر on server PCBs.

Product Features & Advantages

• Exceptional Electrical Performance: High-speed IT968G laminate combined with back-drilling and RTF foil ensures low-loss, low-latency transmission of high-frequency signals, making it an ideal choice for مركبات ثنائي الفينيل متعدد الكلور عالية التردد و مركبات ثنائي الفينيل متعدد الكلور عالية السرعة.

• Superior Power Handling & الإدارة الحرارية: 2Oz inner-layer copper and the 2.4mm board design enhance current-carrying capacity, overall structural rigidity, and thermal conductivity.

• High Density & Reliability: The 18-layer routing space coupled with 0.1/0.1mm line width/space supports the most complex designs. Strict process control and high-Tg materials ensure long-term reliability for 24/7 uninterrupted operation.

• End-to-End Service Support: UGPCB offers not only top-tier تصنيع ثنائي الفينيل متعدد الكلور but also a one-stop solution from design review to production, accelerating your time-to-market.

Production Process Overview

Our manufacturing adheres to stringent معايير IPC and a quality management system:
Engineering Review → Material Preparation → Inner Layer Imaging → Lamination → Drilling & Back-Drilling → Hole Metallization → Outer Layer Imaging → Plating (for hybrid copper weight) → Solder Mask Application (Pre-ENIG) → ENIG → Routing / Profiling → Electrical Test & التفتيش النهائي

https://via.placeholder.com/800×450.png?text=18-Layer+PCB+Cross-Section
Alt Text: Cross-sectional view of an 18-layer server PCB board, detailing precise lamination and back-drilled via structures for high-speed signal transmission.

التطبيقات & تصنيف

This high-performance PCB is widely used in:

• Enterprise & Cloud Server Motherboards

• Data Center AI Computing Acceleration Cards

• High-Performance Storage Servers & Backplanes

• Network Switch & Communication Equipment Core Boards

Technical Classification:

• By Layer Count: عالي ثنائي الفينيل متعدد الكلور متعدد الطبقات (18 طبقات)

• By Technology: High-Speed/High-Frequency PCB, Back-Drilled PCB, Heavy Copper PCB

• By Application: Server/Data Center PCB

• By Surface Finish: يوافق (Electroless Nickel Immersion Gold) ثنائي الفينيل متعدد الكلور

Choose UGPCB, and you select more than just a high-quality server PCB board; you gain a trusted partner in advanced PCB manufacturing. We are dedicated to translating complex technical details into reliable advantages for your products, empowering your next-generation data center solutions.

Contact our expert team today for a customized PCB solution quote and technical consultation!