نظرة عامة على المنتج
يقدم UGPCB 6‑layer 2+N+2 HDI PCB (نموذج: 6L2+N+2 HDI ثنائي الفينيل متعدد الكلور). This high‑density interconnect لوحة الدوائر المطبوعة is engineered specifically for communication equipment. It uses ITEQ IT150 high‑performance laminate, combined with a second‑order HDI build‑up architecture, 2.5mil/2.5mil fine‑line trace and space, و 0.1mm laser microvias. These features deliver reliable interconnections for 5G base stations, high‑speed network switches, الوحدات البصرية, والتطبيقات المماثلة.
في ثنائي الفينيل متعدد الكلور صناعة, مؤشر التنمية البشرية (ربط الكثافة العالية) technology is the core enabler for shrinking component pitches and rising signal speeds. ال 2+N+2 HDI PCB architecture represents the second‑order HDI category. It achieves an optimal balance among routing density, سلامة الإشارة, وتكلفة التصنيع.
What Is a 2+N+2 HDI PCB?
Definition and Nomenclature
“2+N+2” is a standardized naming convention for HDI stack‑up structures. It is defined in theIPC‑2226 standard and is classified asالنوع الثالث within that system.
Breaking down the term:
- ال first “2” means two sequential build‑up layers above the core.
- “N” stands for the number of core layers (here N=2, أي., two inner core layers).
- ال second “2” means two sequential build‑up layers below the core.
هكذا, a 2+N+2 structure adds two build‑up layers on each side of the conventional core. These are constructed throughtwo sequential lamination cycles. This 6‑layer board therefore comprises: 2 outer build‑up layers + 2 inner core layers + 2 outer build‑up layers.
HDI Classification per IPC‑2226
The IPC‑2226 standard defines several HDI types based on microvia structures and build‑up layer counts:
| HDI Type | بناء | Build‑up Layers (لكل جانب) | Minimum BGA Pitch | التطبيقات النموذجية |
|---|---|---|---|---|
| النوع الأول | 1+ن+1 | 1 طبقة | 0.5مم | الهواتف الذكية, mid‑density designs |
| Type II/III | 2+ن+2 | 2 طبقات | 0.4مم | معدات الشبكات, high‑performance computing |
| النوع الثالث / إليك | 3+N+3 and above | 3+ طبقات | 0.3mm and below | Flagship smartphones, AI modules |
This product falls into the2+N+2 category. It features two build‑up layers per side, with microvias that can be arranged in eitherstacked or staggered التكوينات.
المواصفات الفنية الأساسية
| المعلمة | مواصفة |
|---|---|
| نموذج | 6L2+N+2 HDI ثنائي الفينيل متعدد الكلور |
| مادة | اي تي كيو اي تي 150 |
| عدد الطبقة | 6 طبقات (2+N+2 second‑order HDI) |
| لون قناع اللحام | أسود أو أبيض (خياري) |
| سمك اللوحة النهائية | 1.0مم |
| سمك الطبقة الداخلية من النحاس | 1 أوقية (~35μm) |
| سمك الطبقة الخارجية من النحاس | 0.5 أوقية (~17.5μm) |
| الحد الأدنى من التتبع / تباعد | 2.5ميل / 2.5ميل (~63.5μm / ~63.5μm) |
| Minimum Mechanical Drill | 0.2مم |
| Minimum Laser Drill | 0.1مم |
| الانتهاء من السطح | الغمر الذهب + OSP |
| التطبيق الأساسي | معدات الاتصالات |
Material Deep Dive: اي تي كيو اي تي 150
Material Positioning
اي تي كيو اي تي 150 هو أ medium‑Tg, halogen‑free, multifunctional epoxy صفح. It sits between standard فر-4 and high‑performance low‑loss materials. It delivers lead‑free process compatibility, good manufacturability, and cost‑effectiveness.
The IT150GS variant (within the IT150 family) is a medium‑Tg (تيراغرام >150° C بواسطة DSC), halogen‑free, middle‑loss material. It offers high thermal reliability and excellent CAF resistance. It is specifically designed for server, تخزين, and networking applications.
معلمات الأداء الرئيسية
Based on ITEQ official datasheets and IPC‑TM‑650 test methods:
| ملكية | طريقة الاختبار | القيمة النموذجية | وحدة |
|---|---|---|---|
| درجة حرارة انتقال الزجاج (تيراغرام) | DSC (IPC‑2.4.25) | 155 | درجة مئوية |
| درجة حرارة التحلل (TD, 5% خسارة بالوزن) | TGA (IPC‑2.4.24.6) | 365 | درجة مئوية |
| المحور Z CTE (a1, أدناه تيراغرام) | IPC‑2.4.24 | 35–40 | جزء في المليون/درجة مئوية |
| المحور Z CTE (a2, فوق تيراغرام) | IPC‑2.4.24 | 220–240 | جزء في المليون/درجة مئوية |
| X/Y‑axis CTE (40–125°C) | IPC‑2.4.41 | 11/13 | جزء في المليون/درجة مئوية |
| ثابت العزل الكهربائي (DK) @ 1 جيجا هرتز | IPC‑2.5.5.13 | 4.2–4.5 | — |
| عامل التبديد (ص) @ 1 جيجا هرتز | IPC‑2.5.5.13 | 0.010–0.018 | — |
| T288 Thermal Stress | إيبك-TM-650 | >60 | Minutes |
| امتصاص الرطوبة | IPC‑2.6.2.1 | 0.12 | % |
| تصنيف القابلية للاشتعال | يو ال94 | V-0 | تصنيف |
| UL MOT (Max Operating Temp) | — | 130 | درجة مئوية |
مزايا المواد
1. Lead‑Free Process Compatibility
Standard FR‑4 typically has a Tg around 130°C. ITEQ IT150 delivers155درجة مئوية. Under lead‑free reflow peaks of260درجة مئوية, this higher Tg provides superior dimensional stability. The material resists excessive Z‑axis expansion, which significantly reduces the risk of via barrel cracking and pad lifting during assembly.
2. مقاومة CAF ممتازة
المقهى (خيوط انوديك موصلة) is a primary failure mode in PCBs. It occurs when electrochemical migration creates short circuits under humid and hot conditions. ITEQ IT150 offershigh CAF resistance (18ل / less than 100mil). This makes it especially suitable for long‑term outdoor deployment in communication infrastructure.
3. Halogen‑Free Compliance
ITEQ IT150 meetsJPCA‑ES‑01‑2003 halogen‑free standards. Chlorine (Cl) والبروم (ر) content are each below 0.09% بالوزن. Total Cl+Br is below 0.15% (1500جزء في المليون).
إرشادات التصميم
Stack‑Up Architecture
The 2+N+2 HDI PCB is manufactured throughsequential lamination:
- Core fabrication – Start with a double‑sided copper‑clad laminate. Etch inner layer circuits, perform mechanical drilling (0.2مم), and plate to create buried via connections.
- First build‑up – Apply prepreg and copper foil (or RCC) to both sides of the core. Execute the first lamination cycle.
- First laser drilling – Drill first‑order blind vias (laser holes at 0.1mm) and fill them with copper.
- Second build‑up – Apply additional dielectric layers and copper foil. Execute the second lamination cycle.
- Second laser drilling – Drill second‑order blind vias (0.1مم) and fill with copper.
- Outer layer circuits – Form outer layer circuits (trace/space 2.5mil) and apply the surface finish.
هذاtwo‑sequential‑lamination process is precisely what the “2” in 2+N+2 signifies.
Fine‑Line Circuit Design
يحقق هذا المنتج 2.5مل/2.5 مل (~63.5μm/63.5μm) عرض التتبع والتباعد. This exceeds the تصميم اتش دي اي Level C (60‑99μm) defined in IPC‑2226. This fine‑line capability enables:
- 0.4mm pitch BGA breakout with ample routing channels.
- Flexible signal routing for high‑density عنصر التنسيب.
- Reduced layer count, which lowers overall PCB cost.
ميكروفيا تكنولوجيا
يستخدم هذا المنتج أhybrid drilling approach:
- الحفر الميكانيكي – Minimum diameter 0.2مم, used for through‑holes and buried vias in the core.
- حفر الليزر – Minimum diameter 0.1مم (4ميل) , used for blind vias in build‑up layers.
The 0.1mm laser microvia reduces via area by75% compared to a 0.2mm mechanical hole. This significantly frees up routing space. It is fundamental to achieving high‑density interconnect and enablingعبر في الوسادة designs for fine‑pitch BGAs.
مبدأ التشغيل
The 2+N+2 HDI PCB works through amulti‑layer interconnect architecture:
- Core‑layer interconnection – Buried vias, formed by الحفر الميكانيكي + تصفيح, connect signals between core layers.
- Build‑up interconnection – Blind vias, formed by الحفر بالليزر + تصفيح, connect outer signal layers to inner layers.
- Full‑board through‑holes – After stack‑up completion, mechanical drilling penetrates all layers to create through‑holes.
- Signal transmission path – High‑speed signals travel from surface BGA pads → through laser blind vias into inner layers → across buried vias through the core → through laser blind vias on the opposite side to the bottom layer.
هذاstepped interconnect structure shortens signal paths and reduces parasitic via effects. نتيجة ل, it preserves high‑speed signal integrity.
مزايا الأداء
الموثوقية الحرارية
ITEQ IT150’sTD (decomposition temperature) reaches 365°C, which is well above the lead‑free reflow peak of 260°C. T288 thermal stress testingexceeds 60 دقائق without delamination. This ensures material integrity through multiple reflow cycles.
سلامة الإشارة
بسرعة 1 جيجا هرتز, ITEQ IT150 exhibits a dielectric constant Dk of approximately 4.2–4.5 and a dissipation factor Df of 0.010–0.018. As a “standard‑to‑mid‑loss” material, IT150 provides a compelling price‑performance ratio compared to ultra‑low‑loss materials. This makes it ideal for production‑ready communication equipment.
القوة الميكانيكية
ITEQ IT150 deliversflexural strength of 470–500 N/mm² in the warp direction and 400–430 N/mm² in the fill direction. This ensures structural integrity throughout assembly and field deployment.
تصنيف المنتج
This product is classified across multiple dimensions:
| Classification System | فئة |
|---|---|
| IPC‑2226 HDI Type | Type II/III (2+ن+2, double build‑up per side) |
| HDI Order | Second‑order (2 laser drilling cycles + 2 lamination cycles) |
| Rigid/Flexible | ثنائي الفينيل متعدد الكلور جامد |
| عدد الطبقة | 6‑layer multilayer board |
| نظام المواد | Medium‑Tg, halogen‑free, FR‑4‑compatible epoxy |
| الانتهاء من السطح | الغمر الذهب + OSP hybrid finish |
| مجال التطبيق | Communication‑grade PCB |
تدفق عملية التصنيع
UGPCB follows this production sequence for the 6‑layer 2+N+2 HDI PCB:
خطوة 1: Core Layer Fabrication
Material cutting → Inner layer dry film → Etching → AOI inspection → Brown oxide treatment
خطوة 2: First Build‑Up
التصفيح (جوهر + prepreg + احباط النحاس) → First lamination → First‑order laser drilling (0.1مم) → Desmear → Electroless copper + plating → Circuit patterning
خطوة 3: Second Build‑Up
Second lamination → Second lamination → Second‑order laser drilling (0.1مم) → Desmear → Electroless copper + plating → Circuit patterning
خطوة 4: Outer Layer and Finishing
الحفر الميكانيكي (0.2mm through‑holes) → Electroless copper + plating → Outer layer circuits (2.5مل/2.5 مل) → Solder mask → Immersion Gold + OSP surface finish → Electrical testing → Final inspection → Packaging and shipment
The entire process involvestwo lamination cycles and two laser drilling operations. This demands exceptional process control and precision.
سيناريوهات التطبيق
This product is primarily designed forمعدات الاتصالات:
5البنية التحتية للاتصالات
- 5محطات قاعدة G (gNB) – RF front‑end and baseband processing units.
- High‑speed backplane interconnects for 5G network equipment.
- Enterprise‑grade routers and core switches.
High‑Speed Data Transmission
- 400G/800G optical modules – control and signal processing boards.
- High‑speed fiber‑optic switches.
- أجهزة الإرسال والاستقبال الضوئية.
Other High‑End Applications
- High‑performance servers and storage devices.
- AI inference/training accelerator cards.
- Advanced medical imaging equipment.
The 2+N+2 HDI structure is particularly well‑suited formoderate pin‑count, high‑density BGA التوجيه. It enables complex signal interconnects within limited board space.
لماذا تختار UGPCB?
UGPCB brings deep manufacturing expertise to HDI PCB production:
- Fine‑line capability – 2.5mil/2.5mil trace/space in volume production, meeting advanced HDI design requirements.
- Mature microvia process – 0.1mm laser via + 0.2mm mechanical drill hybrid solution with stable yield.
- Comprehensive material certification – Full qualification on ITEQ IT150 and other mainstream material systems.
- End‑to‑end process control – Every step from cutting to electrical testing strictly follows إيبك-6012 rigid PCB qualification and performance specifications.
- Communication industry track record – Extensive experience in 5G base station, optical module, and network equipment تصنيع ثنائي الفينيل متعدد الكلور.
اطلب عرض أسعار اليوم
Whether you are designing high‑speed backplanes for 5G base stations or developing next‑generation optical modules, UGPCB’s 6‑layer 2+N+2 HDI PCB provides the reliable interconnect foundation your project deserves.
إعلان مصدر البيانات
The technical data cited in this document comes from the following authoritative standards and sources:
- IPC‑2226 - Sectional Design Standard for High Density Interconnect (مؤشر التنمية البشرية) Printed Boards
- IPC‑6012E/F - مواصفات التأهيل والأداء للألواح المطبوعة الصلبة
- IPC/JPCA‑2315 - Design Guide for High Density Interconnect Structures and Microvias
- ITEQ IT‑150 / IT‑150GS Official Datasheets and Material Specifications
- إيبك-TM-650 – Test Methods Manual (including methods 2.4.4, 2.4.24, 2.4.24.6, 2.4.25, 2.5.5.13, 2.6.2.1, وغيرها)
- JPCA‑ES‑01‑2003 - Halogen‑Free Copper‑Clad Laminate Standard
- يو ال94 - معيار السلامة من قابلية اشتعال المواد البلاستيكية لأجزاء الأجهزة والأجهزة
