6-PCB HDI a 1 stadio (1+N+1) | UGPCB High-Density Interconnect Manufacturing

Product positioning: UGPCB’s 6-layer 1-stage HDI PCB uses a 1+N+1 stack-up. Offre 0.10 mm laser blind vias, 0.20 mm through holes, 0.20 mm BGA pitch, E 3/3 mil traces. It suits compact, high-integration electronics.

1. What Is a 6-Layer 1-Stage HDI PCB?

A 6-layer 1-stage HDI PCB is a six-layer circuito stampato di interconnessione ad alta densità. It uses a 1+N+1 stack-up, where N equals 4. IPC-2226 classifies this build-up approach as a Type I ISU struttura. Each side has one build-up layer. Laser microvias connect the outer layers to the next inner layer. Mechanical through holes connect the core layers.

Parameter Snapshot

Parametro	Specifica
Conteggio degli strati	6 strati (1+N+1)
Base material	FR4Tg150
Spessore della scheda	1.6 mm
Dimensioni del pannello	105 × 95 mm (1-su)
Spessore esterno del rame	35 µm (1 oz)
Spessore interno del rame	30 µm
Foro passante minimo	0.20 mm
Minimum blind via	0.10 mm
Minimum BGA pitch	0.20 mm
Trace width/spacing	3/3 mil (75 µm/75 µm)

2. Product Overview and Scientific Classification

2.1 Panoramica del prodotto

UGPCB’s 6-layer 1-stage HDI PCB targets high-density electronic packaging. It improves routing density over a standard 6-layer through-hole PCB. Laser-drilled blind vias make this possible. IPC-2226 defines HDI as a board with higher wiring density than PCB convenzionali. It uses conductors ≤100 µm, vias <150 µm, e pastiglie <400 µm. This product meets those thresholds. Suo 3/3 mil (75 µm) traces and 0.10 mm laser microvias exceed standard PCB capability.

2.2 Classificazione scientifica

• By interconnection: PCB HDI, IPC-2226 Type I
• By stack-up: 1+N+1 first-order HDI, single build-up per side, N=4 core
• Per numero di strati: 6-strato PCB multistrato
• By base material: FR4 Tg150 epoxy glass fabric
• By performance class: Classe IPC-6012 2 o classe 3
• By product form: bare PCB or assemblaggio PCBA

3. Stack-Up and Design Highlights

3.1 1+N+1 Stack-Up

1+N+1 is the most basic and mature HDI stack-up. “N” is the core. Each “1” is one build-up layer. This product is 1+4+1. The core has four layers. One build-up layer sits on each side. IPC-2226 describes this structure as having microvias that connect to adjacent inner layers. The core uses mechanical through holes. This structure balances signal integrity, costo, and yield. Many HDI PCB designs start with this stack-up.


3.2 Key Design Points

Blind via design: The minimum blind via is 0.10 mm (100 µm). IPC-T-50M defines a microvia as a blind via ≤0.15 mm with aspect ratio ≤1:1. The blind via connects only the outer layer to the next inner layer. It frees inner-layer routing space. This helps high-density PCB layout.

Trace width and spacing: The product uses 3/3 mil (75 µm/75 µm) tracce. This is a core PCB HDI capacità. Standard multilayer PCBs often use 6/6 mil (150 µm) tracce. HDI PCBs can use 3/3 mil or finer. This doubles routing density in the same area. A 0.20 mm BGA pitch, 3/3 mil traces allow two routes between pads. This directly affects BGA escape routing.

BGA support: The minimum BGA pitch is 0.20 mm. At this pitch, pads are often 0.10–0.12 mm. Pad spacing is only 0.08–0.10 mm. This demands high registration accuracy and etch control in PCB manufacturing.

Controllo dell'impedenza: Con 3/3 mil traces and FR4 Tg150, Dk is about 4.2–4.6 at 1 MHz. Manufacturers can control 50 Ω single-ended and 100 Ω differential impedance. This supports high-speed signal transmission.

Thermal design: The 6-layer structure uses 30 µm inner copper. Large inner copper planes spread heat away from BGA areas.

4. Come funziona

The 6-layer 1-stage HDI PCB uses two via types:

• Laser blind via: A laser drills from the outer layer to the next inner layer. The minimum diameter is 0.10 mm. CO₂ or UV lasers form these vias.
• Mechanical through hole: This hole passes from top to bottom. It connects core layers and all layers. The minimum diameter is 0.20 mm.

Signals travel from surface components, such as BGA chips, through blind vias into inner signal layers. This avoids the space loss and signal reflection of through holes. The shorter path lowers parasitic inductance and capacitance. This benefits high-speed digital signals.

5. Core Materials and Performance

5.1 Materiale di base: FR4Tg150

This product uses FR4 Tg150 epoxy glass fabric. Tg is the glass transition temperature. IPC-TM-650 method 2.4.25 (DSC) measures this value. Tg150 material remains stable in lead-free soldering. Lead-free reflow peaks at about 245–260°C. The material withstands multiple reflow cycles without major dimensional change or delamination.

5.2 Spessore del rame

• Outer copper: 35 µm (1 oz). This supports current carrying and solder reliability.
• Rame interno: 30 µm. This meets signal and power plane needs.

5.3 Caratteristiche chiave delle prestazioni

• High routing density: 3/3 mil traces and 0.10 mm microvias raise density by over 50% versus standard 6-layer boards.
• Small package support: 0.20 mm BGA pitch fits CSP, QFN, and other micro packages.
• Strong signal integrity: Short blind via paths reduce parasitic effects. This helps high-speed signals.
• Reliable construction: The board can meet IPC-6012 acceptance requirements. Classe IPC-6012 3 requires a minimum average copper thickness of 25 µm in plated holes.

6. Processo di produzione

UGPCB makes 6-layer 1-stage HDI PCBs through precise steps:

1. Inner-layer imaging: Expose, sviluppare, and etch inner traces on the 4-layer core.
2. Inner-layer lamination: Press inner cores and prepreg into a 4-layer core.
3. First drilling and plating: Drill mechanical through holes and plate copper.
4. Build-up lamination: Press one dielectric layer on each side of the core.
5. Perforazione laser: Use CO₂ or UV lasers to form 0.10 MM MICROVIA.
6. Blind via plating and filling: Plate and fill laser vias for reliable conduction.
7. Outer-layer imaging: Modulo 3/3 mil outer traces.
8. Solder mask and surface finish: Apply solder mask and ENIG or OSP finish.
9. Profiling and testing: Route the outline, run prova della sonda volante, AOI, e ispezione finale.

7. Principali applicazioni

The 6-layer 1-stage HDI PCB balances density, misurare, e affidabilità. It serves many markets:

• Smartphones and mobile devices: Mainboard core areas with processor BGA packages.
• Indossabili: Smartwatch, TWS earbuds, and other space-limited products.
• Elettronica automobilistica: ADAS sensor modules and infotainment mainboards.
• Elettronica medica: Portable monitors and implantable device control boards.
• Controllo industriale: PLC modules and industrial IoT gateways.
• Attrezzatura di comunicazione: 5G small-cell RF modules and optical module PCBs.

The global HDI PCB market is growing fast. The Business Research Company reports strong HDI market growth. The market will grow from USD 17.78 miliardi di 2025 a USD 19.47 miliardi di 2026. That is a 9.5% compound annual growth rate (CAGR). The market may reach USD 28.82 miliardi di 2030.

8. Perché scegliere UGPCB?

UGPCB Circuits Limited (UGPCB®) focuses on high-precision PCB R&D and manufacturing. Its factory covers 280,000 square meters. Impiega 1,300 persone. Sopra 35% are technical professionals. The company makes HDI PCBs from 1 A 6+ stages, any-layer HDI boards, Substrati dei circuiti integrati, tavole rigido-flessibili, and standard multilayer FR4 PCBs.

UGPCB holds ISO9001, UL, and RoHS certifications. It follows IPC standards for production and acceptance. This ensures product quality meets customer needs and industry rules. The company serves customers in mainland China, Taiwan, Corea, Giappone, the US, Brasile, India, Sud -est asiatico, and Europe.

Get a quote today: Send your Gerber files or design parameters. The UGPCB technical team will reply within 24 ore. We will provide a custom 6-layer HDI PCB quote and a one-stop PCBA assembly solution. Se ne hai bisogno quick prototyping or stable volume supply, we can help.

Dichiarazione sull'origine dei dati

This article cites standards and technical data from these authorities:

1. IPC-2226, Sectional Design Standard for High Density Interconnect (ISU) Schede stampate — HDI structure classification and microvia definition.
2. IPC-T-50M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits — microvia terminology.
3. IPC-6012, Specifiche di qualificazione e prestazione per circuiti stampati rigidi — rigid board acceptance and plated copper thickness.
4. IPC-2221, Standard generico sulla progettazione di schede stampate — PCB design guidelines and trace/space practice.
5. IPC-TM-650 Method 2.4.25 — glass transition temperature (Tg) metodo di prova.
6. The Business Research Company, Global High Density Interconnect (ISU) Market Report 2026 — HDI market data.