6-Stratto di circuito stampato a impronta dorata

Overview of 6 Layer Golden Finger PCB

IL 6 Layer Golden Finger PCB is a high-precision, multi-layered printed circuit board designed for advanced electronic applications. This product combines multiple layers of conductive traces and insulating materials to provide exceptional performance and reliability in various electronic devices.

Definizione

UN 6 Layer Golden Finger PCB is a type of multi-layer printed circuit board (PCB) that features six individual layers of conductive material, separated by insulating layers. Il termine “Golden Finger” refers to the specific surface treatment applied to the edges of the board, which involves immersion gold and additional gold plating on the contact fingers.

Requisiti di progettazione

When designing a 6 Layer Golden Finger PCB, several key requirements must be considered:

Qualità del materiale: High-quality FR4 material is essential for durability and performance.
Configurazione del livello: Six layers are needed to accommodate complex circuitry and signal routing.
Spessore del rame: A standard copper thickness of 1OZ ensures adequate conductivity.
Trattamento superficiale: Immersion gold with additional gold finger plating enhances connectivity and corrosion resistance.
Dimensioni di traccia/spazio: A minimum trace/space of 4mil/4mil is required for precise circuit patterns.
Processi speciali: The gold finger process with a thickness of 0.1um is critical for reliable edge connections.

Principio di lavoro

IL 6 Layer Golden Finger PCB operates based on the principles of electrical conductivity and insulation. Conductive traces on different layers create pathways for electrical signals, mentre gli strati isolanti impediscono interazioni indesiderate tra questi segnali. The gold finger edges facilitate easy insertion into connectors, ensuring stable and reliable connections.

Applicazioni

This type of PCB is widely used in applications that require high precision and reliability, ad esempio:

High-speed digital circuits
Telecommunications equipment
Advanced computing systems
Elettronica automobilistica
Medical devices

Classificazione

6 Layer Golden Finger PCBs can be classified based on their intended use, ad esempio:

Signal Processing Boards: For handling high-frequency signals in communication devices.
Power Distribution Boards: To manage power supply in complex electronic systems.
Schede di controllo: For controlling and managing various functions in electronic devices.

Materiali

The primary materials used in the construction of a 6 Layer Golden Finger PCB include:

Materiale di base: FR4, Un materiale in fibra di vetro retardante di fiamma noto per le sue eccellenti proprietà dielettriche e la resistenza meccanica.
Materiale conduttivo: Rame, Utilizzato per le tracce conduttive.
Trattamento superficiale: Immersion gold and additional gold plating for the gold fingers.

Prestazione

The performance of a 6 Layer Golden Finger PCB is characterized by:

High Signal Integrity: Due to precise trace/space dimensions and quality materials.
Connettività affidabile: Ensured by the gold finger surface treatment.
Durata: Enhanced by the robust FR4 base material and immersion gold finish.
Efficienza elettrica: Perdita del segnale ridotta al minimo e interferenza dovuta alla configurazione del livello ottimizzato.

Struttura

The structure of a 6 Layer Golden Finger PCB consists of:

Six Layers of Conductive Material: Alternando gli strati isolanti.
Gold Finger Edges: Plated with a thin layer of gold for enhanced connectivity.
Protective Layers: Including solder mask and silkscreen for protection and identification.

Caratteristiche

Key features of the 6 Layer Golden Finger PCB include:

Advanced Surface Treatment: Immersion gold plus gold finger for superior connection quality.
Alta precisione: With a minimum trace/space of 4mil/4mil.
Opzioni di colore personalizzabili: Available in green or white.
Spessore standard: With a finished thickness of 1.6mm.

Processo di produzione

The production process for a 6 Layer Golden Finger PCB involves several steps:

Preparazione del materiale: Selezione e preparazione di fogli FR4 e foglio di rame.
Stacking strato: Alternating layers of copper and insulating materials.
Incisione: Rimozione del rame in eccesso per formare il modello di circuito desiderato.
Placcatura: Applying immersion gold and additional gold finger plating.
Laminazione: Combinando gli strati sotto calore e pressione.
Perforazione: Creazione di buchi per componenti a foro e Vias.
Applicazione della maschera di saldatura: Protezione del circuito da ponti di saldatura e fattori ambientali.
Silkscreen Printing: Aggiunta di testo e simboli per il posizionamento e l'identificazione dei componenti.
Controllo di qualità: Garantire che il PCB soddisfi tutte le specifiche e gli standard di progettazione.