0.22mm Ultra-Thin 6-Layer HDI Rigid-Flex PCB Manufacturer | UGPCB

UGPCB’s 0.22mm Ultra-Thin 6-Layer HDI Rigid-Flex PCB Product Overview

In the pursuit of extreme device miniaturization and high reliability, traditional rigid Printed Circuit Boards (PCBs) are often insufficient. UGPCB combines advanced High-Density Interconnect (HDI) and Rigid-Flex technologies to present our flagship product: the 0.22mm Ultra-Thin 6-Layer HDI Rigid-Flex PCB. This board is a pinnacle of PCB manufacturing and a high-performance interconnect solution engineered for wearable technology, advanced medical instruments, aerospace, and premium consumer electronics. It seamlessly merges the stable support of rigid boards with the dynamic bending capability of flexible circuits, enabling complex electrical connections within minimal space.

Product Definition & Scientific Classification

This is a high-layer-count PCB utilizing any-layer HDI and rigid-flex construction. It can be accurately classified per industry standards:

• By Structure: Rigid-Flex PCB – Laminates rigid and flexible circuit layers into a single unit.

• By Technology Level: Advanced HDI PCB – Employs laser drilling, filled vias, and microvias (<0.15mm) for superior routing density.

• By Layer Count: 6-Layer Circuit Board (comprising both rigid and flexible layers).

• By Material: Specialty High-Performance Material PCB – Core build-up uses Panasonic RF-777 composite.

Design Essentials & Working Principle

Design Essentials: The key to a successful rigid-flex board design lies in the rigid-to-flex transition zone. Precise calculation of bend radius, stress relief, and routing in flex areas is critical to prevent cracking during dynamic flexing. Concurrently, HDI blind and buried via design must coordinate with the stack-up structure to optimize signal integrity (SI) and power integrity (PI).
Working Principle: The PCB structure integrates rigid sections (for component mounting and mechanical support) with flexible sections (for 3D interconnection and movement) via multilayer lamination. Electrical signals travel through laser-drilled microvias and via filling plating technologies inherent to HDI boards, achieving the shortest and most reliable paths between layers, which minimizes signal loss and crosstalk.

Core Materials & Superior Performance

• Core Material: We utilize the industry-premium Panasonic RF-777 35/50 composite material. Renowned for its exceptional dimensional stability, superior high-frequency performance, and excellent heat resistance, it is the ideal choice for manufacturing high-reliability rigid-flex circuit boards.

• Surface Finish: The board features a 2-micron Electroless Nickel Immersion Gold (ENIG) finish. This provides a flat surface, excellent solderability, and long-term oxidation resistance for PCB pads, making it perfect for mounting fine-pitch components like BGAs.

• Key Performance Attributes:

  • Ultra-Thin 0.22mm Profile: Enables maximum compression of internal device space.

  • High Reliability: Undergoes rigorous PCB reliability testing, capable of withstanding millions of dynamic bend cycles.

  • Excellent Signal Transmission: HDI design and premium materials ensure low-loss transmission for high-speed signals.

  • High-Density Assembly: Provides an ideal platform for SMT assembly, supporting miniaturized component layout.

Structure & Key Features

• PCB Structure: A typical 6-layer construction involving 2-4 layers of rigid FR-4 laminated with polyimide flexible cores. The stack-up is meticulously engineered to balance stiffness and flexibility.

• Product Features:

  1. 3D Interconnection Freedom: Eliminates spatial constraints, enabling 3D assembly and reducing connectors and cables.

  2. Lightweight & Miniaturization: The extreme thinness directly reduces product weight and size.

  3. Enhanced System Reliability: Removes connection point failures, improving overall stability in vibrating or high-shock environments.

  4. Simplified Assembly Process: As a custom PCB assembly, it streamlines final product assembly, lowering labor costs.

Precision Manufacturing Process

UGPCB adheres to international quality standards like IPC-6013 (for flexible circuits) and IPC-2221/2223. Our PCB fabrication process is precise and rigorous:

1. Laser Drilling: Creates micron-level blind and buried vias in flexible and core layers.

2. Hole Metallization & Plating: Vias are made conductive through chemical deposition and plating, with via filling for planarization.

3. Pattern Transfer & Etching: Forms the intricate circuit board traces.

4. Layer Alignment & Lamination: Rigid layers, prepreg, and flexible layers are precisely aligned and bonded under high heat and pressure. This is the core step in rigid-flex PCB manufacturing.

5. Surface Finishing: Application of the ENIG coating to protect pads and ensure solderability.

6. Rigorous Testing: Includes flying probe testing, Automated Optical Inspection (AOI), and reliability testing to ensure every board’s quality.

Wide-Ranging Application Scenarios

This advanced PCB is the core skeleton for innovative products in:

• Wearable Technology: Smartwatches, AR/VR glasses, health monitors, requiring comfort and constant flexing.

• Advanced Medical Electronics: Endoscopic capsules, hearing aids, portable monitors, demanding high reliability and miniaturization.

• Aerospace & Defense: Satellite components, UAV flight control systems, needing extreme environment endurance and low weight.

• Precision Consumer Electronics: High-end smartphone camera modules, folding phone hinge areas, ultra-thin laptops.

• Industrial & Automotive Electronics: Compact sensors, robotic joint interconnection modules.

Contact a UGPCB PCB Technical Expert today for your 0.22mm Ultra-Thin HDI Rigid-Flex PCB solution! Make your product stand out in the competition for miniaturization and high performance.