6-طبقة 1-المرحلة HDI ثنائي الفينيل متعدد الكلور (1+ن+1) | UGPCB High-Density Interconnect Manufacturing

Product positioning: UGPCB’s 6-layer 1-stage HDI PCB uses a 1+N+1 stack-up. إنه يقدم 0.10 mm laser blind vias, 0.20 mm through holes, 0.20 mm BGA pitch, و 3/3 mil traces. It suits compact, high-integration electronics.

1. What Is a 6-Layer 1-Stage HDI PCB?

A 6-layer 1-stage HDI PCB is a six-layer لوحة دوائر مطبوعة عالية الكثافة. It uses a 1+N+1 stack-up, where N equals 4. IPC-2226 classifies this build-up approach as a Type I مؤشر التنمية البشرية بناء. Each side has one build-up layer. Laser microvias connect the outer layers to the next inner layer. Mechanical through holes connect the core layers.

Parameter Snapshot

المعلمة	مواصفة
عدد الطبقات	6 طبقات (1+ن+1)
المادة الأساسية	FR4 Tg150
سمك اللوحة	1.6 مم
حجم اللوحة	105 × 95 مم (1-أعلى)
سمك النحاس الخارجي	35 ميكرومتر (1 أوقية)
سمك النحاس الداخلي	30 ميكرومتر
الحد الأدنى من خلال ثقب	0.20 مم
Minimum blind via	0.10 مم
Minimum BGA pitch	0.20 مم
Trace width/spacing	3/3 ميل (75 µm/75 µm)

2. Product Overview and Scientific Classification

2.1 نظرة عامة على المنتج

UGPCB’s 6-layer 1-stage HDI PCB targets high-density electronic packaging. It improves routing density over a standard 6-layer through-hole PCB. Laser-drilled blind vias make this possible. IPC-2226 defines HDI as a board with higher wiring density than مركبات ثنائي الفينيل متعدد الكلور التقليدية. It uses conductors ≤100 µm, فيا <150 ميكرومتر, and pads <400 ميكرومتر. This product meets those thresholds. إنه 3/3 ميل (75 ميكرومتر) traces and 0.10 mm laser microvias exceed standard PCB capability.

2.2 التصنيف العلمي

• By interconnection: اتش دي اي ثنائي الفينيل متعدد الكلور, IPC-2226 Type I
• By stack-up: 1+N+1 first-order HDI, single build-up per side, N=4 core
• حسب عدد الطبقات: 6-طبقة ثنائي الفينيل متعدد الكلور متعدد الطبقات
• By base material: FR4 Tg150 epoxy glass fabric
• By performance class: فئة IPC-6012 2 أو الطبقة 3
• By product form: bare PCB or تجميع PCBA

3. Stack-Up and Design Highlights

3.1 1+N+1 Stack-Up

1+N+1 is the most basic and mature HDI stack-up. “ن” is the core. Each “1” is one build-up layer. This product is 1+4+1. The core has four layers. One build-up layer sits on each side. IPC-2226 describes this structure as having microvias that connect to adjacent inner layers. The core uses mechanical through holes. This structure balances signal integrity, يكلف, and yield. Many HDI PCB designs start with this stack-up.


3.2 Key Design Points

Blind via design: The minimum blind via is 0.10 مم (100 ميكرومتر). IPC-T-50M defines a microvia as a blind via ≤0.15 mm with aspect ratio ≤1:1. The blind via connects only the outer layer to the next inner layer. It frees inner-layer routing space. This helps high-density PCB layout.

Trace width and spacing: The product uses 3/3 ميل (75 µm/75 µm) آثار. This is a core اتش دي اي ثنائي الفينيل متعدد الكلور القدرة. Standard multilayer PCBs often use 6/6 ميل (150 ميكرومتر) آثار. HDI PCBs can use 3/3 mil or finer. This doubles routing density in the same area. في 0.20 mm BGA pitch, 3/3 mil traces allow two routes between pads. This directly affects BGA escape routing.

BGA support: The minimum BGA pitch is 0.20 مم. At this pitch, pads are often 0.10–0.12 mm. Pad spacing is only 0.08–0.10 mm. This demands high registration accuracy and etch control in PCB manufacturing.

التحكم في المعاوقة: مع 3/3 mil traces and FR4 Tg150, Dk is about 4.2–4.6 at 1 ميغاهيرتز. Manufacturers can control 50 Ω single-ended and 100 Ω differential impedance. This supports high-speed signal transmission.

Thermal design: The 6-layer structure uses 30 µm inner copper. Large inner copper planes spread heat away from BGA areas.

4. كيف يعمل

The 6-layer 1-stage HDI PCB uses two via types:

• Laser blind via: A laser drills from the outer layer to the next inner layer. The minimum diameter is 0.10 مم. CO₂ or UV lasers form these vias.
• Mechanical through hole: This hole passes from top to bottom. It connects core layers and all layers. The minimum diameter is 0.20 مم.

Signals travel from surface components, such as BGA chips, through blind vias into inner signal layers. This avoids the space loss and signal reflection of through holes. The shorter path lowers parasitic inductance and capacitance. This benefits high-speed digital signals.

5. Core Materials and Performance

5.1 المواد الأساسية: FR4 Tg150

This product uses FR4 Tg150 epoxy glass fabric. Tg is the glass transition temperature. IPC-TM-650 method 2.4.25 (DSC) measures this value. Tg150 material remains stable in lead-free soldering. Lead-free reflow peaks at about 245–260°C. The material withstands multiple reflow cycles without major dimensional change or delamination.

5.2 سمك النحاس

• Outer copper: 35 ميكرومتر (1 أوقية). This supports current carrying and solder reliability.
• Inner copper: 30 ميكرومتر. This meets signal and power plane needs.

5.3 ميزات الأداء الرئيسية

• High routing density: 3/3 mil traces and 0.10 mm microvias raise density by over 50% versus standard 6-layer boards.
• Small package support: 0.20 mm BGA pitch fits CSP, QFN, and other micro packages.
• Strong signal integrity: Short blind via paths reduce parasitic effects. This helps high-speed signals.
• Reliable construction: The board can meet IPC-6012 acceptance requirements. فئة IPC-6012 3 requires a minimum average copper thickness of 25 µm in plated holes.

6. عملية الإنتاج

UGPCB makes 6-layer 1-stage HDI PCBs through precise steps:

1. Inner-layer imaging: Expose, يطور, and etch inner traces on the 4-layer core.
2. Inner-layer lamination: Press inner cores and prepreg into a 4-layer core.
3. First drilling and plating: Drill mechanical through holes and plate copper.
4. Build-up lamination: Press one dielectric layer on each side of the core.
5. حفر الليزر: Use CO₂ or UV lasers to form 0.10 مم ميكروفيا.
6. Blind via plating and filling: Plate and fill laser vias for reliable conduction.
7. Outer-layer imaging: Form 3/3 mil outer traces.
8. Solder mask and surface finish: Apply solder mask and ENIG or OSP finish.
9. Profiling and testing: Route the outline, run اختبار مسبار الطيران, الهيئة العربية للتصنيع, and final inspection.

7. التطبيقات الرئيسية

The 6-layer 1-stage HDI PCB balances density, مقاس, والموثوقية. It serves many markets:

• Smartphones and mobile devices: Mainboard core areas with processor BGA packages.
• الأجهزة القابلة للارتداء: الساعات الذكية, سماعات الأذن TWS, and other space-limited products.
• إلكترونيات السيارات: ADAS sensor modules and infotainment mainboards.
• Medical electronics: Portable monitors and implantable device control boards.
• التحكم الصناعي: PLC modules and industrial IoT gateways.
• معدات الاتصالات: 5G small-cell RF modules and optical module PCBs.

The global HDI PCB market is growing fast. The Business Research Company reports strong HDI market growth. The market will grow from USD 17.78 مليار في 2025 to USD 19.47 مليار في 2026. That is a 9.5% compound annual growth rate (معدل نمو سنوي مركب). The market may reach USD 28.82 مليار من قبل 2030.

8. لماذا تختار UGPCB?

UGPCB Circuits Limited (UGPCB®) focuses on high-precision PCB R&D and manufacturing. Its factory covers 280,000 square meters. يوظف 1,300 الناس. زيادة 35% are technical professionals. The company makes HDI PCBs from 1 ل 6+ stages, any-layer HDI boards, ركائز IC, لوحات مرنة جامدة, and standard multilayer FR4 PCBs.

UGPCB holds ISO9001, أول, and RoHS certifications. It follows IPC standards for production and acceptance. This ensures product quality meets customer needs and industry rules. The company serves customers in mainland China, تايوان, كوريا, اليابان, the US, البرازيل, الهند, جنوب شرق آسيا, and Europe.

Get a quote today: Send your Gerber files or design parameters. The UGPCB technical team will reply within 24 ساعات. We will provide a custom 6-layer HDI PCB quote and a one-stop PCBA assembly solution. سواء كنت بحاجة quick prototyping or stable volume supply, we can help.

بيان مصدر البيانات

This article cites standards and technical data from these authorities:

1. IPC-2226, Sectional Design Standard for High Density Interconnect (مؤشر التنمية البشرية) Printed Boards — HDI structure classification and microvia definition.
2. IPC-T-50M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits — microvia terminology.
3. IPC-6012, مواصفات التأهيل والأداء للألواح المطبوعة الصلبة — rigid board acceptance and plated copper thickness.
4. IPC-2221, المعيار العام لتصميم اللوحة المطبوعة — PCB design guidelines and trace/space practice.
5. IPC-TM-650 Method 2.4.25 — glass transition temperature (تيراغرام) طريقة الاختبار.
6. The Business Research Company, Global High Density Interconnect (مؤشر التنمية البشرية) Market Report 2026 — HDI market data.