مقدمة
UGPCB‘s 2-Layer Rigid PCB is a fundamental, high-reliability لوحة الدائرة solution engineered for demanding applications. Built on a robust FR-4 TG150 substrate with a standard 1.60mm thickness, it delivers an optimal balance of performance, durability, and cost-effectiveness. The board features a reliable lead-free Hot Air Solder Leveling (ينزف) surface finish, a protective black solder mask, and clear white silkscreen legends for identification.

Product Overview & تصنيف
This double-sided PCB serves as a core interconnect platform for a wide range of electronics. It is scientifically classified as a Rigid PCB (by construction), أ 2-Layer or Double-Sided Board (by layer count), and is rated for Industrial Grade (فئة إيبك 2) applications based on its FR-4 TG150 material specification, making it suitable for extended lifecycle products.
تصميم & Operational Principle
Successful implementation requires attention to electrical and thermal design rules. Adequate trace width for current capacity (على سبيل المثال, 1A per 10mil trace width for 1oz copper) and strategic placement of thermal reliefs are critical. The PCB functions as a miniature city: ال FR-4 substrate is the foundation, copper traces are the roads carrying signals and power, plated through-holes are interlayer connectors, ال solder mask is a protective coating, and the silkscreen provides navigation.
بناء, مواد & Performance
The symmetrical stack-up ensures mechanical stability. Key materials define its capabilities:
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Core: FR-4 TG150 Laminate (Tg ≥ 150°C) provides high thermal endurance and stability.
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نحاس: Standard 1oz (35µm) electrodeposited copper foil.
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Finishes: Black LPI solder mask and white epoxy silkscreen.
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الانتهاء من السطح: Lead-Free HASL for excellent solderability.
This combination yields high heat resistance, superior electrical insulation, strong mechanical rigidity (from the 1.60mm thickness), and excellent solder joint reliability.
عملية التصنيع & ضبط الجودة
Our production follows معايير IPC, encompassing CAM engineering, precision drilling, electroplating, LPI solder mask application, legend printing, lead-free HASL surface finishing, and electrical testing. Every board undergoes 100% electrical testing and الفحص البصري الآلي (الهيئة العربية للتصنيع) to meet stringent quality criteria.
التطبيقات
This versatile PCB is ideal for:
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Industrial Control Systems: PLCs, motor drives, sensor interfaces.
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Power Electronics: Switch-mode power supplies (SMPS), UPS boards, LED drivers.
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السيارات & الالكترونيات الاستهلاكية: Auxiliary control modules, audio amplifiers, appliance controllers.

Key Specifications Table
| المعلمة | Specification |
|---|---|
| طبقات | 2 |
| Board Thickness | 1.60 مم (Standard) |
| Base Material | فر-4, Tg ≥ 150°C |
| Copper Weight | 1 أوقية (35 µm) Standard |
| قناع اللحام | أسود, LPI |
| Silkscreen | أبيض |
| الانتهاء من السطح | Lead-Free HASL |
| دقيقة. Trace/Spacing | ≥ 0.15 مم (6 ميل) |
| Standard Compliance | IPC-A-600, فئة إيبك 2 |
شعار UGPCB















