1. Panoramica del prodotto: What Is a Cooker Hood Mother Board PCB?
A cooker hood mother board PCB (Circuito stampato) serves as the central hardware backbone of a range hood control system. This rigid printed circuit board handles all electrical connections and signal transmission tasks for motor driving, touch sensing, LED lighting control, airflow adjustment, and delayed shut‑off functions.
UGPCB presents this cooker hood motherboard PCB manufactured with Kingboard KB6165G high-end laminate. This double-sided rigid printed circuit board is specifically engineered for long‑term reliable operation in harsh kitchen environments. IL PCB misure 82.63 × 46.7 mm with a standard 1.6 spessore tavola mm. Its double‑sided routing structure delivers excellent electrical performance and mechanical strength for medium‑complexity control circuits.
Industry data shows that China’s range hood control board shipments reached 38.60 milioni di unità 2024, marking a 5.7% year‑over‑year growth. Smart control boards now account for 58.7% of total shipments. Given this substantial market demand, selecting a reliable and well‑manufactured cooker hood PCB directly impacts the end product’s quality and user experience.
2. Definizione del prodotto e specifiche tecniche
2.1 Parametri di base
| Parametro | Specifica |
|---|---|
| Nome prodotto | PCB della scheda madre della cappa da cucina |
| Materiale laminato | Kingboard KB6165G (Halogen‑Free TG150 Glass Fiber Copper‑Clad Laminate) |
| Spessore della scheda | 1.6 mm |
| Numero di strati | 2 Strati (Double‑Sided Board) |
| Dimensione finita | 82.63 × 46.7 mm |
| Diametro minimo del foro | 0.296 mm |
| Larghezza minima della linea / Interlinea | 0.342 mm / 0.37 mm |
| Spessore di lamina di rame | 1/1 OZ (35 µm per strato) |
| Finitura superficiale | Nichel chimico / Oro ad immersione (Essere d'accordo / Gold Plating Process) |
| Maschera di saldatura / Leggenda | Black Solder Mask / Legenda serigrafia bianca |
2.2 Materiale laminato: Kingboard KB6165G
This product uses KB6165G, a halogen‑free TG150 glass fiber copper‑clad laminate from Kingboard Laminates Holdings Ltd. This industrial‑grade high‑performance laminate delivers the following key properties:
- Temperatura di transizione vetrosa (Tg) : 150° C. (155‑158°C measured by DSC method). The material withstands three lead‑free reflow soldering cycles with a peak temperature of 260°C.
- Indice di tracciamento comparativo (CTI) : 600 V. This represents a threefold improvement over the base model KB‑6165F (CTI ≥ 175 V), offering exceptional resistance to tracking failure.
- Z‑axis Coefficient of Thermal Expansion (Cte) : Alfa 1 A 41 ppm/° C., Alfa 2 A 235 ppm/° C..
- T288 Delamination Time : > 60 minuti, several times higher than standard FR‑4 materials.
- Temperatura di decomposizione termica (Td, 5% perdita di peso) : 370° C..
- Punteggio di infiammabilità : UL94 V‑0.
- Resistività superficiale : 5.2 × 10⁸ MΩ.
- Resistività al volume : 6.1 × 10⁹ MΩ‑cm.
- Forza della pelatura : 1.4 N/mm (per 1 foglio di rame da once).
This laminate passes 96‑hour salt spray testing and is free of halogens, antimony, and red phosphorus, fully complying with RoHS environmental directives.
3. Design Principles and Operating Principles
3.1 Design Standard Compliance
This product’s design strictly followsIPC‑2221C, Standard generico sulla progettazione di schede stampate (released August 18, 2025). IPC‑2221C serves as the foundation design standard for all documents in the IPC‑2220 series. It establishes generic requirements for printed board design, covering material selection, copper foil selection, minimum electrical clearance, impedance tolerances, and other core design specifications.
3.2 Engineering Basis for Line Width and Spacing Design
This product features a design line width of 0.342 mm and line spacing of 0.37 mm. These parameters are determined based on the current‑carrying capacity formula from the IPC‑2221 standard:
io = k × ΔT^0,44 × A^0,725
Dove:
- IO = Maximum allowable current (Amperes, UN)
- k = Fattore di correzione (0.048 for outer layer traces, 0.024 for inner layer traces)
- ΔT = Temperature rise (° C.)
- UN = Conductor cross‑sectional area (milioni²)
For this product with 1 foglio di rame da once (circa 35 μm thickness), outer layer traces can carry approximately 1.5‑2 A per millimeter of width at a 10°C temperature rise. IL 0.342 mm line width sufficiently meets the current‑carrying demands of range hood control circuits (typically including motor drive currents of 3‑5 A and touch/logic circuit currents below 1 UN), while providing adequate process windows for subsequent PCBA soldering operations.
3.3 Principi di funzionamento
The cooker hood motherboard PCB functions as the physical carrier of the control system, operating at three levels:
Electrical Connection Level : The copper traces on the PCB electrically connect the MCU (main control chip), touch sensing modules, motor driver ICs, LED driver circuits, and power management modules according to the schematic diagram, enabling orderly signal transmission.
Signal Processing Level : User commands entered through the touch panel (power on/off, airflow adjustment, lighting control, ecc.) travel via touch traces on the PCB to the MCU. Dopo l'elaborazione, the MCU outputs corresponding control signals through the driver traces on the PCB to activate motors, Luci a LED, and other actuating components.
Power Management Level : Power traces on the PCB convert the input AC or DC power to the operating voltages required by each component. Proper power/ground plane layout ensures power supply stability.
4. Classificazione del prodotto
Based on printed circuit board industry classification standards, questo prodotto rientra nelle seguenti categorie:
| Dimensione Classificazione | Categoria |
|---|---|
| Per struttura | Rigid Printed Circuit Board |
| Per conteggio strati | Double‑Sided Board (2‑Layer Board) |
| By Laminate Material | FR‑4.1 Grade Halogen‑Free Glass Fiber Copper‑Clad Laminate (KB6165G) |
| Per finitura superficiale | Nichel chimico / Oro ad immersione (Essere d'accordo) |
| Per applicazione | Home Appliance Control Board (Cooker Hood Mother Board) |
| Per grado di infiammabilità | UL94 V‑0 |
| Per conformità ambientale | Halogen‑Free, Conforme a ROHS |
PerIPC‑6012F, Specifiche di qualificazione e prestazione per circuiti stampati rigidi (released September 2023), this product meetsClasse 2 – Servizio dedicato Prodotti Elettronici Requisiti. Classe 2 applies to products where extended life is expected and uninterrupted service is desired, but the operating environment is not extreme—perfectly matching home appliance applications.
5. Materiali utilizzati
5.1 Substrato: KB6165G Copper‑Clad Laminate
As detailed above, this product uses Kingboard KB6165G halogen‑free TG150 glass fiber copper‑clad laminate with the following material composition:
- Rinforzo : Electronic‑grade glass fabric
- Matrix Resin : Halogen‑free epoxy resin (Tg 150°C)
- Lamina di rame : 1 oz Electrolytic Copper Foil (Rame ED)
- Sistema ritardante di fiamma : Halogen‑free flame retardant (UL94 V‑0)
5.2 Finitura superficiale: Nichel chimico / Oro ad immersione (Essere d'accordo)
This product uses the Electroless Nickel / Oro ad immersione (Essere d'accordo) surface finish process. PerIPC‑4552B, Specifiche per nichel chimico/oro per immersione (Essere d'accordo) Placcatura per schede stampate (published May 2021), ENIG deposit thickness requirements are:
- Spessore dello strato di nichel : 3‑6 μm (per IPC‑4552B Class 1/2/3)
- Gold Layer Thickness : 0.05‑0.10 μm (typical range: 0.075‑0.125 μm)
ENIG surface finish offers these advantages:
- Ottima saldabilità, meeting the highest coating durability rating per IPC‑J‑STD‑003
- Superiore resistenza all'ossidazione e alla corrosione
- Flat surface suitable for fine‑pitch component soldering
- Suitable for wire bonding and contact finish applications
5.3 Maschera di saldatura e leggenda
- Maschera di saldatura : Black ink offering excellent insulation and heat resistance
- Leggenda : White silkscreen providing high contrast for SMT placement and repair identification
6. Struttura del prodotto e caratteristiche prestazionali
6.1 Caratteristiche strutturali
Double‑Sided Design (2 Strati) : Both the Top Layer and Bottom Layer contain circuit traces, with electrical connections between layers made through Plated Through‑Holes (PTH). The double‑sided structure balances routing density with cost‑effectiveness.
Precision Hole Diameter Control : Diametro minimo del foro di 0.296 mm meets the strict requirements of IPC‑6012F for plated through‑holes. Copper plating on hole walls ensures reliable interlayer connections and conductivity.
Compact Dimensions : IL 82.63 × 46.7 mm compact size is specifically tailored for the limited internal space of range hoods, facilitating overall product mechanical design.
Standard 1.6 Spessore tavola mm : This thickness maintains mechanical strength while matching standard component lead lengths, facilitando PCB assemblaggio.
6.2 Caratteristiche delle prestazioni
Superior Heat Resistance : With Tg of 150°C and Td of 370°C, the board withstands the high‑temperature impact of lead‑free reflow soldering (picco 260°C).
Excellent Insulation Performance : Surface resistivity of 5.2 × 10⁸ MΩ and volume resistivity of 6.1 × 10⁹ MΩ‑cm ensure reliable signal transmission in high‑humidity kitchen environments.
High CTI Tracking Resistance : The CTI 600 V rating effectively prevents tracking failure in high‑pollution environments (kitchen fume environments fall under Pollution Degree 2‑3).
Good Anti‑CAF Performance : The laminate offers strong resistance to Conductive Anodic Filament (CAF) formazione, reducing the risk of CAF failure in moist‑heat environments.
UL94 V‑0 Flammability Rating : Meets the highest fire safety requirements for home appliances.
7. Flusso del processo di produzione
UGPCB manufactures this cooker hood motherboard PCB in strict compliance with IPC‑6012F requirements:
Fare un passo 1: Controllo qualità in entrata (IQC) → Inspect KB6165G copper‑clad laminate, lamina di rame, Film secco, inchiostro per maschera di saldatura, e altre materie prime
Fare un passo 2: Taglio → Cut large copper‑clad laminate sheets to working panel size
Fare un passo 3: Perforazione → Foratrici CNC process the 0.296 mm minimum hole diameter along with other mounting holes and vias
Fare un passo 4: Deposizione chimica di rame / Placcatura del pannello → Metallize hole walls to create conductive through‑holes
Fare un passo 5: Trasferimento del modello → Apply dry film → Expose → Develop to form the circuit pattern
Fare un passo 6: Incisione → Remove unprotected copper to create the designed circuit traces
Fare un passo 7: Maschera di saldatura → Print black solder mask ink → Expose → Develop to expose pads
Fare un passo 8: Essere d'accordo (Nichel chimico / Oro ad immersione) → Electroless nickel plating (3‑6 μm) + Oro di immersione (0.05‑0.10 μm)
Fare un passo 9: Stampa della legenda → Print white silkscreen legend identifiers
Fare un passo 10: Instradamento / V‑Cut → CNC routing to final dimensions of 82.63 × 46.7 mm
Fare un passo 11: Test elettrici → Test con sonde volanti / fixture testing to verify open/short circuit integrity
Fare un passo 12: Controllo qualità finale (FQC) → Visual inspection and dimensional inspection per IPC‑6012F Class 2 standard
Fare un passo 13: Imballaggio e spedizione → Vacuum packaging + anti‑static bags, conforme a IPC packaging specifications
8. Application Scenarios and Market Applications
8.1 Scenari applicativi primari
This cooker hood motherboard PCB is widely used in:
- Residential Range Hoods : Main control circuit boards for touch‑control or button‑type range hoods
- Integrated Cooktop Control Boards : Core control units for integrated cooking appliances
- Smart Kitchen Appliances : Control modules for smart range hood and cooktop integrated systems
- Commercial Kitchen Equipment : Control boards for large commercial exhaust systems
8.2 Prospettive di mercato
China’s small appliance control board market is projected to reach approximately RMB 45 miliardi di 2025, with year‑over‑year growth of 10.3%. Smart control boards now account for over 60% of the market. The Chinese home appliance control board market is in a critical stage of smart transformation and upgrade, driving sustained demand for high‑performance, high‑reliability cooker hood motherboard PCBs.
8.3 Typical Operating Environment
The cooker hood motherboard PCB operates under these conditions:
- Temperature Range : ‑10°C to +85°C (kitchen environment)
- Humidity Range : 20% A 90% RH (significant steam generated during cooking)
- Grado di inquinamento : Pollution Degree 2‑3 (fume and dust)
- Vibrazione : Continuous vibration from motor operation
9. Why Choose UGPCB for Your Cooker Hood Mother Board PCB?
✅Conformità agli standard internazionali : Full adherence to IPC‑2221C and IPC‑6012F international standards throughout design, produzione, e ispezione
✅Premium Laminate Materials : Kingboard KB6165G industrial‑grade laminate with Tg 150°C, CTI 600 V, and UL94 V‑0 rating
✅Capacità di produzione di precisione : Diametro minimo del foro di 0.296 mm e larghezza minima della linea di 0.342 mm
✅Finitura superficiale superiore : ENIG finish compliant with IPC‑4552B, offering excellent solderability
✅Conformità ambientale : Halogen‑free materials meeting RoHS and REACH directives
✅Customization Services : Flexible customization of dimensions, layer count, materiale laminato, e finitura superficiale
✅Consegna rapida : Quick‑turn capability from prototypes to volume production
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UGPCB is committed to providing high‑quality cooker hood motherboard Produzione di PCB services to customers worldwide. Che tu abbia bisogno di campioni di prototipi o di produzione in serie, we offer professional technical support and competitive pricing.
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💡 Please provide the following information for an accurate quote:
- PCB dimensions, layer count, and laminate material requirements
- Minimum line width/spacing and minimum hole diameter
- Surface finish requirements
- Copper foil thickness requirements
- Quantity requirements (prototipo / piccolo lotto / produzione in volume)
- File Gerber (se disponibile)
Send your requirements today, e il UGPCB professional team will respond with a detailed quote and technical recommendations within 24 ore!
Dichiarazione dell'origine dei dati
The technical data and standards cited in this article are sourced from the following authoritative organizations and publicly available materials:
- IPC‑6012F : Specifiche di qualificazione e prestazione per circuiti stampati rigidi, settembre 2023, IPC International, Inc.
- IPC‑2221C : Standard generico sulla progettazione di schede stampate, agosto 18, 2025, IPC International, Inc.
- IPC‑4552B : Specifiche per nichel chimico/oro per immersione (Essere d'accordo) Placcatura per schede stampate, May 2021, IPC International, Inc.
- KB‑6165G / KB‑6165GMD Technical Data Sheet : Kingboard Laminati Holdings Ltd. official product technical documentation
- Ul94 : Norma per prove di infiammabilità di materie plastiche per parti di dispositivi ed apparecchi, Underwriters Laboratories Inc.
- IPC‑TM‑650 : Manuale dei metodi di prova, IPC International, Inc.
