UGPCB の詳細な分析: 6-レイヤーリジッド + 4-レイヤーフレキシブルイエローソルダーマスクリジッドフレックスボード – 高密度相互接続の新時代の到来

In today’s rapid evolution toward lightweight, 薄い, 短い, and compact electronic devices, の リジッドフレックスPCB has become indispensable in high-precision fields such as telecommunications, medical instruments, と航空宇宙. Its unique combination of rigid support and three-dimensional flexibility makes it a critical interconnect component.

プロフェッショナルとして PCBメーカー, UGPCB introduces its high-performance Yellow Soldermask Rigid-Flex PCB (R-FPCB) . This article explores this advanced board, で構築された FR-4 + PI materials そしてa 6-layer rigid plus 4-layer flexible 構造. We will examine its design principles, 製造工程, and applications, showing how it enables more stable signal transmission and a more compact system layout.

1. 製品の定義と概要

UGPCBYellow Soldermask Rigid-Flex Board integrates a rigid PCB and a flexible circuit board into a single interconnect solution through a lamination process.

主な仕様:

• レイヤーのスタックアップ: 6 レイヤー (6L) in rigid sections / 4 レイヤー (4L) in flexible sections

• Material Combination: FR-4 (rigid areas) + PI (ポリイミド, flexible areas)

• Surface Color: Yellow soldermask (硬い) / White coverlay (flex)

• 仕上がり厚さ: 0.4mm (rigid sections) / 0.2mm (flex sections)

This design retains the structural support and component-carrying capacity of rigid areas while utilizing the bendability of flexible sections. It achieves a true rigid-flex integration, eliminating the need for traditional connectors and ribbon cables.

2. Design Principles and Technology

あ. 作業原則

The core of rigid-flex technology lies in seamless interconnection. UGPCB laminates flexible PI layers with rigid FR-4 layers under high temperature and pressure. In flexible zones, FR-4 material is removed, leaving the PI base with a coverlay to allow bending. In rigid zones, FR-4 remains to support コンポーネント. This structure eliminates physical contact points from connectors, significantly enhancing 信号の完全性 (そして) and vibration resistance.

B. 設計上の考慮事項

• インピーダンス制御: For high-frequency communication PCBs, strict control of 3.5mil trace width and spacing ensures consistent differential impedance (例えば。, 100おお).

• Transition Zone Protection: The junction between rigid and flexible sections (the stub) is a stress point. UGPCB’s design uses rounded transitions and tapered trace widths to prevent cracking during bending.

• Stackup Matching: Uniform 1OZ copper thickness is maintained to prevent fatigue failure in the flexible sections during dynamic flexing.

3. Material and Performance Analysis

あ. コア材料

• FR-4 (厳格な領域): A fiberglass-reinforced epoxy laminate. It offers high mechanical strength, 耐熱性, and insulation, providing a stable platform for mounting heavy components like chips and connectors.

• PI (柔軟な領域): Polyimide film. It provides excellent high-temperature resistance (operating >150°C), a low dielectric loss factor (Df), and a high flex life.

• 表面仕上げ: イマージョンゴールド (同意する). This chemical process deposits a nickel-gold layer over copper.

  • 利点: High surface flatness suitable for fine-pitch circuits (3.5mil spacing), strong oxidation resistance, and good solderability along with aluminum wire bonding capability.

B. Key Performance Specifications

4. Structural Classification and Features

あ. Structural Classification

この製品は、 asymmetric structure (6-レイヤーリジッド + 4-layer flexible) within the category of multi-layer rigid-flex boards. 一般的に, rigid-flex boards are classified as:

• Layered Type: Flexible layers extend out independently, as seen in this product.

• Non-layered Type: The entire board uses flexible material, with stiffeners added to specific areas.

B. 製品の特徴

• 高い信頼性: The immersion gold finish combined with PI material ensures stable electrical performance even in harsh environments (high temperature and humidity).

• 高精度: Manufacturing capabilities for 3.5mil fine lines and 0.1mm micro vias solve high-density interconnect challenges.

• スペースの最適化: Replaces connectors, reducing installation volume by over 60% and lowering overall product weight.

• Visual Differentiation: The yellow soldermask provides a unique appearance and offers clearer contrast during SMT assembly, facilitating optical inspection.

5. 製造工程と品質管理

To ensure the reliability of this complex 6L+4L structure, UGPCB follows a rigorous production flow:

1. Inner Layer Circuit (Flex Area): Fine 3.5mil circuits are formed on the PI base material using laser or photolithography.

2. Coverlay Lamination: A protective film is laminated onto the flexible circuit, leaving only the pad areas exposed.

3. ラミネート加工: Rigid and flexible layers are aligned and laminated under vacuum. Key controls are the temperature profile and resin flow to prevent voids.

4. 掘削 & メッキ: 0.1mm micro vias are drilled. Electroless copper deposition creates interlayer connections.

5. 外層 & SolderMask: Yellow soldermask is applied to rigid areas; white coverlay remains on flexible areas.

6. 表面仕上げ: イマージョンゴールド (同意する) is applied with controlled thickness: 0.05-0.1μm Au / 3-5μm Ni.

7. プロファイリング & 電気試験: Laser routing or die punching defines the final shape. 100% AOI and 飛行探査機 testing verify electrical integrity.

6. アプリケーション

This product is primarily targeted at the通信基板 sector. Key applications include:

• 5G Communication Base Stations: Used for flexing connections in RF modules, solving compact interconnect needs between antennas and mainboards.

• スマートフォン & ウェアラブル: The 0.2mm flexible section enables dynamic bending in foldable phone hinges.

• 医療エレクトロニクス: Used in devices like ultrasonic endoscope probes, leveraging PI’s biocompatibility and high-density routing.

• カーエレクトロニクス: ADAS camera modules that must withstand constant vibration and thermal shock.

7. UGPCBを選択する理由?

Engineers often face challenges with low yields and long lead times for complex rigid-flex designs. UGPCB is a reliable supply chain partner offering:

• 製造能力: Mass production capability for 3.5mil trace/space, overcoming high-density interconnect barriers.

• 物質的な調達: Uses high-quality materials from suppliers like Shengyi/ITEQ for FR-4 and DuPont/Tayoho for PI, ensuring quality from the source.

• エンジニアリングサポート: Provides free DFM (製造可能性のための設計) checks to help optimize designs, especially in the rigid-flex transition zone.

Are you designing a circuit board that must both carry complex ICs and flex within a tight space?

UGPCB now offers prototyping and mass production services for this6-レイヤーリジッド + 4-layer flexible yellow soldermask rigid-flex PCB.

👉 Get a Quick Quote Today

Send your Gerber files and technical requirements to [sales@ugpcb.com] or click the online chat. Our engineering team will provide a professional DFM report and a competitive quote within 24 時間.