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Projeto de placa de circuito de equipamentos de rede - UGPCB

Design de PCB de alta potência/

Projeto de placa de circuito de equipamentos de rede

Nome: Projeto de placa de circuito de equipamentos de rede

Designable layers: 1-32 camadas

Largura mínima de linha e espaçamento de linha: 3mil

Abertura mínima do laser: 4mil

Abertura mecânica mínima: 8mil

Espessura da folha de cobre: 18-175cm (padrão: 18CM35CM70CM)

Força de casca: 1.25N/mm

Diâmetro mínimo do orifício de perfuração: lado único: 0.9mm/35mil

Diâmetro mínimo do orifício: 0.25mm/10mil

Tolerância à abertura: ≤ 100,8 mm ± 0,05 mm

Tolerância ao orifício: ± 0,05 mm

  • Detalhes do produto

Various Names of Circuit Boards

The names of circuit boards are: placa de circuito de cerâmica, alumina ceramic circuit board, aluminum nitride ceramic circuit board, placa de circuito, Placa de PCB, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, Thin circuit boards, impresso (copper etching technology) circuit boards, etc..

Importance of Circuit Boards

The circuit board makes the circuit miniaturized and intuitive, and plays an important role in the mass production of fixed circuits and the optimization of the layout of electrical appliances.

Types of Circuit Boards

Placas de circuito impresso (PCB)

Circuit boards can be called printed circuit boards.

FPC Circuit Boards

FPC circuit boards (also known as flexible circuit boards) are a kind of high reliability made of polyimide or polyester film as the base material. They are an excellent flexible printed circuit board with the characteristics of high wiring density, light weight, thin thickness, and good bendability.

Soft-Rigid Board

The birth and development of the flexible and rigid combination board—FPC and PCB, gave birth to the combination of flexible and rigid board this new product. Portanto, the soft-rigid board is a circuit board with FPC characteristics and PCB characteristics formed by combining flexible circuit boards and rigid circuit boards according to relevant process requirements through lamination and other processes.

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