LOGOTIPO UGPCB
F4B-1/2 Teflon PCB Glass Fabric Copper-Clad Laminates
F4B-1/2 Teflon PCB glass fabric copper-clad laminates are designed to meet the stringent electrical performance requirements of microwave circuits. These laminates stand out due to their excellent electrical properties and enhanced mechanical strength, making them ideal for microwave PCB applications.
Technical Specifications
Aparência
The appearance of these laminates meets the specification requirements set by National and Military Standards for microwave PCB laminates.
Types
- F4B255
- F4B265
Constante dielétrica
- 2.55
- 2.65
Available Dimensions (milímetros)
- 300×250, 380×350, 440×550, 500×500, 460×610, 600×500
- 840×840, 1200×1000, 1500×1000
- Custom dimensions are available upon request.
Espessura do Cobre
- 0.035μm, 0.018μm
Thickness and Tolerance (milímetros)
| Laminate Thickness | Tolerance |
|---|---|
| 0.17, 0.25 | ±0.025 |
| 0.5, 0.8, 1.0 | ±0.05 |
| 1.5, 2.0 | ±0.05 |
| 3.0, 4.0, 5.0 | ±0.09 |
The laminate thickness includes the copper thickness. Custom dimensions are available upon request.
Força mecânica
| Grossura (milímetros) | Maximum Warp | Single Side | Double Side |
|---|---|---|---|
| 0.25～0.5 | 0.030 | 0.050 | 0.025 |
| 0.8～1.0 | 0.025 | 0.030 | 0.020 |
| 1.5～2.0 | 0.020 | 0.025 | 0.015 |
| 3.0～5.0 | 0.015 | 0.020 | 0.010 |
Cutting/Punching Strength:
- Thickness ≤1mm: No burrs after cutting, minimum space between punching holes is 0.55mm, Sem delaminação.
- Grossura >1milímetros: No burrs after cutting, minimum space between punching holes is 1.10mm, Sem delaminação.
Força de casca (1oz copper)
- Normal State: ≥15N/cm; No bubbles or delamination.
- After Exposure to Constant Humidity and Temperature: Peel strength ≥12N/cm (after keeping in melting solder at 260°C ±2°C for 20 segundos).
Chemical Properties
These laminates can be chemically etched using standard PCB methods without changing their dielectric properties. Plating through holes is possible but requires sodium treatment or plasma treatment.
Electrical Properties
| Nome | Test Condition | Unidade | Value |
|---|---|---|---|
| Density | Normal state | g/cm³ | 2.2～2.3 |
| Absorção de umidade | Dip in distilled water 20±2°C for 24 horas | % | ≤0.1 |
| Operating Temperature | High-low temperature chamber | °C | -50～+260 |
| Condutividade térmica | W/m/k | 0.3 | |
| CTE (typical) | 0～100°C | ppm/°C | x:16, y:21 z:186 |
| Shrinkage Factor | 2 hours in boiling water | % | ≤0.0002 |
| Resistividade da superfície | 500V DC, Normal state | M·Ω | ≥1*10⁴ |
| Constant humidity and temperature | ≥5*10³ | ||
| Resistividade de volume | Normal state | MΩ.cm | ≥1*10⁶ |
| Constant humidity and temperature | ≥9*10⁴ | ||
| Pin Resistance | 500VDC, Normal state | Mω | ≥5*10⁴ |
| Constant humidity and temperature | ≥5*102 | ||
| Surface Dielectric Strength | Normal state, d=1mm (Kv/mm) | ≥1.2 | |
| Constant humidity and temperature | ≥1.1 | ||
| Constante dielétrica | 10GHZ, | εr | 2.55/2.65 (±2%) |
| Dissipation Factor | 10GHZ, | tgδ | ≤1*10⁻³ |
