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High-Performance Aluminum Nitride Ceramic PCB | 2-Capa, Alta conductividad térmica - UGPCB

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High-Performance Aluminum Nitride Ceramic PCB | 2-Capa, Alta conductividad térmica

Modelo : Aluminum nitride ceramic PCB

Material : PCB de cerámica, Sustrato de cerámica

Capa : 2Layer Ceramic PCB

Color : Blanco

Espesor : Aluminum nitride 0.635mm

Espesor de cobre : 1ONZ(35uno)

Tratamiento superficial : Oro de inmersión

Gold thick : >=3U"

Apertura mínima : 0.8milímetros

Process features : through hole, ceramic dam technology

  • Detalles del producto

Aluminum Nitride Ceramic PCB with White Substrate and Gold Plating

Composición de materiales

The Aluminum Nitride Ceramic PCB is composed of high-quality ceramic materials, specifically ceramic PCB and ceramic substrate. This combination ensures exceptional thermal conductivity and electrical insulation properties.

Características de rendimiento

El tarjeta de circuito impreso features a 2-layer ceramic structure with a white color appearance. The thickness of the aluminum nitride layer is precisely 0.635mm, providing a sturdy base for componentes. The copper thickness of 1OZ (35uno) ensures good electrical conductivity, while the immersion gold surface treatment with a gold thickness of >=3Uenhances corrosion resistance and ensures smooth soldering processes.

Distinctive Features

  • Alta conductividad térmica: Aluminum nitride offers excellent thermal conductivity, making it suitable for high-power and high-frequency applications.
  • Durabilidad: Ceramic materials are known for their hardness and durability, contributing to the PCB’s long lifespan.
  • Precisión: The minimum aperture of 0.8mm allows for the placement of fine components, ensuring high-density packaging.

Proceso de producción

Aluminum Nitride (AlN) Ceramic Printed Circuit Boards (PCB) Proceso de fabricación

The production of Aluminum Nitride Ceramic PCBs involves several critical steps:

  1. Preparación de material: High-quality aluminum nitride powder and other ceramic materials are mixed and pressed into the desired shape.
  2. Sinterización: The pressed ceramic substrate undergoes sintering at high temperatures to achieve the required density and strength.
  3. Copper Deposition: A layer of copper is deposited on the ceramic substrate using advanced metallization techniques.
  4. Patrón de circuito: The copper layer is etched to form the desired circuit patterns.
  5. Hole Drilling: Through holes are drilled to allow for interconnections between layers.
  6. Ceramic Dam Technology: This unique technology ensures the precise alignment and sealing of holes, enhancing the PCB’s reliability.
  7. Tratamiento superficial: The PCB undergoes immersion gold plating to provide a corrosion-resistant surface finish.

Escenarios de aplicación

Aluminum Nitride Ceramic PCBs are ideal for various high-performance applications:

  1. High-Power Electronics: Suitable for use in power supplies, inverters, and other high-power electronic devices due to their excellent thermal management capabilities.
  2. Circuitos de alta frecuencia: Perfect for RF and microwave circuits that require low loss and high stability.
  3. Equipo médico: Used in medical devices that demand precision, fiabilidad, and high-performance electronics.
  4. Aeroespacial y defensa: Ideal for applications in harsh environments where durability and thermal resistance are crucial.

Applications of Aluminum Nitride (AlN) Ceramic Printed Circuit Boards (PCB) in High-Power Electronic Devices

En resumen, Aluminum Nitride Ceramic PCBs offer a combination of exceptional thermal conductivity, durability, and precision, making them ideal for high-performance electronics across various industries.

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