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UGPCB Factory’s Copper-Nickel-Gold Production Line: Precision Electroplating Process Empowers High-End PCB Manufacturing
Introducción: Professionalism Forges Quality, Innovation Drives the Future
As a benchmark enterprise in the tarjeta de circuito impreso and PCBA fields, UGPCB Factory provides global customers with highly reliable and precise circuit board solutions through its advanced copper-nickel-gold (Cu-Ni-Au) production line and other professional PCB and PCBA production equipment. This article will delve into the process flow and quality control system of the copper-nickel-gold production line equipment, showcasing UGPCB’s technological advantages and quality control in the electroplating segment of high-end PCB manufacturing.
Equipment Composition: A Perfect Blend of Automation and Precision
Conveyor System and Control System
The production line employs a modularly designed conveyor track that supports continuous production, with a speed control accuracy of ±0.05 m/min, ensuring seamless between workpieces at each process stage. The integrated control cabinet (as shown in the image) monitors parameters such as current, temperatura, and liquid level in real-time through a PLC system, supporting remote diagnosis and process adjustments, significantly enhancing production efficiency for productos de PCB during this manufacturing phase.
Electroplating Tanks and Materials
- Copper Electroplating Tank: Made of PP material with a volume of 1200L, containing copper sulfate (200gramos/litro), ácido sulfúrico (50gramos/litro), and additives. The temperature is controlled at 25±2°C, with a current density of 1.5-3A/dm².
- Nickel Electroplating Tank: Equipped with a titanium basket anode, the plating solution contains nickel sulfate (250gramos/litro), nickel chloride (50gramos/litro), and boric acid (40gramos/litro). The pH value is maintained at 3.8-4.2, with a thickness uniformity of ±5%.
- Gold Electroplating Tank: Utilizing a potassium gold cyanide (AuCN₂⁻) system, the gold layer thickness is adjustable from 0.1-3μm, complying with the IPC-4562 standard.
Spray Rinsing System
Featuring a multi-stage counter-current spray design with 360° rotating nozzles, the deionized water flow rate reaches 12L/min, ensuring a residual ion concentration of <1ppm and effectively preventing cross-contamination.
Process Flow: Scientifically Rigorous, Step-by-Step Excellence
Pretreatment Stage
- Chemical Degreasing: Using a solution of NaOH (50gramos/litro) + Na₂CO₃ (30gramos/litro), treatment is carried out at 80°C for 3 minutes to remove the copper surface oxide layer.
- Microetching: Etching with a sodium persulfate (100gramos/litro) solution, the roughness Ra is controlled at 0.3-0.6μm to enhance the adhesion of the plated layer.
Core Electroplating Processes
- Nickel Layer Deposition: Following Faraday’s law, the thickness calculation formula is:
hNi = dNi⋅1000 / (I⋅t⋅ηNi)
where I is the current (A), t is the time (mín.), ηNi is the nickel electroplating efficiency (95%), and dNi is the nickel density (8.9gramos/cm³). - Gold Layer Deposition: Utilizing pulse electroplating technology with a current density of 0.8A/dm², the plated layer density reaches 99.9%, and the corrosion resistance complies with the ASTM B488 standard.
Post-treatment and Inspection
- Neutralization Treatment: Soaking in 5% dilute sulfuric acid to prevent alkaline residues.
- Inspección AOI: Automatic optical inspection identifies plated layer defects with an accuracy of 25μm.
Control de calidad: Data-Driven, an Industry Benchmark
Parameter Monitoring System
- Electroplating Solution Analysis: Weekly detection of metal ion concentrations (p.ej., Cu²⁺, Ni²⁺) with an error range of ±2%.
- Thickness Detection: Real-time measurement using an X-ray fluorescence spectrometer (XRF), with data uploaded to the MES system for traceability.
Industry Certifications and Standards
- Certified under ISO 9001 e IATF 16949 quality management systems.
- Compliant with RoHS and REACH environmental directives, providing lead-free electroplating solutions.
UGPCB’s Core Advantages: Technological Leadership, Global Service
Equipment Advantages
- High-Precision Electroplating: Nickel layer thickness uniformity of ±3%, gold layer porosity of <0.5 pores/cm².
- Support from Other Modern and Intelligent PCB Equipment: The company’s substantial investment in other modern and intelligent PCB production equipment strongly guarantees product production efficiency and quality assurance.
- Energy Conservation and Environmental Protection: The circulating filtration system reduces wastewater discharge by 90% and lowers energy consumption by 40%.
Service Capabilities
- Rapid Response: Supporting small-batch Prototipos de PCB (delivery as fast as 24 horas) and large-scale production (monthly capacity of 350,000㎡).
- Customized Solutions: Offering special processes such as selective electroplating and local thick gold plating.
Conclusión: Partner with UGPCB for Exceptional Quality
Through its advanced copper-nickel-gold production line and stringent quality management system, UGPCB continuously provides global customers with PCB solutions that exceed expectations. Whether for highly complex HDI boards or highly reliable automotive electronic modules, we leverage technological innovation and professional services to help your products gain a competitive edge in the market.
Contact Us Now: Obtain one-stop PCB solutions and initiate a new model of efficient cooperation!
