Materiales de PCB TU-872 LK y TU-87P LK

Descripción general

TU-872 LK and TU-87P LK are PCB materials with low Dk/Df and high thermal reliability. TU-872 LK is formulated using high-performance modified epoxy resin FR-4.

Material Composition and Properties

This PCB material is reinforced with ordinary woven E glass and designed to have a low dielectric constant and low loss factor, making it ideal for high-speed low-loss multilayer PCB and high-frequency multilayer PCB board applications. TU-872 LK PCB material is compatible with environmentally friendly lead-free processes and also with FR-4 processes. Además, TU-872 LK multilayer PCB material demonstrates excellent CTE, Resistencia química superior, estabilidad térmica, Resistencia a la cafetería, and enhanced toughness due to compounds forming an allyl network.

Aprobaciones de la industria

TU-872 LK and TU-87P LK have received IPC-4101E Type Designations: /29, /99, /101, /126. They are IPC-4101E/126 Validation Services QPL Certified and have a UL designation of ANSI Grade: FR-4.0. The UL file number is E189572, with a Flammability rating of 94V-0 y una temperatura de funcionamiento máxima de 130 ° C.

Disponibilidad estándar

TU-872 LK and TU-87P LK are available in thicknesses ranging from 0.002” [0.05milímetros] a 0.062 " [1.58milímetros], en forma de hoja o panel. El revestimiento de lámina de cobre varía desde 1/3 a 5 Oz para tableros construidos y de doble cara. Prepregs están disponibles en forma de panel o panel, con estilos de vidrio que incluyen 106, 1080, 3313, 2116, y otras calificaciones prepregadas disponibles a pedido.