Comunicazione PCB ibrido ad alta frequenza

Structure and Composition

Base Plate and Layers

The high-frequency hybrid PCB splint includes a base plate, che è piegato e posizionato sul primo strato di filo interno, il primo strato di filo esterno, and the top surface of the solder mask ink layer from bottom to top in order. The positioning circuit layer, the second outer wire layer, and the bottom surface of the substrate are also part of this structure.

High-Frequency and Auxiliary Areas

The substrate includes a high-frequency area and an auxiliary area. The auxiliary area is fixed, while the inlay in the high-frequency area should be located at a fixed position.

Design and Features

Division of Areas

Il modello di utilità fornisce una stecca ibrida ad alta frequenza, che è diviso in due parti: un'area ad alta frequenza e un'area ausiliaria. This design provides mechanical support.

High-Frequency Materials

The high-frequency area is independently arranged, and only this area is made of high-frequency materials. This minimizes the use of high-frequency board materials while satisfying high-frequency signals, thereby reducing production costs.