Visão geral do produto
UGPCB apresenta o 6‑layer 2+N+2 HDI PCB (Modelo: 6L 2+n+2 hdi PCB). This high‑density interconnect placa de circuito impresso is engineered specifically for communication equipment. It uses ITEQ IT150 high‑performance laminate, combined with a second‑order HDI build‑up architecture, 2.5mil/2.5mil fine‑line trace and space, e 0.1mm laser microvias. These features deliver reliable interconnections for 5G base stations, high‑speed network switches, módulos ópticos, e aplicações semelhantes.
No PCB indústria, IDH (Interconexão de alta densidade) technology is the core enabler for shrinking component pitches and rising signal speeds. O 2+N+2 HDI PCB architecture represents the second‑order HDI category. It achieves an optimal balance among routing density, integridade do sinal, e custo de fabricação.
What Is a 2+N+2 HDI PCB?
Definition and Nomenclature
“2+N+2” is a standardized naming convention for HDI stack‑up structures. It is defined in theIPC‑2226 standard and is classified asTipo III within that system.
Breaking down the term:
- O first “2” means two sequential build‑up layers above the core.
- “N” stands for the number of core layers (here N=2, Ou seja,, two inner core layers).
- O second “2” means two sequential build‑up layers below the core.
Por isso, a 2+N+2 structure adds two build‑up layers on each side of the conventional core. These are constructed throughtwo sequential lamination cycles. This 6‑layer board therefore comprises: 2 outer build‑up layers + 2 inner core layers + 2 outer build‑up layers.
HDI Classification per IPC‑2226
The IPC‑2226 standard defines several HDI types based on microvia structures and build‑up layer counts:
| HDI Type | Estrutura | Build‑up Layers (por lado) | Minimum BGA Pitch | Aplicações Típicas |
|---|---|---|---|---|
| Tipo I | 1+N+1 | 1 camada | 0.5milímetros | Smartphones, mid‑density designs |
| Type II/III | 2+N+2 | 2 camadas | 0.4milímetros | Equipamento de rede, high‑performance computing |
| Tipo III / Elic | 3+N+3 and above | 3+ camadas | 0.3mm and below | Flagship smartphones, AI modules |
This product falls into the2+N+2 category. It features two build‑up layers per side, with microvias that can be arranged in eitherstacked or staggered configurações.
Especificações Técnicas Principais
| Parâmetro | Especificação |
|---|---|
| Modelo | 6L 2+n+2 hdi PCB |
| Material | ITEQ IT150 |
| Contagem de camadas | 6 camadas (2+N+2 second‑order HDI) |
| Cor da máscara de solda | Preto ou Branco (opcional) |
| Espessura da placa acabada | 1.0milímetros |
| Espessura de cobre da camada interna | 1 OZ (~35μm) |
| Espessura de cobre da camada externa | 0.5 OZ (~17.5μm) |
| Rastreamento Mínimo / Espaçamento | 2.5mil / 2.5mil (~63.5μm / ~63.5μm) |
| Minimum Mechanical Drill | 0.2milímetros |
| Minimum Laser Drill | 0.1milímetros |
| Acabamento superficial | Imersão Ouro + OSP |
| Aplicação Primária | Equipamento de comunicação |
Material Deep Dive: ITEQ IT150
Material Positioning
ITEQ IT150 é um medium‑Tg, halogen‑free, multifunctional epoxy laminado. It sits between standard FR-4 and high‑performance low‑loss materials. It delivers lead‑free process compatibility, good manufacturability, and cost‑effectiveness.
The IT150GS variant (within the IT150 family) is a medium‑Tg (Tg >150°C por DSC), halogen‑free, middle‑loss material. It offers high thermal reliability and excellent CAF resistance. It is specifically designed for server, armazenar, and networking applications.
Principais parâmetros de desempenho
Based on ITEQ official datasheets and IPC‑TM‑650 test methods:
| Propriedade | Método de teste | Valor típico | Unidade |
|---|---|---|---|
| Temperatura de transição vítrea (Tg) | DSC (IPC‑2.4.25) | 155 | °C |
| Temperatura de decomposição (Td, 5% perda de peso) | TGA (IPC‑2.4.24.6) | 365 | °C |
| CTE do eixo Z (a1, abaixo de Tg) | IPC‑2.4.24 | 35–40 | ppm/°C |
| CTE do eixo Z (a2, acima de Tg) | IPC‑2.4.24 | 220–240 | ppm/°C |
| X/Y‑axis CTE (40–125°C) | IPC‑2.4.41 | 11/13 | ppm/°C |
| Constante dielétrica (Dk) @ 1 GHz | IPC‑2.5.5.13 | 4.2–4,5 | - |
| Fator de dissipação (Df) @ 1 GHz | IPC‑2.5.5.13 | 0.010–0.018 | - |
| T288 Thermal Stress | IPC‑TM‑650 | >60 | Minutes |
| Absorção de umidade | IPC‑2.6.2.1 | 0.12 | % |
| Classificação inflamabilidade | UL94 | V-0 | Avaliação |
| UL MOT (Max Operating Temp) | - | 130 | °C |
Vantagens materiais
1. Lead‑Free Process Compatibility
Standard FR‑4 typically has a Tg around 130°C. ITEQ IT150 delivers155°C. Under lead‑free reflow peaks of260°C, this higher Tg provides superior dimensional stability. The material resists excessive Z‑axis expansion, which significantly reduces the risk of via barrel cracking and pad lifting during assembly.
2. Excelente resistência CAF
CAF (Filamento Anódico Condutivo) is a primary failure mode in PCBs. It occurs when electrochemical migration creates short circuits under humid and hot conditions. ITEQ IT150 offershigh CAF resistance (18eu / less than 100mil). This makes it especially suitable for long‑term outdoor deployment in communication infrastructure.
3. Halogen‑Free Compliance
ITEQ IT150 meetsJPCA‑ES‑01‑2003 halogen‑free standards. Chlorine (Cl) e bromo (irmão) content are each below 0.09% por peso. Total Cl+Br is below 0.15% (1500ppm).
Diretrizes de projeto
Stack‑Up Architecture
The 2+N+2 HDI PCB is manufactured throughsequential lamination:
- Core fabrication – Start with a double‑sided copper‑clad laminate. Etch inner layer circuits, perform mechanical drilling (0.2milímetros), and plate to create buried via connections.
- First build‑up – Apply prepreg and copper foil (or RCC) to both sides of the core. Execute the first lamination cycle.
- First laser drilling – Drill first‑order blind vias (laser holes at 0.1mm) and fill them with copper.
- Second build‑up – Apply additional dielectric layers and copper foil. Execute the second lamination cycle.
- Second laser drilling – Drill second‑order blind vias (0.1milímetros) and fill with copper.
- Outer layer circuits – Form outer layer circuits (trace/space 2.5mil) and apply the surface finish.
Essetwo‑sequential‑lamination process is precisely what the “2” in 2+N+2 signifies.
Fine‑Line Circuit Design
This product achieves 2.5mil/2.5mil (~63.5μm/63.5μm) trace width and spacing. This exceeds the Projeto HDI Level C (60‑99μm) defined in IPC‑2226. This fine‑line capability enables:
- 0.4mm pitch BGA breakout with ample routing channels.
- Flexible signal routing for high‑density componente colocação.
- Reduced layer count, which lowers overall PCB cost.
Tecnologia de Microvia
Este produto utiliza umhybrid drilling approach:
- Perfuração mecânica – Minimum diameter 0.2milímetros, used for through‑holes and buried vias in the core.
- Perfuração a laser – Minimum diameter 0.1milímetros (4mil) , used for blind vias in build‑up layers.
The 0.1mm laser microvia reduces via area by75% compared to a 0.2mm mechanical hole. This significantly frees up routing space. It is fundamental to achieving high‑density interconnect and enablingvia-in-pad designs for fine‑pitch BGAs.
Princípio Operacional
The 2+N+2 HDI PCB works through amulti‑layer interconnect architecture:
- Core‑layer interconnection – Buried vias, formed by perfuração mecânica + revestimento, connect signals between core layers.
- Build‑up interconnection – Blind vias, formed by perfuração a laser + revestimento, connect outer signal layers to inner layers.
- Full‑board through‑holes – After stack‑up completion, mechanical drilling penetrates all layers to create through‑holes.
- Signal transmission path – High‑speed signals travel from surface BGA pads → through laser blind vias into inner layers → across buried vias through the core → through laser blind vias on the opposite side to the bottom layer.
Essestepped interconnect structure shortens signal paths and reduces parasitic via effects. Como resultado, it preserves high‑speed signal integrity.
Vantagens de desempenho
Confiabilidade térmica
ITEQ IT150’sTd (decomposition temperature) reaches 365°C, which is well above the lead‑free reflow peak of 260°C. T288 thermal stress testingexceeds 60 minutos without delamination. This ensures material integrity through multiple reflow cycles.
Integridade do sinal
Em 1 GHz, ITEQ IT150 exhibits a dielectric constant Dk of approximately 4.2–4.5 and a dissipation factor Df of 0.010–0.018. As a “standard‑to‑mid‑loss” material, IT150 provides a compelling price‑performance ratio compared to ultra‑low‑loss materials. This makes it ideal for production‑ready communication equipment.
Força mecânica
ITEQ IT150 deliversflexural strength of 470–500 N/mm² in the warp direction and 400–430 N/mm² in the fill direction. This ensures structural integrity throughout assembly and field deployment.
Classificação do Produto
This product is classified across multiple dimensions:
| Classification System | Categoria |
|---|---|
| IPC‑2226 HDI Type | Type II/III (2+N+2, double build‑up per side) |
| HDI Order | Second‑order (2 laser drilling cycles + 2 lamination cycles) |
| Rigid/Flexible | PCB rígido |
| Contagem de camadas | 6placa multicamadas de ‑camadas |
| Sistema de Materiais | Medium‑Tg, halogen‑free, FR‑4‑compatible epoxy |
| Acabamento superficial | Imersão Ouro + OSP hybrid finish |
| Domínio do Aplicativo | Communication‑grade PCB |
Fluxo do Processo de Fabricação
UGPCB follows this production sequence for the 6‑layer 2+N+2 HDI PCB:
Etapa 1: Core Layer Fabrication
Material cutting → Inner layer dry film → Etching → AOI inspection → Brown oxide treatment
Etapa 2: First Build‑Up
Laminação (essencial + pré-impregnado + Folha de cobre) → First lamination → First‑order laser drilling (0.1milímetros) → Desmear → Electroless copper + plating → Circuit patterning
Etapa 3: Second Build‑Up
Second lamination → Second lamination → Second‑order laser drilling (0.1milímetros) → Desmear → Electroless copper + plating → Circuit patterning
Etapa 4: Outer Layer and Finishing
Perfuração mecânica (0.2mm through‑holes) → Electroless copper + plating → Outer layer circuits (2.5mil/2.5mil) → Solder mask → Immersion Gold + OSP surface finish → Electrical testing → Final inspection → Packaging and shipment
The entire process involvestwo lamination cycles and two laser drilling operations. This demands exceptional process control and precision.
Cenários de aplicação
This product is primarily designed forequipamento de comunicação:
5Infraestrutura de Comunicação G
- 5Estações base G (gNB) – RF front‑end and baseband processing units.
- High‑speed backplane interconnects for 5G network equipment.
- Enterprise‑grade routers and core switches.
High‑Speed Data Transmission
- 400G/800G optical modules – control and signal processing boards.
- High‑speed fiber‑optic switches.
- Transceptores ópticos.
Other High‑End Applications
- High‑performance servers and storage devices.
- AI inference/training accelerator cards.
- Advanced medical imaging equipment.
The 2+N+2 HDI structure is particularly well‑suited formoderate pin‑count, high‑density BGA roteamento. It enables complex signal interconnects within limited board space.
Por que escolher UGPCB?
UGPCB brings deep manufacturing expertise to HDI PCB production:
- Fine‑line capability – 2.5mil/2.5mil trace/space in volume production, meeting advanced HDI design requirements.
- Mature microvia process – 0.1mm laser via + 0.2mm mechanical drill hybrid solution with stable yield.
- Comprehensive material certification – Full qualification on ITEQ IT150 and other mainstream material systems.
- End‑to‑end process control – Every step from cutting to electrical testing strictly follows IPC‑6012 rigid PCB qualification and performance specifications.
- Communication industry track record – Extensive experience in 5G base station, optical module, and network equipment Fabricação de placas de circuito impresso.
Solicite um orçamento hoje
Whether you are designing high‑speed backplanes for 5G base stations or developing next‑generation optical modules, UGPCB’s 6‑layer 2+N+2 HDI PCB provides the reliable interconnect foundation your project deserves.
Declaração de fonte de dados
The technical data cited in this document comes from the following authoritative standards and sources:
- IPC‑2226 - Sectional Design Standard for High Density Interconnect (IDH) Quadros Impressos
- IPC‑6012E/F - Especificação de qualificação e desempenho para placas impressas rígidas
- IPC/JPCA‑2315 - Design Guide for High Density Interconnect Structures and Microvias
- ITEQ IT‑150 / IT‑150GS Official Datasheets and Material Specifications
- IPC‑TM‑650 – Test Methods Manual (including methods 2.4.4, 2.4.24, 2.4.24.6, 2.4.25, 2.5.5.13, 2.6.2.1, e outros)
- JPCA‑ES‑01‑2003 - Halogen‑Free Copper‑Clad Laminate Standard
- UL94 - Norma para Segurança de Inflamabilidade de Materiais Plásticos para Peças em Dispositivos e Eletrodomésticos
