PCB HDI (2+N+2) Características
Advanced BGA Capabilities
- For BGAs with smaller ball pitch and higher I/O count
High Routing Density
- Increase routing density in complex designs
Capacidade de folha
- Capacidade de folha (Further details may be needed to elaborate on this feature)
Superior Signal Transmission
- Lower Dk/Df material for better signal transmission performance
Enhanced Connectivity
- Copper filled vias
Aplicações
Eletrônicos de consumo
- Mobile phones
- PDAs (Personal Digital Assistants)
- UMPCs (Ultra-Mobile Personal Computers)
- Portable game consoles
- Digital cameras
- Filmadoras
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