Placa de circuito impressa em LED p2.9

Overview of the P2.9 LED Printed Circuit Board

The P2.9 LED Printed Circuit Board (PCB) is a specialized PCB designed for use with P2.9 LED modules, which are commonly used in high-resolution display applications. This PCB is ideal for creating large, seamless LED displays.

What is a P2.9 LED Printed Circuit Board?

A P2.9 LED Printed Circuit Board is a printed circuit board (PCB) specifically designed to accommodate and connect P2.9 LED modules. O termo “P2.9” refers to the pixel pitch of the LED module, which measures 2.9 millimeters between each pixel. This PCB ensures that the LED modules can be interconnected efficiently, providing a stable platform for the electronic components.

Requisitos de design

The design requirements for a P2.9 LED Printed Circuit Board are stringent to ensure its performance and reliability:

Material: SY1000-2 TG170 FR4, chosen for its excellent electrical and thermal properties.
Contagem de camadas: 6 layers to accommodate the necessary circuitry and signal integrity.
Cor: Preto/branco para fácil identificação e apelo estético.
Espessura Acabada: 1.0mm to provide structural integrity and durability.
Espessura do Cobre: 1OZ to ensure adequate conductivity and heat dissipation.
Tratamento de superfície: O ouro de imersão para melhorar a solda e a resistência à corrosão.
Traço mínimo e espaço: 4mil(0.1milímetros) Para suportar padrões de circuito fino.
Característica: More pads with small spacing to accommodate the dense layout of P2.9 LED modules.

Como funciona?

The P2.9 LED Printed Circuit Board works by providing a platform for various electronic components to be interconnected through conductive pathways. Esses caminhos, ou traços, são feitos de cobre e são gravados no quadro. The SY1000-2 TG170 FR4 material ensures that the PCB can withstand the demands of LED display applications, while the immersion gold surface treatment ensures that these traces remain conductive and resistant to corrosion.

Aplicações

The primary application of the P2.9 LED Printed Circuit Board is in high-resolution LED display systems where it manages and regulates the flow of electrical signals. Isso inclui:

Indoor and outdoor LED displays
Digital signage
Large format video walls
Event stages and concert screens

Classificação

Com base em seus recursos e aplicativos, the P2.9 LED Printed Circuit Board can be classified as a high-density, high-speed digital PCB designed for LED display applications. This classification highlights its capability to handle high-frequency signals and provide stable electrical connections.

Composição de materiais

The core material used in the P2.9 LED Printed Circuit Board is SY1000-2 TG170 FR4, a high-performance composite material known for its excellent mechanical, térmico, e propriedades elétricas. This material ensures that the PCB can withstand the demands of LED display applications.

Características de desempenho

The performance characteristics of the P2.9 LED Printed Circuit Board include:

Alta integridade do sinal
Baixa perda de sinal
Gerenciamento térmico superior
Força mecânica robusta
Estabilidade a longo prazo

Detalhes estruturais

The structural details of the P2.9 LED Printed Circuit Board are as follows:

Contagem de camadas: 6 camadas
Espessura Acabada: 1.0milímetros
Espessura do Cobre: 1OZ
Tratamento de superfície: Imersão Ouro
Traço mínimo e espaço: 4mil(0.1milímetros)
Característica: More pads with small spacing to accommodate the dense layout of P2.9 LED modules.

Recursos e benefícios

The key features and benefits of the P2.9 LED Printed Circuit Board include:

Interconectividade de alta densidade
Excelente integridade do sinal
Construção mecânica robusta
Desempenho confiável de longo prazo
Opções de cores estéticas (Preto/branco)

Processo de Produção

The production process of the P2.9 LED Printed Circuit Board involves several steps including:

Seleção de material: Choosing high-quality SY1000-2 TG170 FR4 material.
Empilhamento de camada: Organizando o 6 camadas com precisão.
Gravura: Removendo o excesso de cobre para formar os padrões de traços desejados.
Aplicação de máscara de solda: Applying a solder mask layer to protect the copper traces.
Revestimento: Aplicando tratamento de superfície de ouro de imersão.
Conjunto: Incorporando PTHs e Vias para interconexões de camada.
Teste: Garantir que o PCB atenda a todas as especificações de desempenho.