6L 1+N+1 HDI for Mobile Phone Main board PCB

ภาพรวมผลิตภัณฑ์

The 6L 1+N+1 HDI mobile mainboard is a high-density interconnect (HDI) แผงวงจรพิมพ์ (พีซีบี) designed for use in mobile devices. With its advanced design and construction, this mainboard offers superior performance and reliability for demanding mobile applications.

คำนิยาม

HDI stands for High-Density Interconnect, which refers to PCBs that have higher wiring density than traditional PCBs. ที่ “1+N+1” designation indicates the layer structure of the PCB, with one power layer, N signal layers, and one ground layer.

ข้อกำหนดการออกแบบ

The design of the 6L 1+N+1 HDI mobile mainboard must meet several key requirements:

• High signal integrity to support fast data transfer rates
• Low crosstalk and interference to ensure reliable communication
• Robust mechanical properties to withstand the stresses of daily use
• Thermal management to dissipate heat effectively

หลักการทำงาน

The 6L 1+N+1 HDI mobile mainboard operates by connecting various electronic components through a network of conductive pathways. These pathways are created using copper traces on the PCB layers, which are insulated from each other by layers of dielectric material. Electrical signals travel along these traces to perform the device’s functions.

Purpose and Applications

This type of mobile mainboard is commonly used in smartphones, แท็บเล็ต, and other portable electronic devices where space is limited but performance requirements are high. Its compact size and high functionality make it ideal for modern mobile technology.

การจำแนกประเภท

The 6L 1+N+1 HDI mobile mainboard falls under the category of high-end mobile mainboards due to its advanced features and construction. It is designed specifically for mobile applications requiring high performance and reliability.

วัสดุที่ใช้

The main material used for this mainboard is FR-4, a flame-resistant glass-epoxy laminate composite. This material provides excellent thermal stability and mechanical strength, making it suitable for high-performance mobile applications.

ลักษณะประสิทธิภาพ

• ความสมบูรณ์ของสัญญาณสูง: Ensures fast data transfer rates without loss or distortion.
• Low Crosstalk: Minimizes interference between adjacent signal traces.
• Robust Mechanical Properties: Withstands the physical stresses of daily use.
• Effective Thermal Management: Dissipates heat efficiently to prevent overheating.

Structure and Features

• Layer Structure: Consists of six layers with a configuration of 1+N+1, where N represents the number of signal layers.
• ความหนาของทองแดง: Inner layers have a thickness of 1 ออนซ์ (ออนซ์), while outer layers are 0.5 ออนซ์.
• การรักษาพื้นผิว: ทองแช่, which provides excellent solderability and corrosion resistance.
• Minimum Trace/Space: Capable of producing fine details with minimum trace widths and spaces of 3 MIL.
• Hole Types: Mechanically drilled holes as small as 0.2 mm and laser-drilled holes as fine as 0.1 มม.

กระบวนการผลิต

The manufacturing process for the 6L 1+N+1 HDI mobile mainboard involves several stages:

1. การเตรียมวัสดุ: Selection of high-quality FR-4 substrates.
2. การซ้อนชั้น: Arranging the layers in the desired order.
3. การแกะสลัก: Removing excess copper to create the desired circuit pattern.
4. การชุบ: Applying a thin layer of metal to the exposed copper areas.
5. การรักษาพื้นผิว: Applying immersion gold for enhanced solderability.
6. การประกอบ: Mounting components onto the mainboard.
7. การทดสอบ: Conducting thorough electrical and functional tests to ensure quality.
8. การตรวจสอบขั้นสุดท้าย: Visual and automated optical inspection to check for defects.
9. การบรรจุหีบห่อ: Safely packaging the finished product for shipment.

ใช้สถานการณ์กรณี

• อุปกรณ์อิเล็กทรอนิกส์สำหรับผู้บริโภค: สมาร์ทโฟน, แท็บเล็ต, สมาร์ทวอทช์, ฯลฯ.
• Wearable Devices: ติดตามฟิตเนส, health monitors, ฯลฯ.
• อุปกรณ์อิเล็กทรอนิกส์ยานยนต์: In-car entertainment systems, navigation units, ฯลฯ.
• Industrial Applications: Control panels, sensor interfaces, ฯลฯ.

โดยสรุป, the 6L 1+N+1 HDI mobile mainboard is an advanced PCB designed specifically for high-performance mobile applications. Its robust construction, superior signal integrity, and efficient thermal management make it an ideal choice for modern mobile technology.