โลโก้ UGPCB
Power the Future of Computing: UGPCB’s High-Performance Server PCB Solutions
In today’s rapidly evolving landscape of data centers, ปัญญาประดิษฐ์, and cloud computing, server performance and stability are pivotal to digital efficiency. As the fundamental hardware bedrock, the quality of Server แผงวงจรพิมพ์ (PCBS) is paramount. Leveraging deep technical expertise, UGPCB provides professional, customized, high-performance server PCB manufacturing and พีซีบี (ชุดประกอบแผงวงจรพิมพ์) one-stop solutions.
1. ภาพรวมผลิตภัณฑ์ & คำนิยาม
A Server PCB is a complex, multi-layer circuit board specifically engineered for server-class products. Its critical mission is to host core components like CPUs, หน่วยความจำ, high-speed buses, and power modules while ensuring stable signal transmission at speeds of tens of Gbps and beyond. It is not merely a physical connection platform but the core element guaranteeing the system’s signal integrity, ความสมบูรณ์ของพลังงาน, and thermal performance.
The specifications you provide (ความหนาของบอร์ด: 2.8mm ±10%, 22 เลเยอร์, 2/1 oz Copper Weight, 0.1/0.1 mm Trace/Space) define a typical high-layer-count, ความหนาแน่นสูง, high-speed server PCB. It is suitable for critical applications in mid-to-high-end dual-processor or AI server motherboards, accelerator cards, and backplanes.
2. Design Essentials & Key Technologies
The success of such advanced การออกแบบ PCB hinges on mastering a range of cutting-edge technologies:
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Stack-up & การควบคุมความต้านทาน: The complex 22-layer stack-up requires precise calculation to achieve strict การควบคุมความต้านทาน (typically 50Ω single-ended, 100Ω differential), forming the cornerstone of การออกแบบ PCB ความเร็วสูง.
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การขุดเจาะหลัง: This critical process removes the unused copper stub from high-speed signal vias (เช่น, for PCIe, DDR buses), significantly reducing signal reflection and attenuation, and is central to enhancing signal integrity.
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High-Speed Laminate Application: We utilize premium high-speed materials like IT-968G & IT-180A from ITEQ. Their low dissipation factor (ฟ) and stable dielectric constant (ดีเค) ensure signal purity and low latency. A high Glass Transition Temperature (ทีจี >170องศาเซลเซียส) guarantees material reliability under the prolonged high-temperature operation of servers.
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มูลนิธิฯ (Reverse Treated Foil) ทองแดง: Its smoother surface profile effectively reduces “skin effect” losses for high-frequency signals on the conductor surface, further enhancing high-speed performance.
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Any-Layer HDI & Hybrid Construction: Supports high-density routing. Combined with hybrid construction techniques, it allows the use of different performance materials in localized areas (เช่น, high-current power zones vs. high-speed signal zones) to meet specific circuit requirements.
3. ผลงาน & คุณสมบัติเชิงโครงสร้าง
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Exceptional Electrical Performance: Extremely low signal loss and excellent impedance consistency meet the demands of high-speed protocols like PCIe 4.0/5.0 and DDR4/DDR5.
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Ultra-High Reliability: เห็นด้วย (ทองคำแช่นิเกิลแบบไม่ใช้ไฟฟ้า) surface finish provides a flat soldering surface and superior oxidation resistance, ensuring long-term connection reliability. The 10oz thick inner copper cores (combined with the 2/1oz design) offer robust current-carrying capacity and thermal pathways for power layers.
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Precision Manufacturing Capability: ที่ 0.1/0.1 mm trace/space and a minimum finished hole diameter of 0.25mm demonstrate UGPCB’s top-tier expertise in high-precision การผลิต PCB.
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Robust Thermal Management: The 2.8mm thick board structure, combined with thick copper design, provides excellent thermal dissipation, aiding overall system cooling.
4. กระบวนการผลิต & การควบคุมคุณภาพ
UGPCB’s server การผลิต PCB follows a stringent, automotive electronics-grade quality control protocol: Material Inspection → Inner Layer Imaging → Precision Lamination → Laser/Mechanical Drilling → Back Drilling → Copper Deposition & Plating → Outer Layer Imaging → Solder Mask → Surface Finish (เห็นด้วย) → Electrical Test (Flying Probe/Dedicated Fixture) → Final Inspection. Each stage is supported by high-speed signal testing, Aoi (การตรวจสอบด้วยแสงอัตโนมัติ), และอีกมาก, ensuring every delivered PCB meets design specifications.
5. สถานการณ์การใช้งาน & Technical Classification
This high-performance server PCB is widely used in:
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เซิร์ฟเวอร์ AI & GPU Accelerator Cards: For processing massive parallel computing tasks.
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Cloud Computing Data Center Servers: As core compute nodes.
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High-End Storage Servers: For high-speed data storage and exchange.
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Network Switching Equipment: Core routing and switching motherboards.
Scientific Classification:
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By Layer Count: High Multi-layer Board (22 เลเยอร์)
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By Technology: High-Speed/High-Frequency PCB, Back-Drilled PCB, Heavy Copper PCB, การเชื่อมต่อระหว่างกันที่มีความหนาแน่นสูง (HDI) พีซีบี
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โดยการสมัคร: Data Center/Server-Dedicated PCB
