10-Fabricante de PCB ENIG de capa | Tableros de cobre de alta densidad de 2OZ-3OZ

What is a 10Layers ENIG Board?

A 10-layer ENIG (Oro de inmersión de níquel químico) board is an advanced multilayer printed circuit board (tarjeta de circuito impreso) with ten layers of conductive material, típicamente cobre, separados por capas aislantes. El “ACEPTAR” refers to the surface treatment applied to the copper traces, which involves electroless nickel and immersion gold plating. Este tipo de tarjeta de circuito impreso is designed for high-density and complex electronic applications.

Requisitos de diseño

Designing a 10-layer ENIG board involves several key considerations:

• Material: Made from TU-768, a high-performance composite material known for its excellent electrical properties and durability.
• Recuento de capas: Consists of ten layers, allowing for intricate and dense circuit designs.
• Espesor de cobre: Ranges from 2OZ to 3OZ, providing robust conductivity for high-power applications.
• Tratamiento superficial: Features immersion gold plating, which offers excellent solderability and corrosion resistance.
• Traza y espacio: Minimum trace and space are set at 3mil (0.075milímetros), enabling fine details in the circuit design.

¿Cómo funciona??

The 10-layer ENIG board functions by providing multiple layers of conductive pathways, separados por capas aislantes, to interconnect electronic components. The immersion gold surface treatment ensures reliable soldering and long-term protection against oxidation and wear.

Aplicaciones

Due to their complexity and reliability, 10-layer ENIG boards are widely used in various high-end electronic applications including:

• Sistemas aeroespaciales y de defensa.
• High-speed networking equipment
• Advanced telecommunication devices
• Equipo de imágenes médicas

Clasificación

10-layer ENIG boards can be classified based on several factors:

• Por material: Most commonly made from TU-768 due to its balance of cost, fortaleza, y propiedades electricas.
• By Copper Thickness: Varies from lightweight (2ONZ) to heavyweight (3ONZ) depending on the application’s needs.
• Por tratamiento superficial: Features immersion gold plating, which provides excellent solderability and corrosion resistance.

Materiales utilizados

The primary materials used in manufacturing 10-layer ENIG boards include:

• TU-768: Un laminado epoxi reforzado con vidrio que proporciona excelente resistencia mecánica y estabilidad térmica..
• Cobre: Utilizado para las capas conductoras., con espesor que varía según los requisitos de diseño.
• Máscara de soldadura: Typically green or white, protege las trazas de cobre de la oxidación y de cortocircuitos accidentales.
• Oro de inmersión: Applied as a surface treatment to improve solderability and protect against corrosion.

Características de rendimiento

Key performance attributes of a 10-layer ENIG board include:

• Densidad alta: Allows for more componentes to be packed into a smaller area.
• Fiabilidad: The use of multiple layers reduces the risk of electrical shorts and improves signal integrity.
• Integridad de señal: Mejorado debido a rutas de señal más cortas y diafonía reducida.

Composición estructural

Estructuralmente, a 10-layer ENIG board comprises:

• Capas conductoras: Hecho de cobre, grabado en los patrones de circuito deseados.
• Capas aislantes: Evite cortocircuitos eléctricos entre capas conductoras.
• Plated Through-Hole Vias: Facilitate connections between different layers.

Características distintivas

Some notable features of a 10-layer ENIG board are:

• Paso fino: Allows for high-density interconnects making it ideal for compact devices.
• Robustez: The use of multiple layers provides a strong mechanical bond between the board and components.
• Versatilidad: Adecuado para una amplia gama de aplicaciones gracias al número de capas personalizable y a la elección de materiales.

Proceso de producción

The manufacturing process of a 10-layer ENIG board involves several steps:

1. Diseño y diseño: Usar software especializado para crear el patrón del circuito..
2. Preparación de material: Cortar materiales base a medida y limpiar superficies..
3. Laminación: Apilar y unir capas individuales bajo calor y presión..
4. Aguafuerte: Eliminar el exceso de cobre para formar las rutas de circuito deseadas..
5. Enchapado: Agregar una fina capa de metal a las vías y áreas de cobre expuestas.
6. Aplicación de máscara de soldadura: Applying the green or white coating to protect traces.
7. Tratamiento superficial: Applying immersion gold for solderability and corrosion resistance.
8. Inspección final: Garantizar la calidad y la funcionalidad antes del envío.

Casos de uso

Common scenarios where a 10-layer ENIG board might be employed include:

• High-density interconnect applications in aerospace and defense systems.
• Sistemas de comunicación avanzados que requieren baja pérdida de señal.
• Instrumentos médicos portátiles que necesitan un rendimiento confiable en entornos hostiles.
• Electrónica automotriz que exige robustez y longevidad.

En resumen, the 10-layer ENIG board represents a significant advancement in printed circuit board technology offering unparalleled complexity and performance for modern electronic applications Its design flexibility combined with superior signal integrity and durability makes it an essential component in the development of next-generation high-end electronics and beyond