36-PCB de plano posterior TG de capa alta TG - Alta densidad & Solución resistente a la alta temperatura

Overview of the 36-Layer High TG Backplane PCB

The 36-Layer High TG Backplane PCB is a high-density, multilayer printed circuit board (tarjeta de circuito impreso) designed for backplane applications. Este tarjeta de circuito impreso is ideal for complex electronic systems that need to manage high power and signal integrity.

What is a 36-Layer High TG Backplane PCB?

A 36-Layer High TG Backplane PCB is a printed circuit board (tarjeta de circuito impreso) con 36 layers of conductive material separated by insulating layers, specifically designed for backplane applications. El término “High TG” refers to the glass transition temperature, indicating the PCB’s ability to withstand high temperatures without losing its mechanical and electrical properties.

Requisitos de diseño

The design requirements for a 36-Layer High TG Backplane PCB are stringent to ensure its performance and reliability:

Material: Alto tg fr4, chosen for its excellent electrical and thermal properties.
Recuento de capas: 36 layers to accommodate complex and dense circuit designs.
Color: Green/White for easy identification and aesthetic appeal.
Espesor terminado: 2.4mm to provide structural integrity and durability.
Espesor de cobre: 1OZ to ensure adequate conductivity and heat dissipation.
Tratamiento superficial: Oro de inmersión para mejorar la soldabilidad y la resistencia a la corrosión..
Minimum Trace and Space: 4mil(0.1milímetros) to support fine circuit patterns.
Característica: Alta multicapa, Panasonic M6 PCB material, known for its high reliability and performance.

¿Cómo funciona??

The 36-Layer High TG Backplane PCB works by providing a platform for various electronic components to be interconnected through conductive pathways. These pathways, or traces, are made of copper and are etched onto the board. The high TG FR4 material ensures that the PCB can withstand high temperatures without losing its mechanical and electrical properties, while the immersion gold surface treatment ensures that these traces remain conductive and resistant to corrosion.

Aplicaciones

The primary application of the 36-Layer High TG Backplane PCB is in backplane applications where it manages and regulates the flow of electrical signals. This includes:

Data communication devices
Equipo de red
Industrial control systems
Infraestructura de telecomunicaciones

Application of High-Tg Backplane PCBs in 5G Communications

Clasificación

Según sus características y aplicaciones., the 36-Layer High TG Backplane PCB can be classified as a high-speed digital PCB designed for backplane applications. This classification highlights its capability to handle high-frequency signals and provide stable electrical connections.

Composición de materiales

el núcleo material used in the 36-Layer High TG Backplane PCB is High TG FR4, a high-performance composite material known for its excellent mechanical, térmico, y propiedades electricas. This material ensures that the PCB can withstand the demands of backplane applications.

Características de rendimiento

The performance characteristics of the 36-Layer High TG Backplane PCB include:

Alta integridad de la señal
Pérdida de señal baja
Gestión térmica superior
Robust mechanical strength
Long-term stability

Detalles estructurales

The structural details of the 36-Layer High TG Backplane PCB are as follows:

Recuento de capas: 36 capas
Espesor terminado: 2.4milímetros
Espesor de cobre: 1ONZ
Tratamiento superficial: Oro de inmersión
Minimum Trace and Space: 4mil(0.1milímetros)
Característica: Alta multicapa, Panasonic M6 PCB material

Características y beneficios

The key features and benefits of the 36-Layer High TG Backplane PCB include:

Interconectividad de alta densidad
Excelente integridad de la señal
Construcción mecánica robusta
Rendimiento confiable a largo plazo
Opciones de color estético (Verde/Blanco)

Proceso de producción

The production process of the 36-Layer High TG Backplane PCB involves several steps including:

Selección de material: Choosing high-quality High TG FR4 material.
Apilamiento de capas: arreglando el 36 capas con precisión.
Aguafuerte: Eliminar el exceso de cobre para formar los patrones de traza deseados..
Aplicación de máscara de soldadura: Applying a solder mask layer to protect the copper traces.
Enchapado: Aplicando el tratamiento de la superficie de oro de inmersión.
Asamblea: Incorporación de PTH y vías para interconexiones de capas..
Pruebas: Garantizar que la PCB cumpla con todas las especificaciones de rendimiento.