UGPCB LOGO
Characteristics of SI10U
SI10U is characterized by its low coefficient of thermal expansion (CTE) and high modulus, which can effectively reduce the warpage of packaging substrates. It also boasts excellent heat and humidity resistance, good PCB processability, and is made from halogen-free materials.
Application Areas for SI10U
The application areas for SI10U include eMMC, DRACMA, AP, Pensilvania, Dual CM, Huella dactilar, and RF Module.
Specifications of SI10U
| Items | Conditions | Unidad | SI10U(S) |
|---|---|---|---|
| tg | DMA | grado Celsius | 280 |
| td | 5% WT. pérdida | grado Celsius | >400 |
| CTE (Eje x/y) | Before Tg | PPM/Grado Celsius | 10 |
| CTE (Eje Z) | A1/a2 | PPM/Grado Celsius | 25/135 |
| Constante dieléctrica (1GHz) | – | – | 2.5.5.9 |
| Factor de disipación (1GHz) | – | – | 2.5.5.9 |
| Fuerza de pelado | 1/3 ONZ, VLP con | N/mm | 0.80 |
| Soldadura de soldadura | @288 grados Celsius | mín. | >=30 |
| Módulo de Young | 50 grado Celsius | GPA | 26 |
| Módulo de Young | 200 grado Celsius | GPA | 23 |
| Módulo de flexión (50 grado Celsius) | GPA | 32 | |
| Módulo de flexión (200 grado Celsius) | GPA | 27 | |
| Absorción de agua (A) | % | 0.14 | |
| Absorción de agua (85 Grado Celsius/85%RH,168Hora) | % | 0.35 | |
| Inflamabilidad | UL-94 Rating | V-0 | |
| Conductividad térmica | W/(M.K) | 0.61 | |
| Color | – | Negro |
Production Capabilities
UGPCB company has matured to use SI10U to produce IC Substrate boards in batches.
