표준 PCB 제조 기능

Precision Circuit Imaging & Etching Technology

UGPCB Factory demonstrates exceptional process control in circuit patterning and etching. For standard PCB production, we consistently achieve:

• 레이저 직접 이미징 (LDI) replacing traditional photolithography masks, enabling digital file-based exposure with ±5μm alignment accuracy
• Alkaline etching process ensuring clean line edges with ±15% line width control (industry-leading tolerance)
• Expertise in handling various copper thicknesses (1온스-6온스) with minimized side-etching

High-Precision Drilling & Hole Metallization

Our drilling capabilities cover:

• Mechanical drilling for 0.4mm-3.0mm boards with ±0.025mm hole size tolerance
• 레이저 드릴링 down to 0.1mm microvias
• Hole metallization 달성 >20μm uniform copper plating through advanced chemical deposition and electroplating
• Special processes for 8:1 에게 10:1 aspect ratio requirements

Multilayer Lamination & Interlayer Alignment

• Up to 100-layer PCB fabrication using FR-4 Grade A materials
• Precision lamination with ±0.05mm layer-to-layer alignment
• Temperature/pressure/time-controlled processes preventing delamination
• Options for high-Tg materials, high-speed laminates, and heavy copper up to 1000μm

솔더 마스크 & Surface Finish Options

• Solder mask colors: Green/Blue/Red/Black with 0.08mm minimum solder bridge
• Surface finishes:
  1. HASL (열기 솔더 레벨링)
  2. 동의하다 (무전해 니켈 침지 금)
  3. Immersion Tin/Silver
  4. OSP (유기 용해성 보존)

Comprehensive QC & Testing Systems

• AOI 검사: High-resolution defect detection for line/space, 패드, shorts/opens
• 임피던스 제어: ±10% tolerance for high-speed/RF applications
• 전기 테스트: 플라잉 프로브 & fixture-based continuity verification
• Reliability Testing: 열 충격, humidity resistance, flexural testing

Process Capability & 안정

• CPK >1.33 (4에이) across critical processes, reaching 1.67 (5에이) in key areas
• Line width control within ±15% (vs industry 20% 기준)
• Statistical process control (SPC) ensuring consistent production quality

PCBA One-Stop Services

• SMT 어셈블리: 01005 component handling with ±0.03mm placement accuracy
• 고급 포장: BGA/Micro BGA/PoP support with X-ray inspection
• DFM Support: Impedance calculation, stack-up design, manufacturability analysis

산업 응용 & 연락하다

Serving consumer electronics, industrial controls, 통신, 의료기기, and automotive sectors with tailored PCB solutions. Visit our website for process capability reports and free DFM consultation.