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Semiconductor Test PCB - UGPCB

Semiconductor Test PCB

Technological Leadership: Redefining Standards in Semiconductor Test PCBs

With over a decade of expertise in semiconductor testing, UGPCB specializes in delivering high-precision PCB solutions for wafer-level testing, package testing, and system-level validation. Our products, including probe card interface boards, ATE load boards, and burn-in test carriers, set industry benchmarks:

  • Ultra-High-Density Interconnects: 58-layer stack-ups, 3/3mil trace/space, 0.8mm BGA pitch for 3nm process testing

  • Extreme Environmental Stability: FR4 Tg185 substrates withstand -55°C to +185°C with 1,000 thermal shock cycles

  • Signal Integrity Assurance: ±3% differential impedance control, <-55dB crosstalk @10GHz for 6G/Wi-Fi7 applications

Core Advantages: Full-Chain Technological Breakthroughs

1. High Aspect Ratio Processing

Our hybrid laser-mechanical drilling achieves 23.4:1 aspect ratio vias with ≤15μm wall roughness. Combined with magnetron-sputtered PVD and pulse plating, resistance variation remains <2% after 10,000 insertion cycles.

2. Intelligent Thermal Architecture

  • Embedded microchannel cooling reduces thermal resistance by 40%

  • 500+ thermal vias per square inch

  • Dynamic thermal compensation maintains ±1°C uniformity

3. Reliability Certification
Certified through:

  • JEDEC JEP183 standard (MTTF >150,000 시간)

  • AQG324 automotive vibration testing

  • Bipolar degradation tests for SiC/GaN devices

응용: Full Lifecycle Semiconductor Testing

Test Phase Key Products Technical Highlights
Wafer-Level Testing Probe Card Interface Boards Supports 6″/8″ wafer parallel testing
Package Testing Burn-In Test Carriers Triple-protection circuit design
System Validation Power Module Test Backplanes 300A pulse current capacity
Automotive Compliance AEC-Q200 Test Modules ISO 26262 functional safety certified

Smart Manufacturing: Industry 4.0-Driven Precision

UGPCB’s Fuzhou production base features fully automated PCB lines:

  • Design-Production Integration: EDA-to-LDI direct data transfer (±5μm alignment)

  • 실시간 모니터링: 3D X-ray inspection with >99.99% defect detection

  • Sustainable Practices: 98.5% copper recovery rate, EHS Tier-4 wastewater treatment

Client Success Stories

  • AI Chip Testing: Custom 80-layer ATE load boards enabled 10,000+ parallel channels, boosting yield to 99.95%

  • Automotive SiC Validation: 1700V-rated test carriers facilitated ISO/TS 16949 인증

Take Action

연락하다 sales@ugpcb.com for instant quotes or technical consultations.

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