50-레이어는 프로브 카드 PCB를 먹었습니다

Introduction to UGPCB’s ATE Probe Card PCB

UGPCB’s 50-layer ATE (자동 테스트 장비) Probe Card PCB is a precision-engineered solution designed for high-frequency semiconductor testing. It enables accurate signal transmission between test equipment and integrated circuits (ICS), ensuring reliable performance in mission-critical environments.

Key Technical Specifications

• 레이어 수: 50 레이어

• 두께: 198 밀

• 재료: FR4 HTg (High-Temperature Glass Epoxy)

• 최소 구멍 크기: 5 밀

• BGA 간격: 0.35mm

• 종횡비: 40:1

• 드릴-카퍼 거리: 3 밀

• POFV (채워진 위에 도금되었습니다): 예

• 표면 마감: 에그 (Electroless Nickel Electroless Gold)

Design and Structural Innovations

Critical Design Features

1. High-Density Interconnects: The 50-layer architecture supports ultra-fine routing for BGA components with a 0.35mm pitch, essential for modern IC testing.

2. Advanced Material: FR4 HTg ensures thermal stability (Tg ≥ 180°C), preventing deformation during high-power testing cycles.

3. 정밀 드릴링: 에이 40:1 aspect ratio and 5 mil microvias enable reliable signal paths in tightly spaced layouts.

4. POFV 기술: Filled and plated vias enhance mechanical strength and thermal dissipation, critical for prolonged testing operations.

Structural Advantages

• Ultra-Short Drill-to-Copper Distance: 3 mil spacing minimizes signal loss and crosstalk.

• ENEG Surface Finish: Provides exceptional oxidation resistance and stable contact surfaces for probe needles.

Performance and Functional Applications

운영 원리

The PCB routes electrical signals between test probes and ICs with minimal latency. The FR4 HTg substrate maintains dielectric consistency under thermal stress, while POFV ensures uninterrupted connectivity in high-vibration environments.

핵심 성과 지표

• Thermal Endurance: Stable performance at temperatures up to 180°C.

• 신호 무결성: Controlled impedance (±8%) and low insertion loss (<0.5dB).

• Mechanical Durability: Resists delamination during 10,000+ test cycles.

1 차 사용 사례

• Semiconductor Testing: Validates logic chips, 메모리 모듈, and processors in ATE systems.

• Aerospace Electronics: Used in avionics testing rigs requiring ultra-reliable PCBs.

• 5G and IoT Device Production: Ensures signal accuracy in high-frequency RF component testing.

• Automotive IC Validation: Deployed in ADAS and ECU testing workflows.

생산 프로세스 및 품질 보증

제조 워크 플로

1. Material Cutting: FR4 HTg laminates are precision-cut to required dimensions.

2. 레이저 드릴링: Achieves 5 mil holes with a 40:1 aspect ratio using CO₂ lasers.

3. Plating and Via Filling: POFV technology reinforces vias with copper plating.

4. Layer Alignment: 50-layer stackup is bonded under high pressure and temperature.

5. 표면 처리: ENEG coating is applied for corrosion resistance.

6. Rigorous Testing: Includes electrical continuity checks, impedance testing, and thermal cycling validation.

Quality Standards

• IPC-6012 클래스 3 규정 준수: Guarantees reliability for harsh industrial applications.

• 100% 자동 광학 검사 (AOI): Detects micro-defects in high-density layouts.

Summary of Competitive Advantages

• Ultra-High Density: Supports miniaturized IC testing with 0.35mm BGA spacing.

• 열 탄력성: FR4 HTg ensures stability in extreme conditions.

• Industry-Leading Precision: 5 mil microvias and 3 mil drill-to-copper spacing.

• Broad Compatibility: Compatible with major ATE platforms like Teradyne and Advantest.

This PCB combines cutting-edge engineering, stringent quality controls, and specialized materials to meet the demands of next-generation semiconductor testing.