62-레이어는로드 PCB 보드를 먹었습니다

Overview of the 62-Layer ATE Load PCB

The 62-Layer ATE Load PCB is a high-performance, ultra-high-density 인쇄 회로 기판 engineered for Automated Test Equipment (먹었다) 시스템. Designed to handle complex signal routing and high-power loads, it meets rigorous testing requirements in semiconductor manufacturing and advanced electronics validation.

Key Definition

An ATE Load PCB is a specialized circuit board that simulates real-world operating conditions for testing integrated circuits (ICS) 그리고 electronic components. The 62-layer configuration supports intricate signal paths, power distribution, and thermal management in compact designs.

Critical Design Parameters

• 레이어 수: 62 layers for multi-domain signal isolation and power plane optimization.

• 치수: 16.9″ × 22.9″ (large format for multi-device integration).

• 두께: 250 밀 (balances rigidity and thermal dissipation).

• 재료: FR4 HTg (high-temperature glass epoxy for stability up to 180°C).

• 최소 구멍 크기: 8 밀 (supports high-density interconnects).

• BGA Pitch: 0.65mm (enables fine-pitch component mounting).

• 종횡비: 32:1 (ensures reliable plating in microvias).

• Drill-to-Copper: 7 밀 (prevents short circuits).

• POFV & Back-Drilling: Eliminates signal distortion in high-frequency applications.

• 표면 마감: 에그 (Electroless Nickel Electroless Gold for corrosion resistance).

Core Functionality

그만큼 PCB routes test signals between ATE systems and devices under test (DUTs), ensuring accurate voltage/current measurements. Back-drilling removes unused via stubs to minimize signal reflections, while POFV (Plated Over Filled Vias) enhances thermal conductivity and structural integrity.

기본 응용 프로그램

• Semiconductor Testing: Validates ICs, CPU, and memory modules.

• 항공우주 & Defense: Mission-critical avionics and radar systems.

• Telecom Infrastructure: High-speed data transmission equipment.

• 의료 기기: Precision diagnostic and imaging tools.

Material Advantages

FR4 HTg provides:

• 열 탄력성: Stable performance under cyclic thermal stress.

• 낮은 유전체 손실: Critical for high-frequency signal integrity.

• 기계적 강도: Resists warping during multilayer lamination.

구조적 특징

• Hybrid Stackup: Combines high-speed, power, and ground layers.

• 마이크로 비아 기술: Laser-drilled microvias (8 밀) enable dense interlayer connections.

• Controlled Impedance Traces: Minimizes crosstalk in 0.65mm BGA layouts.

Performance Highlights

• 신호 무결성: <3% insertion loss at 10 GHz.

• Power Handling: Supports 20A per power plane.

• 열 관리: 1.2 W/mK thermal conductivity via POFV.

제조 워크 플로

1. Material Prep: Cut FR4 HTg cores and prepreg sheets.

2. 레이저 드릴링: Create 8-mil microvias with ±1 mil tolerance.

3. 도금 & POFV: Electroplate vias and fill with conductive epoxy.

4. Back-Drilling: Remove excess via stubs using depth-controlled drills.

5. 라미네이션: Press 62 layers under high temperature/pressure.

6. 표면 마감: Apply ENEG for solderability and oxidation resistance.

7. 테스트: Validate impedance, continuity, and thermal cycling.

Ideal Use Cases

• High-Frequency ATE Systems: Tests 5G RF components and millimeter-wave devices.

• Multi-Site Testing: Parallel validation of 16+ DUTs on a single board.

• Harsh Environments: Oil/gas exploration sensors and automotive ECU testing.