TG150 PCB | High-Tg 4-Layer Immersion Gold Circuit Board | 0.08mm Fine Line Specialist

TG150 PCB Circuit Board 소개: Meeting the Thermal Challenge in Modern Electronics

In high-speed communications, 자동차, 항공우주, and advanced industrial controls, electronic devices face increasingly harsh operating environments. Elevated temperatures can cause standard PCB 기판 (예를 들어, standard FR-4) to reach their glass transition, leading to softening, 흉한 모습, and critical performance loss, jeopardizing system reliability. Selecting a 하이 -Tg 인쇄 회로 기판 is essential for ensuring long-term stability in these demanding applications.

1. 제품개요: What is a TG150 PCB?

에이 TG150 PCB is a 인쇄 회로 기판 fabricated using a laminate material with a glass transition temperature (Tg) 150°C. The Tg is a crucial metric for a PCB substrate’s thermal endurance. Compared to common TG130 PCB laminates, TG150 material maintains superior physical rigidity and stable electrical properties under high temperatures. UGPCB 4-layer TG150 circuit board combines this high-performance material with an 이머젼 골드 (동의하다) 표면 마감 and supports 0.08mm fine-line circuitry 그리고 0.2mm micro-drilling, making it a high-reliability 다층 PCB 해결책 for advanced applications.

2. Core Material and Enhanced Performance of TG150 PCB

• 기본 재료: A high-performance epoxy or modified FR-4 formulation, specially engineered to consistently achieve a Tg of 150°C or higher.

• Key Performance Advantages (대. TG130 PCBs):

  • Exceptional Thermal Stability: The increase from 130°C to 150°C Tg significantly enhances the board’s resistance to deformation at high temperatures, improving its ability to withstand high-temperature assembly processes like lead-free soldering.

  • Superior Moisture and Chemical Resistance: A denser molecular structure reduces moisture absorption in humid environments, minimizing losses in insulation resistance (IR) 신호 무결성, while offering better resistance to chemical exposure.

  • Improved Mechanical Strength and Dimensional Stability: High Tg PCBs exhibit lower Z-axis expansion coefficients and stronger bond strength during thermal cycling, reducing risks like via cracking and delamination.

  • Stable Electrical Characteristics: 유전 상수 (DK) 그리고 소산 인자 (Df) remain more stable at elevated operating temperatures, ensuring higher signal integrity for 고주파 PCB.

3. Structure and Design Specifications of Our TG150 PCB

PCB Stack-up

This product is a standard 4-층 PCB 보드. A typical stack-up is 신호 레이어 – 접지 비행기 – 파워 평면 – 신호 레이어, providing a complete return path for high-speed signals and effective EMI control.

Key Design Capabilities & 명세서

Minimum Trace Width/Space: 0.08mm / 0.1mm. This represents advanced fine-line PCB 제조 capability, essential for routing high-density ICs (예를 들어, BGA packages).

드릴 직경: 0.2mm. 지원합니다 micro-via drilling, facilitating higher density interconnects and saving board space.

표면 마감: 이머젼 골드 (동의하다). Provides a flat surface, excellent solderability, and long shelf life, ideal for fine-pitch components (예를 들어, MFF, BGA).

4. Manufacturing Process and Quality Control

UGPCB TG150 PCB manufacturing process strictly adheres to international standards like IPC-6012 (Qualification and Performance Specification for Rigid PCBs). The process includes:
Material Preparation → Inner Layer Imaging → Etching → Lamination → Drilling (0.2mm) → 디스미어 & Plating → Outer Layer Imaging → Pattern Plating → Etching → Solder Mask Application → ENIG Surface Finish → Routing → Electrical Testing → Final Inspection.
At each stage, we employ advanced equipment (예를 들어, LDI imaging, AOI 검사) and rigorous reliability testing (예를 들어, 열 응력, ionic contamination) to ensure the quality of every high-Tg circuit board.

5. Product Classification and Typical Applications

1. 기술 분류:

   • By Tg: Mid-High Tg PCB (Tg ≥ 150°C).

   • 레이어 수에 의해: 다층 PCB (4-Layer Board).

   • 기술 별: Precision PCB (HDI-ready capability).

   • By Finish: ENIG PCB, Fine-Line PCB.

2. Ideal Application Scenarios:

   • 자동차 전자: 엔진 제어 장치 (씌우다), 인포테인먼트 시스템, power management modules – requiring tolerance under-hood temperatures.

   • 통신 장비: 5G base station PAs, optical modules, network switches – where high power generates sustained heat.

   • 산업 제어: 서보 드라이브, plcs, industrial PCs – for reliable operation in hot factory environments.

   • 전력전자: High-power switch-mode power supplies (SMPS), inverters – where power components generate significant heat.

   • 항공우주 & 방어: Electronic systems with extreme demands for reliability and environmental resilience.

6. Why Choose UGPCB for Your TG150 PCBs?

• 인증 된 자료: We use verified, traceable TG150 PCB laminates from reputable suppliers.

• 정밀가공: Our expertise in multilayer PCB fabrication 그리고 ENIG processing ensures high yield for 0.08mm fine-line designs.

• Guaranteed Specifications: All technical parameters (Tg 150°C, 0.2mm drills) are rigorously validated against datasheets.

• 엔드 투 엔드 지원: We provide full technical support from PCB 설계 검토 그리고 임피던스 제어 신속한 프로토타이핑 및 대량 생산에 이르기까지.

7. 행동을 취하십시오: Secure Your Design with a Robust Foundation

Don’t let thermal limitations hinder your product innovation. Choosing UGPCB’s high-reliability TG150 PCB means investing in exceptional stability, 내구성, 성능.

행동 유도 문안

*(이미지 제안: High-quality close-up photo of a populated TG150 PCB used in a telecom orautomotive application.)*
모든 것이 필요합니다: High-density assembled 4-layer TG150 PCB with ENIG finish for automotive or telecom applications

Is your next project facing thermal reliability challenges?
Do you need a PCB that can withstand rigorous environmental stress?

Contact the UGPCB expert team today!
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