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2-Camada de PCB rígida de 1,6 mm | FR-4 TG150 HASL sem chumbo | Fabricação UGPBC - UGPCB

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2-Camada de PCB rígida de 1,6 mm | FR-4 TG150 HASL sem chumbo | Fabricação UGPBC

Contagem de camadas: 2 Layers Rigid PCB

Espessura da placa: 1.60milímetros

Material: FR-4 TG150

Acabamento superficial: Lead-Free Hot Air Solder Leveling (Sangrar), White Solder Mask, Black Legend

  • Detalhes do produto

UGPCB Standard 2-Layer Rigid PCB: Reliable 1.6mm FR-4 Circuit Boards for Demanding Applications

At the heart of modern electronics, o Placa de circuito impresso (PCB) acts as the foundational platform, interconnecting components and routing signals with precision. UGPCB's Standard 2-Layer Rigid PCB, built with a robust 1.60mm espessura and high-performance FR-4 TG150 material, represents the optimal balance of durability, desempenho elétrico, and cost-effectiveness for a wide range of applications. Esse double sided PCB is a proven solution for prototypes and medium-complexity electronic devices.

UGPCB Standard 2-Layer Rigid PCB

Product Definition & Classificação

Technical Classification:

  • Por contagem de camadas: Double-Sided PCB / Two Layer PCB

  • By Substrate Rigidity: PCB rígido

  • By Base Material: Glass Epoxy (FR-4) PCB

  • By Flammability Rating: UL94 V-0 (inherent to FR-4)

  • By Assembly Compatibility: Tecnologia do orifício (THT) and Surface-Mount Technology (SMT) capable PCB.

This product is a double sided circuit board constructed with copper clad laminate on both sides of an insulating FR-4 core. Electrical connection between layers is achieved via plated through-holes (PTH). O 1.60milímetros (aproximadamente 1/16 inch) board thickness is an industry-standard, offering excellent mechanical stability.

Construção & Material Specifications

Layer Stack-Up:

Esse 2 layer rigid PCB structure is as follows (top to bottom):

  1. Top Solder Mask (Branco): Insulating layer to prevent solder bridges.

  2. Top Copper Layer (1 onças, ~35µm): Etched to form conductive traces and pads.

  3. Insulating Core Substrate (FR-4, Tg150): Provides mechanical support and electrical insulation.

  4. Bottom Copper Layer (1 onças, ~35µm): Etched to form bottom-layer circuitry.

  5. Bottom Solder Mask (Branco): Insulating protective layer.

  6. Silkscreen Legend (Preto): Component designators, logos, and markings.

Key Materials:

  • Base Laminate: FR-4 TG150. This denotes a flame-retardant glass-reinforced epoxy laminate with a Glass Transition Temperature (Tg) of 150°C. It offers superior mechanical strength, isolamento elétrico, and thermal reliability for a rigid printed circuit board, making it the industry’s most cost-effective choice.

  • Folha de cobre: Standard 1-ounce (onças) Electro-Deposited copper for optimal conductivity and current carrying capacity.

  • Acabamento superficial: Lead-Free Hot Air Solder Leveling (Sangrar). A cost-effective and reliable PCB surface finish that provides excellent solderability, good shelf life, and robust protection against oxidation.

  • Inks: High-quality photo-imageable white solder mask ink and durable black epoxy silkscreen ink.

(Image Suggestion: Cross-sectional diagram of the PCB stack-up)
Alt Tag: Detailed cross-sectional diagram of a 2 layer rigid PCB showing copper, FR-4 core, and solder mask layers.

Design Guidelines & Operational Principle

Critical Design Considerations:

  1. Via Design: Maximize the routing space of your double sided Projeto de PCB by strategically placing Plated Through-Holes (PThs) for inter-layer connections.

  2. Trace Width/Spacing: For 1oz copper, a standard minimum trace/space is 6mil/6mil (~0.15mm) to ensure reliable manufacturability and current capacity.

  3. Pad & Hole Annular Ring: Ensure adequate pad size relative to the drill hole to guarantee a strong connection for Montagem de placas de circuito impresso e confiabilidade.

  4. Máscara de solda & Silkscreen: White solder mask aids visual inspection during Montagem SMT, while clear black silkscreen is crucial for Prototipagem de PCB and repair.

Operational Principle:

A PCB does not generate function but enables it through its predefined conductive pathways. The etched copper traces replace discrete wiring, providing electrical connections between components. The insulating FR-4 substrate prevents short circuits. Plated through-holes (PThs) serve as vertical conduits, connecting the top and bottom PCB copper layers, thereby doubling the available routing area compared to a single-sided board and increasing design flexibility.

Características de desempenho & Advantages

  • Alta confiabilidade: O FR-4 TG150 substrate ensures stable performance in environments below its Tg, offering excellent thermal and mechanical stability for a rigid circuit board.

  • Excellent Electrical Properties: Low dielectric constant and dissipation factor support the signal integrity requirements of most digital and analog circuits.

  • High Manufacturability: O 1.6milímetros PCB padrão grossura e HASL sem chumbo process are mature, ensuring high yield, cost control, and fast lead times.

  • Superior Solderability: The HASL finish offers a flat, wettable surface ideal for both through-hole soldering e SMT soldering processes.

  • Clear Identification: High-contrast white solder mask with black legend facilitates efficient PCBA inspeção, testando, and rework.

  • Environmental Compliance: Lead-Free HASL finish complies with RoHS and other environmental directives.

Standard Manufacturing Process Flow

UGPCB adheres to IPC standards throughout our PCB fabrication process:
Panelization → Drilling → Electroless Copper Deposition → Dry Film Lamination & Imaging → Copper Plating → Etching → Solder Mask Application & Curing → Silkscreen Printing → Surface Finish (HASL sem chumbo) → Profiling/Routing → Electrical Testing (Sonda Voadora) → Final Automated Optical Inspection (AOI) → Packaging & Shipment.

Aplicações primárias & Casos de uso

This versatile two layer rigid PCB is widely used in industries that demand a balance of reliability and value:

  • Industrial Controls: PLC interfaces, sensor modules, motor drives, HMI controller boards.

  • Eletrônicos de consumo: Smart appliance controllers, audio amplifiers, Fontes de alimentação, educational kits.

  • Telecomunicações: Router/switch peripheral boards, RF antenna modules, network monitoring units.

  • Eletrônica Automotiva: Infotainment systems, lighting control modules, body control modules (non-safety critical).

  • Power Electronics: Smart meter PCBs, UPS control boards, solar inverter circuitry.

  • Test & Measurement: Data acquisition cards, instrument control panels, handheld tester boards.

 

Double-Layer FR-4 PCB Applications in Industrial Control

Why Choose UGPCB for Your 2-Layer PCB Needs?

Choosing UGPCB means partnering with a reliable Fabricante de placas de circuito impresso committed to quality. We specialize in Protótipo de PCB and medium-volume production, implementing rigorous Electrical Testing and IPC-A-600 based inspection on every board. From simple 2 placas de camada to complex multi-layer designs, nós fornecemos especialistas PCB design for manufacturing (Dfm) support and a streamlined supply chain.

Contact us today for a competitive quote and swift lead time on your 1.6mm FR-4 2-Layer PCB project!

(Image Suggestion: Gallery of finished PCBs with different designs)
Alt Tag: Gallery of various 2 layer rigid PCB examples manufactured by UGPCB with white solder mask.

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