PCB ultrafino de alta frequência de 0,30 mm | 2-Placa Layer Rogers R04003 com ENIG | UGPCB

Ultra-Thin High-Frequency PCB: 0.30mm Thick 2-Layer Rogers R04003 Visão geral do produto & Definição

Esse Ultra-Thin High-Frequency PCB de UGPCB is a double-sided printed circuit board manufactured using Rogers R04003 laminado de alta frequência. Engineered for electronic devices with stringent demands on size, peso, and RF performance, this board excels in radio frequency (RF), microwave communication, and high-speed digital applications. Its core advantage lies in the combination of an extremely thin profile (0.30milímetros) e superior dielectric properties, making it a critical component for device miniaturization and enhanced performance.

Especificações Técnicas & Classificação

• Classificação: High-Frequency/Microwave PCB, Ultra-Thin PCB

• Camadas: 2 Camadas (PCB de dupla face)

• Espessura da placa: 0.30 milímetros

• Material base: Rogers R04003 Laminate (0.2mm core, built up to final thickness)

• Peso de cobre (Finalizado): 1onças / 1onças (aprox.. 35μm per side)

• Acabamento superficial: Ouro de imersão em níquel eletrolítico (CONCORDAR), 2eu”

• Dimensões: 124.45 mm x 39.69 milímetros

Materiais & Características de desempenho

• Laminado: Rogers RO4003C laminate is used, featuring a stable dielectric constant (Dk ~3.0) and a very low dissipation factor (Df). This is essential for placas de circuito de alta frequência to minimize signal loss and ensure signal integrity.

• Folha de cobre: Padrão 1 onça (35μm) electro-deposited copper, offering excellent conductivity and current-carrying capacity.

• Acabamento superficial: CONCORDAR (2eu”) fornece um apartamento, solderable, and oxidation-resistant surface. The thin gold layer is particularly suitable for RF and microwave PCBs, minimizing signal attenuation due to the skin effect at high frequencies.

Estrutura, Projeto & Manufacturing Key Points

1. Estrutura: Standard 2-layer board structure with plated through-holes (PTH) for inter-layer connectivity.

2. Considerações Críticas de Design:

   • Controle de impedância: Preciso PCB de impedância controlada design is crucial. Trace width/spacing must be carefully calculated based on the Dk of RO4003 and the 0.30mm dielectric thickness to achieve target impedance values (por exemplo, 50Oh).

   • Gerenciamento térmico: The thin profile offers a short path for heat dissipation. Layout of high-power components must be planned accordingly.

   • Mechanical Handling: The 0.30mm thickness offers flexibility but requires careful handling and support during assembly to prevent bending or damage.

3. Fluxo do Processo de Produção:
   Material Preparation → Inner Layer Imaging → Lamination (RO4003 core with prepreg) → Drilling → Desmear & Electroless Copper Deposition → Outer Layer Imaging & Pattern Plating → Etching → Solder Mask Application → ENIG Surface Finish → Routing / Profiling to 124.45x39.69mm → Electrical Testing (Flying Probe) → Final Inspection & Packaging

Como funciona & Principais recursos

UM PCB de alta frequência acts as a “highway” for signal transmission, ensuring minimal loss, distorção, and delay. O Rogers RO4003 material e precision impedance-controlled design are fundamental to this performance.

Principais recursos do produto:

• Excelente desempenho de alta frequência: The low-loss characteristics of RO4003 laminate enhance RF circuit efficiency and integridade do sinal.

• Extremely Thin and Lightweight: The 0.30mm thin core PCB profile saves critical space and aids in product lightweighting.

• Alta confiabilidade & Soldabilidade: The ENIG finish ensures long-term shelf life, excellent solder joint reliability, and a flat surface for fine-pitch components.

• Fabricação de Precisão: Fabricated to exact dimensions (124.45×39.69milímetros) for reliable integration into compact assemblies.

Aplicações primárias & Casos de uso

Esse ultra-thin Rogers PCB is ideal for:

• RFID Modules: Antenna and placas de circuito in compact readers.

• Comunicação via satélite & GPS Devices: Miniaturized receiver modules.

• Automotive Radar Sensors: Antenna boards for 77GHz radar systems.

• Teste de última geração & Equipamento de medição: Probes and signal acquisition boards.

• Portable Communication Devices & UAVs: RF front-end modules where size and weight are critical.

Why Choose UGPCB for Your Ultra-Thin High-Frequency PCB?

Succeeding in competitive RF and high-speed markets requires a PCB partner with deep expertise. UGPCB provides a complete solution, de alta frequência Projeto de PCB apoiar para high-reliability manufacturing compliant with IPC standards. Todo 0.30mm thin PCB we produce undergoes rigorous impedance testing and quality checks, guaranteeing performance in real-world applications.

For your microwave antenna board ou high-speed transmission module, trust UGPCB to deliver superior integridade do sinal and power efficiency. Somos especializados em RF circuit board fabrication e microwave PCB manufacturing.

Contact us today for a quote on your high-frequency PCB project.