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6layers 1+N+1 Mobile Phone PCB - UGPCB

เอชดีไอ พีซีบี/

6layers 1+N+1 Mobile Phone PCB

แบบอย่าง : 6layers 1+N+1 Mobile Phone PCB

วัสดุ : S1000-2

ชั้น :6Layers 1+N+1

สี :สีเขียว/ขาว

ความหนาสำเร็จรูป : 0.8มม

ความหนาของทองแดง : inner0.5OZ,outer1OZ

การรักษาพื้นผิว :Immersion Gold+OSP

ติดตามขั้นต่ำ / ช่องว่าง :3พัน/3mil

แอปพลิเคชัน :mobile phone PCB

  • รายละเอียดสินค้า

Understanding the 6Layers 1+N+1 Mobile Phone PCB

ภาพรวมผลิตภัณฑ์

The 6Layers 1+N+1 Mobile Phone PCB represents an advanced electronic component tailored for integration into modern mobile devices. This PCB is characterized by its multi-layered structure, offering a balance between functionality and compactness essential for contemporary smartphones.

Definition

A Printed Circuit Board (พีซีบี) is a foundational element in electronic devices, functioning as the platform that connects various electrical components. The term “6Layers 1+N+1denotes a specific configuration within a PCB, indicating it consists of six layers, with the outermost layers dedicated to signal traces, power/ground planes, or a combination thereof, enhancing electrical performance and reducing signal interference.

Design Requirements

Designing a 6Layers 1+N+1 Mobile Phone PCB entails adhering to stringent criteria:

  • วัสดุ: S1000-2, chosen for its excellent thermal stability and mechanical strength.
  • ความหนา: A finished thickness of 0.8mm ensures compatibility with slim device profiles.
  • ความหนาของทองแดง: Varies between inner 0.5OZ and outer 1OZ to manage heat dissipation and current-carrying capacity.
  • การรักษาพื้นผิว: Incorporates Immersion Gold and OSP (Organic Solderability Preservative) to enhance solderability and protect against corrosion.

หลักการทำงาน

At its core, the PCB facilitates the flow of electrical signals between components. In a multi-layer design like the 6Layers 1+N+1, signal integrity is maintained through meticulous layer stacking, where ground planes can be interspersed between signal layers to minimize crosstalk and electromagnetic interference (อีเอ็มไอ).

การใช้งาน & การจำแนกประเภท

Primarily designed for mobile phones, these PCBs are also suitable for other portable electronic devices requiring high-density interconnect solutions. They are classified based on their layer count, material properties, and intended use cases, making them versatile yet specialized for mobile technology.

องค์ประกอบของวัสดุ

Constructed from S1000-2, a high-temperature epoxy resin glass cloth laminate, this PCB offers superior dimensional stability and durability under thermal stress, crucial for devices subject to varying environmental conditions.

Performance Features

  • ความสมบูรณ์ของสัญญาณ: Maintains clear transmission of signals even at high frequencies due to optimized layer arrangement.
  • Heat Dissipation: Efficient heat management thanks to copper thickness variations and material selection.
  • Corrosion Resistance: Enhanced longevity through immersion gold and OSP surface treatments.

Structural Layout

The PCB’s structure comprises six layers, strategically arranged to optimize space usage and electrical performance. The “1+N+1configuration implies flexibility in assigning roles to each layer, typically involving signal layers sandwiched between power/ground planes.

Key Characteristics

  • Slim Form Factor: With a thickness of just 0.8mm, it supports sleek device designs.
  • High Density Interconnectivity: Supports complex circuitry with fine trace widths and spacing of 3mil/3mil.
  • Robust Construction: Ensures durability and reliability in demanding mobile environments.

กระบวนการผลิต

Manufacturing involves several stages:

  1. การเตรียมวัสดุ: Selecting premium S1000-2 substrate.
  2. การแกะสลัก: Creating precise circuit patterns using chemical etching processes.
  3. Layer Lamination: Bonding individual layers together under controlled pressure and temperature.
  4. Plating: Applying copper layers to establish conductive paths.
  5. การรักษาพื้นผิว: Applying Immersion Gold and OSP for protection and enhanced solderability.
  6. Quality Control: Rigorous inspection and testing to ensure adherence to specifications.

ใช้สถานการณ์กรณี

Ideal for high-performance mobile phones, the 6Layers 1+N+1 Mobile Phone PCB is also applicable in:

  • Advanced smartphones with intricate circuit designs.
  • Devices requiring miniaturization without compromising functionality.
  • Applications needing reliable signal transmission and thermal management within compact spaces.

โดยสรุป, the 6Layers 1+N+1 Mobile Phone PCB stands out as a sophisticated solution tailored for the demands of modern mobile electronics, offering unparalleled connectivity, durability, and performance within a minimalist form factor.

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