1. Descripción general del producto: What Is a Cooker Hood Mother Board PCB?
A cooker hood mother board PCB (Placa de circuito impreso) serves as the central hardware backbone of a range hood control system. This rigid printed circuit board handles all electrical connections and signal transmission tasks for motor driving, touch sensing, LED lighting control, airflow adjustment, and delayed shut‑off functions.
UGPCB presents this cooker hood motherboard PCB manufactured with Kingboard KB6165G high-end laminate. This double-sided rigid printed circuit board is specifically engineered for long‑term reliable operation in harsh kitchen environments. El tarjeta de circuito impreso medidas 82.63 × 46.7 mm with a standard 1.6 mm de espesor del tablero. Its double‑sided routing structure delivers excellent electrical performance and mechanical strength for medium‑complexity control circuits.
Industry data shows that China’s range hood control board shipments reached 38.60 millones de unidades en 2024, marking a 5.7% year‑over‑year growth. Smart control boards now account for 58.7% of total shipments. Given this substantial market demand, selecting a reliable and well‑manufactured cooker hood PCB directly impacts the end product’s quality and user experience.
2. Definición del producto y especificaciones técnicas
2.1 Parámetros básicos
| Parámetro | Especificación |
|---|---|
| Nombre del producto | PCB de la placa madre de la campana extractora |
| Material laminado | Kingboard KB6165G (Halogen‑Free TG150 Glass Fiber Copper‑Clad Laminate) |
| Grosor del tablero | 1.6 milímetros |
| Número de capas | 2 capas (Double‑Sided Board) |
| Tamaño terminado | 82.63 × 46.7 milímetros |
| Diámetro mínimo del agujero | 0.296 milímetros |
| Ancho mínimo de línea / Espaciado de línea | 0.342 milímetros / 0.37 milímetros |
| Espesor de lámina de cobre | 1/1 ONZ (35 μm per layer) |
| Acabado superficial | Níquel no electrolítico / Oro de inmersión (ACEPTAR / Gold Plating Process) |
| Máscara de soldadura / Leyenda | Black Solder Mask / Leyenda serigrafiada blanca |
2.2 Material laminado: Kingboard KB6165G
This product uses KB6165G, a halogen‑free TG150 glass fiber copper‑clad laminate from Kingboard Laminates Holdings Ltd. This industrial‑grade high‑performance laminate delivers the following key properties:
- Temperatura de transición vítrea (tg) : 150°C (155‑158°C measured by DSC method). The material withstands three lead‑free reflow soldering cycles with a peak temperature of 260°C.
- Índice de seguimiento comparativo (TIC) : 600 V. This represents a threefold improvement over the base model KB‑6165F (CTI ≥ 175 V), offering exceptional resistance to tracking failure.
- Z‑axis Coefficient of Thermal Expansion (CTE) : Alfa 1 en 41 ppm/°C, Alfa 2 en 235 ppm/°C.
- T288 Delamination Time : > 60 minutos, several times higher than standard FR‑4 materials.
- Temperatura de descomposición térmica (td, 5% perdida de peso) : 370°C.
- Calificación de inflamabilidad : UL94 V‑0.
- Resistividad superficial : 5.2 × 10⁸ MΩ.
- Resistividad de volumen : 6.1 × 10⁹ MΩ‑cm.
- Fuerza de pelado : 1.4 N/mm (para 1 oz de lámina de cobre).
This laminate passes 96‑hour salt spray testing and is free of halogens, antimony, and red phosphorus, fully complying with RoHS environmental directives.
3. Design Principles and Operating Principles
3.1 Design Standard Compliance
This product’s design strictly followsIPC‑2221C, Norma genérica sobre diseño de tableros impresos (released August 18, 2025). IPC‑2221C serves as the foundation design standard for all documents in the IPC‑2220 series. It establishes generic requirements for printed board design, covering material selection, copper foil selection, minimum electrical clearance, impedance tolerances, and other core design specifications.
3.2 Engineering Basis for Line Width and Spacing Design
This product features a design line width of 0.342 mm and line spacing of 0.37 milímetros. These parameters are determined based on the current‑carrying capacity formula from the IPC‑2221 standard:
Yo = k × ΔT^0,44 × A^0,725
Dónde:
- I = Maximum allowable current (Amperes, A)
- k = Factor de corrección (0.048 for outer layer traces, 0.024 for inner layer traces)
- ΔT = Temperature rise (°C)
- A = Conductor cross‑sectional area (mil²)
For this product with 1 oz de lámina de cobre (aproximadamente 35 μm thickness), outer layer traces can carry approximately 1.5‑2 A per millimeter of width at a 10°C temperature rise. El 0.342 mm line width sufficiently meets the current‑carrying demands of range hood control circuits (typically including motor drive currents of 3‑5 A and touch/logic circuit currents below 1 A), while providing adequate process windows for subsequent PCBA soldering operations.
3.3 Principios operativos
The cooker hood motherboard PCB functions as the physical carrier of the control system, operating at three levels:
Electrical Connection Level : The copper traces on the PCB electrically connect the MCU (main control chip), touch sensing modules, motor driver ICs, LED driver circuits, and power management modules according to the schematic diagram, enabling orderly signal transmission.
Signal Processing Level : User commands entered through the touch panel (power on/off, airflow adjustment, lighting control, etc.) travel via touch traces on the PCB to the MCU. Después del procesamiento, the MCU outputs corresponding control signals through the driver traces on the PCB to activate motors, luces LED, and other actuating components.
Power Management Level : Power traces on the PCB convert the input AC or DC power to the operating voltages required by each component. Proper power/ground plane layout ensures power supply stability.
4. Clasificación de productos
Based on printed circuit board industry classification standards, este producto cae en las siguientes categorías:
| Dimensión de clasificación | Categoría |
|---|---|
| Por estructura | Rigid Printed Circuit Board |
| Por recuento de capas | Double‑Sided Board (2‑Layer Board) |
| By Laminate Material | FR‑4.1 Grade Halogen‑Free Glass Fiber Copper‑Clad Laminate (KB6165G) |
| Por acabado superficial | Níquel no electrolítico / Oro de inmersión (ACEPTAR) |
| Por aplicación | Home Appliance Control Board (Cooker Hood Mother Board) |
| Por clasificación de inflamabilidad | UL94 V‑0 |
| Por cumplimiento ambiental | Halogen‑Free, Cumplimiento de ROHS |
PorIPC‑6012F, Especificación de calificación y rendimiento para tableros impresos rígidos (released September 2023), this product meetsClase 2 – Productos electrónicos de servicio dedicado requisitos. Clase 2 applies to products where extended life is expected and uninterrupted service is desired, but the operating environment is not extreme—perfectly matching home appliance applications.
5. Materiales utilizados
5.1 sustrato: KB6165G Copper‑Clad Laminate
As detailed above, this product uses Kingboard KB6165G halogen‑free TG150 glass fiber copper‑clad laminate with the following material composition:
- Reforzamiento : Electronic‑grade glass fabric
- Matrix Resin : Halogen‑free epoxy resin (Tg 150°C)
- Lámina de cobre : 1 oz Electrolytic Copper Foil (cobre ED)
- Sistema retardante de llama : Halogen‑free flame retardant (UL94 V‑0)
5.2 Acabado superficial: Níquel no electrolítico / Oro de inmersión (ACEPTAR)
This product uses the Electroless Nickel / Oro de inmersión (ACEPTAR) surface finish process. PorIPC‑4552B, Especificación para níquel químico/oro por inmersión (ACEPTAR) Revestimiento para tableros impresos (published May 2021), ENIG deposit thickness requirements are:
- Espesor de la capa de níquel : 3‑6 μm (per IPC‑4552B Class 1/2/3)
- Gold Layer Thickness : 0.05‑0.10 μm (typical range: 0.075‑0.125 μm)
ENIG surface finish offers these advantages:
- Excelente soldabilidad, meeting the highest coating durability rating per IPC‑J‑STD‑003
- Resistencia superior a la oxidación y la corrosión.
- Flat surface suitable for fine‑pitch component soldering
- Suitable for wire bonding and contact finish applications
5.3 Máscara de soldadura y leyenda
- Máscara de soldadura : Black ink offering excellent insulation and heat resistance
- Leyenda : White silkscreen providing high contrast for SMT placement and repair identification
6. Estructura del producto y características de rendimiento.
6.1 Características estructurales
Double‑Sided Design (2 capas) : Both the Top Layer and Bottom Layer contain circuit traces, with electrical connections between layers made through Plated Through‑Holes (PTH). The double‑sided structure balances routing density with cost‑effectiveness.
Precision Hole Diameter Control : Diámetro mínimo del agujero de 0.296 mm meets the strict requirements of IPC‑6012F for plated through‑holes. Copper plating on hole walls ensures reliable interlayer connections and conductivity.
Compact Dimensions : El 82.63 × 46.7 mm compact size is specifically tailored for the limited internal space of range hoods, facilitating overall product mechanical design.
Estándar 1.6 mm Espesor del tablero : This thickness maintains mechanical strength while matching standard component lead lengths, facilitando tarjeta de circuito impreso asamblea.
6.2 Características de rendimiento
Superior Heat Resistance : With Tg of 150°C and Td of 370°C, the board withstands the high‑temperature impact of lead‑free reflow soldering (pico 260°C).
Excellent Insulation Performance : Surface resistivity of 5.2 × 10⁸ MΩ and volume resistivity of 6.1 × 10⁹ MΩ‑cm ensure reliable signal transmission in high‑humidity kitchen environments.
High CTI Tracking Resistance : The CTI 600 V rating effectively prevents tracking failure in high‑pollution environments (kitchen fume environments fall under Pollution Degree 2‑3).
Good Anti‑CAF Performance : The laminate offers strong resistance to Conductive Anodic Filament (c y f) formación, reducing the risk of CAF failure in moist‑heat environments.
UL94 V‑0 Flammability Rating : Meets the highest fire safety requirements for home appliances.
7. Flujo del proceso de fabricación
UGPCB manufactures this cooker hood motherboard PCB in strict compliance with IPC‑6012F requirements:
Paso 1: Control de calidad entrante (coeficiente intelectual) → Inspect KB6165G copper‑clad laminate, lámina de cobre, película seca, tinta de máscara de soldadura, y otras materias primas
Paso 2: Corte → Cut large copper‑clad laminate sheets to working panel size
Paso 3: Perforación → taladradoras CNC process the 0.296 mm minimum hole diameter along with other mounting holes and vias
Paso 4: Deposición de cobre no electrolítica / Revestimiento de paneles → Metallize hole walls to create conductive through‑holes
Paso 5: Transferencia de patrones → Apply dry film → Expose → Develop to form the circuit pattern
Paso 6: Aguafuerte → Remove unprotected copper to create the designed circuit traces
Paso 7: Máscara de soldadura → Print black solder mask ink → Expose → Develop to expose pads
Paso 8: ACEPTAR (Níquel no electrolítico / Oro de inmersión) → Electroless nickel plating (3‑6 μm) + Oro de inmersión (0.05‑0.10 μm)
Paso 9: Impresión de leyendas → Print white silkscreen legend identifiers
Paso 10: Enrutamiento / V‑Cut → CNC routing to final dimensions of 82.63 × 46.7 milímetros
Paso 11: Prueba eléctrica → Prueba de sonda voladora / fixture testing to verify open/short circuit integrity
Paso 12: Control de calidad final (FQC) → Visual inspection and dimensional inspection per IPC‑6012F Class 2 estándares
Paso 13: Embalaje y envío → Vacuum packaging + anti‑static bags, compatible con PCI packaging specifications
8. Application Scenarios and Market Applications
8.1 Escenarios de aplicación primaria
This cooker hood motherboard PCB is widely used in:
- Residential Range Hoods : Main control circuit boards for touch‑control or button‑type range hoods
- Integrated Cooktop Control Boards : Core control units for integrated cooking appliances
- Smart Kitchen Appliances : Control modules for smart range hood and cooktop integrated systems
- Commercial Kitchen Equipment : Control boards for large commercial exhaust systems
8.2 Perspectiva del mercado
China’s small appliance control board market is projected to reach approximately RMB 45 mil millones en 2025, with year‑over‑year growth of 10.3%. Smart control boards now account for over 60% of the market. The Chinese home appliance control board market is in a critical stage of smart transformation and upgrade, driving sustained demand for high‑performance, high‑reliability cooker hood motherboard PCBs.
8.3 Typical Operating Environment
The cooker hood motherboard PCB operates under these conditions:
- Temperature Range : ‑10°C to +85°C (kitchen environment)
- Humidity Range : 20% a 90% RH (significant steam generated during cooking)
- Grado de contaminación : Pollution Degree 2‑3 (fume and dust)
- Vibración : Continuous vibration from motor operation
9. Why Choose UGPCB for Your Cooker Hood Mother Board PCB?
✅Cumplimiento de estándares internacionales : Full adherence to IPC‑2221C and IPC‑6012F international standards throughout design, fabricación, e inspección
✅Premium Laminate Materials : Kingboard KB6165G industrial‑grade laminate with Tg 150°C, TIC 600 V, and UL94 V‑0 rating
✅Capacidad de fabricación de precisión : Diámetro mínimo del agujero de 0.296 mm y ancho de línea mínimo de 0.342 milímetros
✅Acabado superficial superior : ENIG finish compliant with IPC‑4552B, offering excellent solderability
✅Cumplimiento ambiental : Halogen‑free materials meeting RoHS and REACH directives
✅Servicios de personalización : Flexible customization of dimensions, recuento de capas, material laminado, y acabado superficial
✅Entrega rápida : Quick‑turn capability from prototypes to volume production
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UGPCB is committed to providing high‑quality cooker hood motherboard fabricación de PCB services to customers worldwide. Ya sea que necesite muestras de prototipos o producción en volumen, Ofrecemos soporte técnico profesional y precios competitivos..
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📧 Correo electrónico: ventas@ugpcb.com
🌐 Sitio web: www.ugpcb.com
💡 Please provide the following information for an accurate quote:
- PCB dimensions, recuento de capas, and laminate material requirements
- Minimum line width/spacing and minimum hole diameter
- Surface finish requirements
- Copper foil thickness requirements
- Quantity requirements (prototipo / lote pequeño / producción en volumen)
- Archivos Gerber (si está disponible)
Send your requirements today, y el UGPCB professional team will respond with a detailed quote and technical recommendations within 24 horas!
Declaración de fuente de datos
The technical data and standards cited in this article are sourced from the following authoritative organizations and publicly available materials:
- IPC‑6012F : Especificación de calificación y rendimiento para tableros impresos rígidos, Septiembre 2023, IPC International, Inc.
- IPC‑2221C : Norma genérica sobre diseño de tableros impresos, Agosto 18, 2025, IPC International, Inc.
- IPC‑4552B : Especificación para níquel químico/oro por inmersión (ACEPTAR) Revestimiento para tableros impresos, May 2021, IPC International, Inc.
- KB‑6165G / KB‑6165GMD Technical Data Sheet : Kingboard Laminates Holdings Ltd. official product technical documentation
- UL94 : Norma para pruebas de inflamabilidad de materiales plásticos para piezas de dispositivos y electrodomésticos, Underwriters Laboratories Inc.
- IPC‑TM‑650 : Manual de métodos de prueba, IPC International, Inc.
