1. Descripción general del producto
en el campo de interconexión de alta densidad (IDH) placas de circuito impreso, el12-layer 2+N+2 board represents an important direction in advanced PCB manufacturing technology. UGPCB12-placa HDI de capa 2+N+2 uses ISOLA high-performance substrate material, with a finished board thickness of 2.0 milímetros, 1 oz copper on both outer and inner layers, a minimum via diameter of 0.1 milímetros, line width/spacing of 0.1 milímetros, BGA pad diameter of 0.15 milímetros, and electroless nickel/immersion gold (ACEPTAR) acabado superficial.
Este12-capa tarjeta de circuito impreso is a typical high-density interconnect tablero multicapa suitable for electronic products with demanding requirements for signal integrity, routing density, y confiabilidad. como un2+estructura n+2 Tablero de HDI, it features two buildup layers on each side, with N core layers in the middle, supporting stacked or staggered microvia structures.
2. Definición del producto
2.1 What Is a 2+N+2 HDI Board?
A2+Tarjeta HDI N+2 is a high-density interconnect printed circuit board manufactured using a sequential lamination process. El “2” in its name represents two buildup layers on each side, mientras “norte” represents the number of core layers in the middle. Para este producto, the total layer count is 12, meaning a 2+8+2 structure — two buildup layers on each side and eight core layers in the middle.
EstePCB HDI belongs to Type III (as defined by IPC-2226), a commonly used HDI stackup solution supporting medium pin-count, BGA de alta densidad componente enrutamiento. El2+N+2 PCB stackup design significantly improves routing density, supports successful routing of ultra-fine-pitch BGAs with pitches as small as 0.4 milímetros, reduces overall layer count, and minimizes signal attenuation.
2.2 Applicable International Standards
el diseño, fabricación, and acceptance of this product strictly comply with the following IPC international standards:
- IPC-6012F -Especificación de calificación y rendimiento para tableros impresos rígidos: This is the internationally recognized performance specification for rigid printed circuit boards, covering the entire process from material selection to finished product, including quality indicators, qualification, and performance requirements for each process step.
- IPC-2221C -Norma genérica sobre diseño de tableros impresos: This is the foundation design standard for all documents in the IPC-2220 series, establishing generic requirements for printed board design.
- IPC-4101E -Especificación de Materiales Base para Tableros Impresos Rígidos y Multicapa: This specification covers requirements for base materials (laminate or prepreg) used primarily for rigid or multilayer printed boards.
3. Pautas de diseño
3.1 2+N+2 Stackup Structure Design
El12-layer 2+N+2 PCB stackup design follows the core design principles for HDI boards:
- Priority on ground planes: Ground planes are prioritized because they transmit signals in microstrip configurations.
- Low impedance and low noise: A ground-plane-based 12-layer diseño de PCB achieves low ground impedance and low noise.
- High-speed signal routing: Intermediate layers between planes are used for high-speed signal traces, with tight coupling between signal layers.
- Adjacent plane and signal layers: Plane layers and signal layers should be placed on adjacent layers.
- Tight plane coupling: Large-area power and ground planes should be tightly coupled together.
3.2 Diseño de integridad de señal
Según IPC-2221C, impedance tolerance and conductor layer isolation areas are critical considerations in Diseño de PCB de alta velocidad. Para el12-placa HDI de capa 2+N+2, special attention should be paid to:
- control de impedancia: Con 1 onzas de cobre (aproximadamente 35 μm) on both outer and inner layers, precise line width/spacing control is required to achieve target impedance.
- Microvia structure: El 0.1 mm minimum via diameter falls within the microvia category (≤ 0.15 mm as defined by IPC-2221 and IPC-6012).
- BGA breakout: El 0.15 mm BGA pad combined with 0.1 mm line width/spacing supports successful breakout for 0.4 BGA de paso de mm.
4. Principios operativos
El12-placa HDI de capa 2+N+2 operates based on the interconnection and signal transmission of multiple conductive layers. Its core operating mechanisms include:
4.1 Signal Transmission Paths
HDI boards achieve interlayer electrical connections through the following via types:
- Vias ciegos: Connect from an outer layer to a specific inner layer without penetrating the entire board thickness.
- Vías enterradas: Exist only between inner layers.
- Microvías apiladas: Multiple microvias stacked vertically to form a path through multiple buildup layers.
4.2 Power Distribution and Grounding
The power distribution network (PDN) del12-PCB de capa is optimized through:
- Large-area power planes tightly coupled with ground planes, forming effective decoupling capacitance.
- Ground layers serving as return paths for signals, reducing loop inductance.
- Signal layers tightly coupled with adjacent plane layers, reducing electromagnetic interference (EMI).
5. Aplicaciones principales y casos de uso
5.1 Target Application Areas
El12-placa HDI de capa 2+N+2, with its high-density interconnect capability and excellent electrical performance, is primarily used in the following areas:
| Área de aplicación | Typical Products | Requisitos clave |
|---|---|---|
| 5G Infraestructura | 5Estaciones base G, AAU, RRU | High frequency, alta velocidad, baja pérdida |
| Centros de datos | Servidor, interruptores, dispositivos de almacenamiento | High-speed data transmission, alta confiabilidad |
| Informática de alto rendimiento | Tarjetas aceleradoras de IA, HPC | High-density BGA, Integridad de señal |
| Wired/Wireless Communications | Optical modules, enrutadores, microwave equipment | High-frequency performance, low insertion loss |
| Electrónica automotriz | ADA, radar automotriz (77 GHz) | Alta confiabilidad, temperature resistance |
| Aeroespacial y defensa | Aviónica, sistemas de radar | Extreme environment reliability |
ISOLA materials such as TerraGreen® 400G are specifically suited for next-generation 5G infrastructure, data center systems, informática de alto rendimiento, wired/wireless communications, and AI applications, supporting extremely high data transmission rates exceeding 100 Gb/s.
5.2 Compatible Product Types
- High-end smartphone mainboards
- Communication base station RF boards
- High-performance server backplanes
- AI training/inference accelerator cards
- High-speed optical modules
- Automotive radar sensor boards
6. Clasificación de productos
Based on standard PCB industry classification methods, Este producto se puede clasificar científicamente de la siguiente manera.:
6.1 By Product Structure
Rigid board — Manufactured using rigid substrate materials (FR4/ISOLA).
6.2 Por recuento de capas
Tablero multicapa — Featuring 12 capas conductoras, bonded by insulating dielectric materials and interconnected through vias.
6.3 By Manufacturing Process
Tablero de HDI (tablero de interconexión de alta densidad) — Featuring a 2+N+2 sequential lamination structure, classified as a second-order HDI board (2+C+2).
6.4 By IPC-2226 Stackup Type
Type III stackup — 2+N+2 or higher-order stacked/staggered microvia structures.
6.5 By IPC-6012 Quality Class
Available to meetClase 2 (dedicated-service electronic products) oClase 3 (productos electrónicos de alta confiabilidad) requirements as per customer specifications.
7. Materiales utilizados
7.1 sustrato: ISOLA Series Materials
This product uses ISOLA high-performance copper-clad laminates. ISOLA is a leading material supplier in the high-frequency, high-speed PCB sector, with its products widely used in high-speed digital, high-frequency analog, RF/microwave, and other advanced circuit designs.
Typical properties of ISOLA materials (TerraGreen® 400G as an example):
| Propiedad | Valor típico | Método de prueba |
|---|---|---|
| Temperatura de transición vítrea (Tg DSC) | 200°C | IPC-TM-650 2.4.25C |
| Temperatura de transición vítrea (Tg DMA) | 215°C | IPC-TM-650 2.4.24.4 |
| Temperatura de descomposición (Td @5% weight loss) | >380°C | IPC-TM-650 2.4.24.6 |
| Constante dieléctrica (Dk) | 3.15 | IPC-TM-650 2.5.5.5 |
| Factor de disipación (df) | 0.0017 | IPC-TM-650 2.5.5.5 |
| Calificación de inflamabilidad de UL | UL 94 V-0 | UL File E41625 |
ISOLA materials comply with IPC-4101/134 and offer the following advantages:
- Halogen-free and RoHS compliant
- Excelente CAF (conductive anodic filament) resistencia
- Baja absorción de humedad
- Withstands up to 6 reflow cycles at 260°C
- FR-4 process compatible — can be processed using standard equipo de PCB
7.2 Lámina de cobre
- Inner and outer layer copper thickness: 1 onz (aproximadamente 35 μm)
- Copper foil type: HVLP3 (ultra-low profile) or RTF (tratado inverso) copper foil available upon request
7.3 Grosor del tablero
- Grosor del tablero terminado: 2.0 milímetros
8. Especificaciones de rendimiento
8.1 Key Electrical Specifications
| Parámetro | Especificación | Notas |
|---|---|---|
| Recuento de capas | 12 capas | 2+estructura n+2 |
| Grosor del tablero terminado | 2.0 milímetros | - |
| Espesor de cobre de la capa exterior | 1 onz (35 μm) | Cobre acabado |
| Espesor de cobre de la capa interna | 1 onz (35 μm) | - |
| Diámetro mínimo vía | 0.1 milímetros | Laser-drilled microvia |
| Ancho mínimo de línea | 0.1 milímetros | - |
| Espacio mínimo entre líneas | 0.1 milímetros | - |
| BGA Pad Diameter | 0.15 milímetros | Soporte 0.4 mm pitch BGA |
| Acabado superficial | ACEPTAR (Níquel químico/oro de inmersión) | IPC-4552 compliant |
8.2 Reliability Performance
Según IPC-6012F, rigid printed boards must meet the following reliability requirements:
- Electrical performance: Resistencia de aislamiento, dielectric withstanding voltage, control de impedancia, etc..
- Mechanical performance: Fuerza de pelado, alabeo, estabilidad dimensional, etc..
- Environmental performance: Ciclismo térmico, prueba de humedad, salt spray testing, etc..
IPC-6012F has introduced several new requirements for microvia structure reliability, including copper wrap plating, intermediate target lands, microsection evaluation, inner layer plating, and dielectric spacing and reliability issues for microvia structures.
IPC-6012F has increased the minimum copper thickness requirement for plated-through hole barrel walls — raised to 28 μm for Class 3/A (previously 25 μm).
8.3 Rendimiento térmico
ISOLA materials with Tg ≥ 200°C and Td > 380°C support lead-free soldering processes and multiple reflow cycles.
9. Estructura del producto
El2+Tarjeta HDI N+2 via structure includes:
- Vías ciegas láser: From outer layers (L1/L12) to Layer 3/Layer 10 (buildup section), 0.1 mm de diámetro
- Vías ciegas láser: From Layer 3/Layer 10 to inner core layers
- Mechanical through vias: Through the core section (capas 4-9)
- Microvías apiladas: Blind vias can be stacked vertically for multi-layer connections
10. Características del producto
10.1 Capacidad de interconexión de alta densidad
- 0.1 Microvias MM: Support ultra-high-density routing
- 0.1 mm ancho de línea/espaciado: Enable fine-line design
- 0.15 mm BGA pads: Apoyo 0.4 mm pitch ultra-fine-pitch BGAs
10.2 Excelente integridad de la señal
- ISOLA low-loss material (Df tan bajo como 0.0017) ensures low high-frequency signal attenuation
- 2+N+2 structure supports precise impedance control
- Ground planes tightly coupled with signal layers reduce EMI
10.3 Alta fiabilidad
- Complies with IPC-6012F Class 2/Class 3 requisitos
- ISOLA material with Tg ≥ 200°C and Td > 380°C
- ENIG surface finish provides excellent solderability and oxidation resistance
10.4 Compatibilidad de procesos
- ISOLA materials are compatible with standard FR-4 process flows
- Admite laminación secuencial
- Allows multiple reflow cycles
11. Flujo del proceso de fabricación
The 12-layer 2+N+2 HDI board manufacturing process is as follows:
11.1 Core Board Manufacturing (Capas internas)
- corte de materiales: Cut ISOLA substrate per MI requirements
- Formación del circuito de capa interna.: Apply photoresist → expose → develop → etch → strip to form inner layer circuit patterns
- AOI de la capa interna: Automated optical inspection to ensure circuit quality
- Tratamiento con óxido marrón: Enhance adhesion between inner layer copper and prepreg
11.2 Primera laminación
- Acumulación: Stack inner layer cores with prepreg per the stackup structure
- Laminación: Bond multiple layers into one unit under high temperature and pressure
11.3 First Drilling and Via Metallization
- Perforación láser: Perforar 0.1 Microvias MM
- desmechar: Remove carbonized residue from laser drilling
- Via metallization: Electroless copper deposition to form conductive layer on via walls
- Panel plating: Build up copper thickness on via walls
11.4 Buildup Layer (Capa exterior) Fabricación
- Formación del circuito de la capa exterior.: Repeat inner layer circuit formation process
- Outer layer AOI: Inspección óptica automatizada
11.5 Segunda Laminación (si es necesario)
- Secondary lamination: Multiple sequential lamination steps may be required for 2+N+2 structures
11.6 Final Finishing
- Outer layer drilling: Mechanical through-hole drilling
- Via metallization and plating: Through-hole metallization and copper build-up plating
- Outer layer circuits: Formar patrones de circuito de capa exterior.
- máscara de soldadura: Apply solder mask ink
- Acabado superficial: ACEPTAR (Níquel químico/oro de inmersión) — electroless nickel (3–6 µm) + oro de inmersión (0.05–0,1 µm) para IPC-4552
- Impresión de leyenda: Silk-screen component designators and other markings
- Enrutamiento de perfil: Enrutamiento, corte en V, etc..
- Pruebas electricas: sonda voladora o prueba de accesorios
- Inspección final: Visual inspection and packaging
12. Ventajas del acabado superficial ENIG
Este producto utilizaACEPTAR (Níquel químico/oro de inmersión) acabado superficial, offering the following core advantages:
| Ventaja | Descripción |
|---|---|
| Excelente planitud superficial | Ideal for fine-pitch BGA and SMT assembly |
| Superior solderability | Supports multiple reflow cycles (3+ veces) |
| Larga vida útil | 12+ months storage life |
| Strong oxidation resistance | Gold layer protects copper from oxidation |
| Buena conductividad eléctrica | Suitable for high-frequency signal transmission |
The ENIG process chemically deposits a nickel-phosphorus alloy layer (approximately 3–6 μm thickness) y una capa de oro (approximately 0.05–0.1 μm thickness) on the PCB copper surface.
13. Why Choose UGPCB’s 12-Layer 2+N+2 HDI Board?
- International standard compliance: Strictly follows IPC-6012F, IPC-2221C, IPC-4101E, y otras normas internacionales
- Garantía de materiales de primera calidad: Uses ISOLA high-performance substrate for high-frequency, high-speed performance
- Capacidad de fabricación avanzada: Precision processing for 0.1 mm microvias and 0.1 mm ancho de línea/espaciado
- Comprehensive quality control: Full-process quality management from incoming material inspection to final product testing
- Professional engineering support: Provides DFM (Diseño para la fabricación) reviews and impedance design support
14. Solicitar una cotización
UGPCB is committed to providing high-qualityPCB HDI manufacturing services to customers worldwide. Whether you need a12-placa HDI de capa 2+N+2 or other layer counts and structures ofPCB multicapa, Ofrecemos soporte técnico profesional y precios competitivos..
Cómo obtener una cotización:
- Submit design files: Send Gerber files, archivos de perforación, and stackup specifications to our sales team
- Specify technical requirements: Include impedance requirements, material preferences, acabado superficial, cantidad, etc..
- Revisión de ingeniería: Our engineers will perform DFM checks to ensure manufacturability
- Receive a quote: Get a competitive price and lead time quickly
Contáctenos
Send yourtarjeta de circuito impreso design files to our sales email or submit an inquiry through our website. Our technical team will respond within 24 horas.
Declaración de fuente de datos
The technical data and standard information cited in this document are sourced from the following authoritative organizations:
- PCI (Asociación que conecta industrias electrónicas) — IPC-6012FEspecificación de calificación y rendimiento para tableros impresos rígidos (Septiembre 2023); IPC-2221CNorma genérica sobre diseño de tableros impresos (Diciembre 2023); IPC-4101EEspecificación de Materiales Base para Tableros Impresos Rígidos y Multicapa (March 2017); IPC-4552Especificación de rendimiento para níquel químico/oro por inmersión (ACEPTAR) Revestimiento para tableros impresos
- Grupo de isola — TerraGreen® 400G Product Data Sheet
- UL (Laboratorios aseguradores) — UL 94 V-0 Calificación de inflamabilidad, UL File Number E41625
- Literatura técnica de la industria — HDI PCB stackup design and 2+N+2 structure technical documentation
