HDI 제조 공정 기능

UGPCB: Pioneering High-Density Interconnect Innovation with Advanced HDI PCB Technology

Industry-Leading HDI PCB Manufacturing Capabilities

UGPCB stands at the forefront of HDI (고밀도 상호 연결) PCB 기술, driving progress in an era where electronic devices demand unprecedented thinness and functionality. Specializing in 4-40 layer multilayer boards with thickness ranging from 0.4mm to 6.0mm, we cater to diverse needs from consumer electronics to premium communication equipment.

Our cutting-edge Any-layer HDI technology enables seamless interconnection across over 10 PCB 레이어, delivering robust connectivity solutions for high-performance computing and communication devices. This capability positions us as a trusted partner for next-generation electronic applications.

Process Technology: Precision Meets Reliability

Advanced Equipment & 혁신

UGPCB sets industry benchmarks in HDI PCB manufacturing through state-of-the-art equipment and process innovation:

• 레이저 드릴링: Achieves microvia processing as small as 0.075mm (3밀) with precision exceeding industry standards
• 마이크로 비아 기술: Hidden interconnections through next-layer vias eliminate fan-in/fan-out routing, significantly enhancing circuit density
• 임피던스 제어: Maintains +/-7% impedance tolerance for superior signal integrity in 5G and high-performance computing applications

Comprehensive Manufacturing Process

Our HDI production workflow integrates:

1. 레이저 드릴링: CO₂ laser systems ensure consistent hole quality and cleanliness
2. Plating Process: 12-18μm copper thickness guarantees electrical reliability
3. Pattern Transfer: Supports 1.5/1.5mil minimum line width/spacing for ultra-dense routing
4. Lamination Technology: Layer alignment accuracy within ±200μm ensures structural stability

We utilize high-performance PCB substrates including high-Tg FR-4 (140/150/170℃) and polyimide materials to ensure stable performance in high-temperature environments.

품질 보증 & Testing Systems

Multi-Layered Inspection Protocols

UGPCB implements rigorous quality control through:

• AOI (자동 광학 검사)
• Flying Probe Testing
• X-ray Inspection

Microvia Reliability

The inherent reliability of our microvia technology stems from:

• Thinner construction with 1:1 종횡비
• Superior signal transmission stability compared to traditional through-holes
• Enhanced long-term durability for demanding applications

응용: Empowering Cutting-Edge Technologies

UGPCB’s HDI PCBs power high-tech applications across multiple sectors:

• 5G Communication: High-frequency PCBs for 5G base stations and RF modules
• 자동차 전자: Stable signal transmission for navigation and entertainment systems
• 의료 기기: Precision data acquisition for patient monitors and surgical instruments
• 산업 제어: Efficient data exchange for PLCs and sensor networks

기술적 이점: UGPCB를 선택하는 이유는 무엇입니까??

Superior Performance Features

1. 공간 효율: Microvia/blind via designs reduce PCB footprint by up to 30%
2. 신호 무결성: Low-DK materials minimize signal delay and crosstalk for high-speed transmission
3. Design Flexibility: Enables complex circuits in compact spaces
4. 열 관리: Dedicated thermal layers improve heat dissipation for high-power applications

아르 자형&D Direction & 미래의 전망

Next-Gen Technology Investment

UGPCB actively develops HDI PCBs with:

• Higher density and finer lines
• Lower signal loss characteristics
• Laser drilling advancements
• Nanomaterial integration
• Smart manufacturing systems

Our R&D team focuses on advanced microvia technologies and material innovations to support client roadmaps for 5G, 일체 포함, and IoT devices.

결론: Your Trusted HDI PCB Partner

업계 리더십

As an HDI PCB technology leader, UGPCB delivers:

• Advanced process capabilities
• Stringent quality control
• Continuous technological innovation

Comprehensive Solutions

From smartphones to automotive systems, we provide total high-density interconnect solutions. Choosing UGPCB means selecting:

• Superior performance
• Reliable quality
• Technological foresight

Contact UGPCB today to explore how our HDI PCB technology can empower your next-generation products.