RID-FLEX PCB 제조 기능

UGPCB: An Industry Leader in Rigid-Flex PCB Manufacturing Capabilities

오늘날의 빠르게 진화하는 전자 제품 산업에서, the growing demands of 5G communications, 인공지능, 사물 인터넷 (IoT), 의료 전자, and aerospace have made RIDID-FLEX PCB an indispensable core component in high-end electronic devices. 선두로 PCB 제조업체, UGPCB has set an industry benchmark in Rigid-Flex PCB process capabilities with its sophisticated engineering expertise and advanced production equipment, delivering high-performance and highly reliable solutions to global customers.

Core Technical Parameters: Defining High Industry Standards

UGPCB’s Rigid-Flex PCBs feature a range of precise technical parameters that meet the most demanding application requirements:

• 레이어 수: 지원합니다 4 에게 24 layers of combined flexible and rigid PCBs, enabling high-density interconnect (HDI) designs to accommodate complex circuitry.

• 추적 너비/간격: As low as 1.5mil/1.5mil, with precision controlled within ±5%, 고주파 신호 무결성 보장.

• Board Thickness Control: Overall thickness ranges from 0.25mm to 6.0mm, with independent control for flexible and rigid sections.

• 임피던스 제어: Tolerances as tight as ±5%, ensuring quality signal transmission at frequencies above 10GHz.

• Bend Endurance: Flexible sections withstand over 100,000 bending cycles, with some products achieving up to 500,000 dynamic flex cycles (R=5mm, 180° reciprocating).

• 작동 온도: Stable performance in extreme environments from -55°C to +150°C, with zero failures after 1,000 열 충격 사이클.

Advanced Process Technologies: Breaking Through Traditional Manufacturing Barriers

Through continuous technological innovation, UGPCB has overcome multiple challenges in Rigid-Flex PCB manufacturing:

1. Laser Drilling Technology: Utilizes advanced 레이저 드릴링 to achieve 100μm microvias with smooth, burr-free hole walls, significantly improving multilayer interconnect reliability.

2. Adhesive-Free Lamination: Eliminates bubbles and delamination in flexible areas, with bend radii controllable within 0.5mm, greatly enhancing product durability and reliability.

3. “Step Copper” Technology at Rigid-Flex Junctions: Implements a gradual copper thickness transition from 0.5oz to 1oz, reducing bending stress by 38% and effectively preventing traditional “white spot” cracks.

4. Plasma and Chemical Surface Treatment: Achieves peel strength >1.2N/mm at rigid-flex interfaces, far exceeding industry standards.

5. Symmetrical Stack-Up Compensation Algorithm: Uses AI simulation with 200,000 iterative calculations to control warpage to ≤0.3%, compatible with 0.4mm pitch BGA assembly.

Exceptional Quality Control System

UGPCB has established a comprehensive quality control system to ensure high reliability and consistency:

• Full-Process AOI + AI Defect Prediction: Employs 자동 광학 검사 (AOI) and artificial intelligence for defect prediction, achieving a yield rate exceeding 98%.

• Flying Probe and 4-Wire Milliohm Testing: 용도 4-wire milliohm testing in flexible areas to ensure zero cold joints in RF and power lines.

• Full-Process MES Traceability: Each board comes with an “electronic birth certificate,” enabling precise post-sale traceability to batch and machine for rapid issue resolution.

Diverse Application Fields

UGPCB’s Rigid-Flex PCBs are widely used across multiple high-tech industries:

Customer Cases: Enabling Client Success

UGPCB collaborates with industry leaders to overcome technical challenges:

• AR Glasses Project: Developed a 12-layer Rigid-Flex PCB for a leading AR glasses manufacturer, reducing mainboard thickness from 2.1mm to 0.9mm, cutting device weight by 18g. RF traces embedded directly in the flexible area resulted in VSWR <1.3 그리고 a 7% improvement in antenna efficiency.

• TWS Earbuds Project: Supplied an 8-layer Rigid-Flex PCB for a top-three global TWS earbud brand, compressing mainboard thickness from 1.05mm to 0.65mm, increasing yield from 72% 에게 96%, and reducing signal delay per device by 0.8ns.

• Medical Device Project: Customized a 16-layer Rigid-Flex PCB for an international medical giant for use in a portable ultrasound diagnostic device, reducing equipment size by 40% and improving anti-interference performance by 60%.

Corporate Strength and Production Capacity

UGPCB possesses strong technical expertise and production capabilities:

• Production Bases: Two smart factories located in Shenzhen and Jiangxi, with a monthly capacity of 350,000 square feet.

• 아르 자형&D Investment: 8% of annual revenue is invested in exploring innovative process technologies and acquiring advanced equipment.

• 장비: Features a 2,000㎡ Class 1000 cleanroom equipped with German LPKF laser systems and Israeli Camtek inspection systems.

• Rapid Response: Offers 24-hour quick-turn PCB 프로토 타이핑 services and provides one-stop solutions from design review to volume production and PCBA 조립.

결론: Summary of UGPCB’s Advantages

UGPCB offers comprehensive advantages in the Rigid-Flex PCB manufacturing sector:

1. 기술 리더십: Capabilities include 1.5mil/1.5mil fine-line fabrication, 0.1mm micro blind via laser drilling, and advanced multilayer lamination.

2. Reliable Quality: Certified to multiple international standards, with full-process quality monitoring ensuring product yields over 98%.

3. Broad Applicability: 제품은 가전제품에 널리 사용됩니다., 자동차, 의료기기, 항공우주, and other high-tech fields.

4. 비용 효율성: Although initial costs may increase by 15%, overall assembly steps are reduced by 30%, and lifecycle costs decrease by 20% due to lower rework rates.

UGPCB is committed to providing global customers with superior Rigid-Flex PCB solutions through technological innovation and process upgrades, helping clients gain a competitive edge in the market. No matter your industry, if your product requires circuit board solutions that push the limits of space and performance, UGPCB is your most trusted partner.

To learn more about UGPCB’s Rigid-Flex PCB manufacturing capabilities, contact our expert team for the latest technical information and customized solutions.