UGPCB 18층 서버 PCB 솔루션 | 데이터센터용 고성능 컴퓨팅 PCB

UGPCB 18-Layer Server PCB: Engineered for High-Performance Computing & 데이터 센터

In the era of data centers and cloud computing, server stability and performance are critical to digital business operations. As the fundamental hardware carrier, the precision design and exceptional quality of Server PCB (인쇄 회로 기판) are paramount. Leveraging deep industry expertise and cutting-edge technology, UGPCB provides high-performance, highly reliable 18-layer server PCBs to meet the most demanding requirements of next-generation data center applications.

제품개요 & 정의

A server PCB is the core component of server motherboards, storage backplanes, and various functional daughter cards. It hosts critical components like CPUs, 메모리, and chipsets, facilitating high-speed signal transmission, 전력 분배, and system interconnection. Designed specifically for high-performance application servers, this UGPCB product utilizes an 18-layer high multilayer structure and an enhanced board thickness of 2.4mm ±10%, serving as a robust hardware foundation for processing massive datasets and supporting high-speed computations.

Core Design Highlights & 기술 분석

To address server platforms’ extreme demands for signal integrity, 전력 무결성, 열 관리, this product integrates several key technologies:

1. Advanced Stack-up & 재료:

   • 라미네이트: Utilizes ITEQ IT968G high-speed, low-loss material. Its high Tg (유리전이온도) ensures dimensional stability and consistent electrical performance under prolonged high-temperature server operation, effectively reducing signal transmission loss.

   • 레이어 & 구리 무게: An 18-layer complex stack-up with a meticulously designed hybrid copper weight scheme (featuring 2Oz thick copper foil on select inner layers). This optimizes the current-carrying capacity and thermal performance of power planes while enabling fine-line routing on high-speed signal layers.

2. Precision Routing & Interconnection:

   • Line Capability: Achieves ultra-fine line width/space of 0.1mm/0.1mm, meeting the fan-out and interconnection requirements for high-density BGA packages (예를 들어, CPU, GPU, FPGA).

   • 마이크로 비아 기술: Supports a minimum mechanical drill diameter of 0.20mm, enhancing routing density and space utilization.

3. Key Technologies for Signal Integrity:

   • 백 링: For high-speed differential signals (예를 들어, PCIE, SAS, 이더넷), the back-drilling process removes unused copper stubs from through-holes, significantly reducing signal reflection and attenuation. This is a core process for ensuring signal quality in 고속 PCB.

   • RTF Copper Foil: Uses Reverse Treated Foil, which provides a smoother copper surface. This effectively reduces skin effect loss for high-frequency signals, improving signal transmission efficiency.

4. Reliable Surface Finish:

   • 무전해 니켈 침지 금 (동의하다) is applied as the final surface treatment. ENIG provides a flat surface, excellent solderability, a reliable contact interface, and long-term oxidation resistance, making it ideal for soldering dense, fine-pitch 구성 요소 on server PCBs.

제품 기능 & 장점

• Exceptional Electrical Performance: High-speed IT968G laminate combined with back-drilling and RTF foil ensures low-loss, low-latency transmission of high-frequency signals, making it an ideal choice for 고주파 PCB 그리고 고속 PCB.

• Superior Power Handling & 열 관리: 2Oz inner-layer copper and the 2.4mm board design enhance current-carrying capacity, overall structural rigidity, and thermal conductivity.

• 고밀도 & 신뢰할 수 있음: The 18-layer routing space coupled with 0.1/0.1mm line width/space supports the most complex designs. Strict process control and high-Tg materials ensure long-term reliability for 24/7 uninterrupted operation.

• End-to-End Service Support: UGPCB offers not only top-tier PCB 제조 but also a one-stop solution from design review to production, accelerating your time-to-market.

생산 공정 개요

Our manufacturing adheres to stringent IPC 표준 and a quality management system:
Engineering Review → Material Preparation → Inner Layer Imaging → Lamination → Drilling & Back-Drilling → Hole Metallization → Outer Layer Imaging → Plating (for hybrid copper weight) → Solder Mask Application (Pre-ENIG) → ENIG → Routing / Profiling → Electrical Test & 최종검사

https://via.placeholder.com/800×450.png?text=18-Layer+PCB+Cross-Section
Alt Text: Cross-sectional view of an 18-layer server PCB board, detailing precise lamination and back-drilled via structures for high-speed signal transmission.

응용 & 분류

This high-performance PCB is widely used in:

• Enterprise & Cloud Server Motherboards

• Data Center AI Computing Acceleration Cards

• High-Performance Storage Servers & 백플레인

• Network Switch & Communication Equipment Core Boards

Technical Classification:

• 레이어 수에 의해: 높은 다층 PCB (18 레이어)

• 기술 별: High-Speed/High-Frequency PCB, Back-Drilled PCB, 무거운 구리 PCB

• 응용 프로그램에 의해: Server/Data Center PCB

• By Surface Finish: 동의하다 (무전해 니켈 침지 금) PCB

UGPCB를 선택하십시오, and you select more than just a high-quality server PCB board; you gain a trusted partner in advanced PCB manufacturing. We are dedicated to translating complex technical details into reliable advantages for your products, empowering your next-generation data center solutions.

Contact our expert team today for a customized PCB solution quote and technical consultation!