1.6mm 고열 FR-4 알루미늄 베이스 PCB | 단면 ENIG 2u” | LED 방열판 보드 – UGPCB

High-Thermal FR-4 Single-Side Aluminum Base PCB Product Overview & 정의

In today’s high-power, high-density electronic devices, 그만큼 thermal management capability of a 인쇄 회로 기판 (PCB) is critical for product reliability and longevity. UGPCB 1.6mm Single-Side Aluminum Base PCB (1 Layer Aluminum Core PCB) is an innovative solution that combines a high-Tg FR-4 laminate with an integrated thermal management structure. This design achieves an optimal balance between the excellent electrical properties of FR-4, 비용 효율성, and heat dissipation performance comparable to dedicated 금속 코어 PCB (MCPCB). 이것 Thermal Management PCB is specifically engineered to solve cooling challenges in applications like LED lighting and power conversion modules.

핵심 사양 & 기술 분류

• 레이어 수: 1 층 (Single-Sided PCB)

• 보드 두께: 1.6mm (기준, robust)

• Base Laminate Material: FR-4, 유리전이온도 (Tg) ≥ 150°C (High Tg FR-4 PCB)

• Thermal Structure: Integrated Aluminum Base Layer/Block (Metal Core PCB)

• 표면 마감: 무전해 니켈 침지 금 (동의하다), 2 micro-inches Gold Thickness (대략. 0.05μm)

• Legend/Silkscreen: White LPI Solder Mask, Black Text (High contrast for clear identification)

과학적 분류:

1. 레이어 수에 의해: Single-Sided Board.

2. By Substrate Type: Rigid Composite Metal Core Printed Circuit Board.

3. By Thermal Performance: High Thermal Conductivity PCB.

4. By Primary Application: High-Power LED Heat Sink Board, Power Supply Cooling Board.

설계 지침 & Operating Principle

주요 설계 고려 사항:

1. Heat Source Placement: High-heat-dissipation components (예를 들어, LED chips, power MOSFETs) should be placed on pads directly connected to or in close proximity to the aluminum base thermal pad area to ensure the shortest thermal path.

2. Electrical Isolation: Although it features a metal base, electrical isolation between the circuit and the metal core is maintained through the FR-4 dielectric layer 그리고 a thermally conductive insulating layer. Design must ensure the required insulation withstand voltage (일반적으로 >2KV) is met.

3. Copper Weight Selection: Choose appropriate copper foil thickness (standard 1oz/2oz) based on current-carrying requirements. Widen traces or use copper pours for high-current paths.

4. ENIG Finish Advantage: 그만큼 2유” ENIG surface finish provides excellent flatness and solderability, ideal for fine-pitch SMT components and connectors subject to repeated mating cycles.

Operating Principle:

The core functionality of this PCB 보드 is to utilize the high thermal conductivity of aluminum (대략. 200 w/m · k) to rapidly absorb and spread heat generated by components on the circuit layer. The heat is then dissipated into the environment via the chassis or an external heatsink attached to the board. The structure acts as a “thermal highway,” conducting heat from localized hotspots across the entire metal base area, significantly lowering junction temperatures and enhancing system stability.

재료, 건설 & 주요 특징

사용된 재료:

• 회로 레이어: Electro-Deposited (에드) 구리 포일

• Dielectric/Insulating Layer: High-Tg FR-4 Epoxy Glass Laminate (Tg 150)

• Thermal Core Layer: Aluminum Alloy Plate (일반적으로 5052 또는 6061)

• 표면 마감: 무전해 니켈 침지 금 (/또는)

• Legend Ink: High-Temperature Resistant White LPI Solder Mask, Black Legend Ink

Board Construction:

The stack-up, from top to bottom, ~이다: White Solder Mask Layer (with Black Legend) -> 2u” ENIG Pads/Traces Layer -> FR-4 Dielectric Insulation Layer -> Aluminum Metal Substrate. 이것 “샌드위치” construction ensures optimal electrical performance alongside superior thermal management.

Core Performance & 특징:

1. Superior Heat Dissipation: Integrated aluminum core provides thermal conductivity far exceeding standard FR-4 PCB 보드, effectively reducing component operating temperatures by 20%-40%.

2. 높은 신뢰성: 그만큼 FR-4 TG150 소재 offers enhanced thermal endurance, maintaining mechanical stability in high-temperature environments and minimizing solder joint fatigue from CTE mismatch.

3. 우수한 납땜 가능성: 그만큼 무전해 니켈 침지 금 (동의하다) finish 아파트를 제공합니다, oxidation-resistant, and highly solderable surface, 미세 피치 부품에 적합.

4. Mechanical Robustness: The 1.6mm overall thickness combined with the metal core results in a PCB 보드 with higher mechanical strength, resisting bending and vibration.

5. 명확한 식별: The white-on-black legend printing offers excellent readability during assembly and servicing.

6. Cost-Effective Solution: Compared to full ceramic substrates or high-end pure aluminum PCBs, this solution provides superior thermal performance while maintaining a competitive PCB 제조 비용.

제조공정 & Key Techniques

UGPCB strictly adheres to IPC 표준. The core manufacturing workflow is as follows:

1. 패널화 & Prep: Cutting the FR-4 and aluminum core laminate material.

2. 이미징 & Pattern Transfer: Transferring the circuit pattern onto the copper layer via photolithography.

3. 에칭: Forming precise copper traces.

4. 교련 (if required): For mounting holes or thermal vias.

5. 솔더 마스크 & Legend Application: Coating with white LPI solder mask, followed by exposure, 개발, and printing of black legend.

6. 표면 마감: Applying a precisely controlled Electroless Nickel Immersion Gold process to create nickel and gold layers on exposed pads, ensuring a consistent gold thickness of 2 마이크로인치.

7. 라우팅 & Profiling: Board outline routing or V-scoring.

8. Electrical Test & 최종검사: 100% Flying Probe or Fixture testing to ensure circuit continuity and electrical isolation.

기본 응용 프로그램 & 사용 사례

이것 High-Thermal Single-Side Aluminum Core PCB is the ideal choice for a wide range of medium-to-high power electronic applications requiring efficient cooling:

• LED 조명: LED Heat Sink Boards (PCB MCPCBs) for high-power LED street lights, industrial lamps, and automotive lighting, significantly extending LED lifespan by mitigating lumen depreciation.

• 전원 모듈: Switching Mode Power Supplies (SMPS), DC-DC 변환기, and power sections of motor drivers.

• 자동차 전자: Power management systems and LED controller boards in new energy vehicles.

• 가전제품: High-end audio amplifiers, power amplifier modules in routers.

• 산업 제어: IGBT heatsink substrates in variable frequency drives and servo drives.

Why Choose UGPCB’s Aluminum Base PCB Solution?

As a professional PCB 제조업체, UGPCB not only supplies standard products but also offers customization based on your specific thermal requirements (예를 들어, locally thickened aluminum base), electrical insulation needs, and mechanical form factors. We are committed to supporting your project from initial design review through to volume production, 보장 PCB 보드 quality and on-time delivery.

오늘 저희에게 연락하세요 for a free quote and technical consultation on your High-Power Thermal Management PCB Solution. Let our expert design and manufacturing capabilities enhance the reliability and performance of your products.