1. 제품개요: What Is a Cooker Hood Mother Board PCB?
A cooker hood mother board PCB (인쇄 회로 기판) serves as the central hardware backbone of a range hood control system. This rigid printed circuit board handles all electrical connections and signal transmission tasks for motor driving, touch sensing, LED lighting control, airflow adjustment, and delayed shut‑off functions.
UGPCB presents this cooker hood motherboard PCB manufactured with Kingboard KB6165G high-end laminate. This double-sided rigid printed circuit board is specifically engineered for long‑term reliable operation in harsh kitchen environments. 그만큼 PCB measures 82.63 × 46.7 mm with a standard 1.6 mm 보드 두께. Its double‑sided routing structure delivers excellent electrical performance and mechanical strength for medium‑complexity control circuits.
Industry data shows that China’s range hood control board shipments reached 38.60 백만 단위 2024, marking a 5.7% year‑over‑year growth. Smart control boards now account for 58.7% of total shipments. Given this substantial market demand, selecting a reliable and well‑manufactured cooker hood PCB directly impacts the end product’s quality and user experience.
2. 제품 정의 및 기술 사양
2.1 기본 매개변수
| 매개 변수 | 사양 |
|---|---|
| 제품명 | 쿠커후드 마더보드 PCB |
| Laminate Material | Kingboard KB6165G (Halogen‑Free TG150 Glass Fiber Copper‑Clad Laminate) |
| 보드 두께 | 1.6 mm |
| 레이어 수 | 2 레이어 (Double‑Sided Board) |
| 완성 된 크기 | 82.63 × 46.7 mm |
| 최소 구멍 직경 | 0.296 mm |
| 최소 선 너비 / 줄 간격 | 0.342 mm / 0.37 mm |
| 동박 두께 | 1/1 온스 (35 층당 μm) |
| 표면 마감 | 무전해니켈 / 이머젼 골드 (동의하다 / Gold Plating Process) |
| 솔더 마스크 / 전설 | Black Solder Mask / 흰색 실크스크린 전설 |
2.2 Laminate Material: Kingboard KB6165G
This product uses KB6165G, a halogen‑free TG150 glass fiber copper‑clad laminate from Kingboard Laminates Holdings Ltd. This industrial‑grade high‑performance laminate delivers the following key properties:
- 유리전이온도 (Tg) : 150℃ (155‑158°C measured by DSC method). The material withstands three lead‑free reflow soldering cycles with a peak temperature of 260°C.
- 비교 추적 인덱스 (CTI) : 600 다섯. This represents a threefold improvement over the base model KB‑6165F (CTI ≥ 175 다섯), offering exceptional resistance to tracking failure.
- Z‑axis Coefficient of Thermal Expansion (CTE) : 알파 1 ~에 41 ppm/°C, 알파 2 ~에 235 ppm/°C.
- T288 Delamination Time : > 60 분, several times higher than standard FR‑4 materials.
- 열분해 온도 (Td, 5% 체중 감량) : 370℃.
- 가연성 등급 : UL94 V-0.
- 표면 저항 : 5.2 × 10⁸MΩ.
- 부피 저항성 : 6.1 × 10⁹ MΩ‑cm.
- 껍질 힘 : 1.4 N/mm (~을 위한 1 온스 구리 호일).
This laminate passes 96‑hour salt spray testing and is free of halogens, antimony, and red phosphorus, fully complying with RoHS environmental directives.
3. Design Principles and Operating Principles
3.1 Design Standard Compliance
This product’s design strictly followsIPC‑2221C, 인쇄 기판 설계에 대한 일반 표준 (released August 18, 2025). IPC‑2221C serves as the foundation design standard for all documents in the IPC‑2220 series. It establishes generic requirements for printed board design, covering material selection, copper foil selection, minimum electrical clearance, impedance tolerances, and other core design specifications.
3.2 Engineering Basis for Line Width and Spacing Design
This product features a design line width of 0.342 mm and line spacing of 0.37 mm. These parameters are determined based on the current‑carrying capacity formula from the IPC‑2221 standard:
나는 = k × ΔT^0.44 × A^0.725
어디:
- 나 = Maximum allowable current (Amperes, 에이)
- 케이 = 보정 계수 (0.048 for outer layer traces, 0.024 for inner layer traces)
- ΔT = Temperature rise (℃)
- 에이 = Conductor cross‑sectional area (밀²)
For this product with 1 온스 구리 호일 (약 35 μm thickness), outer layer traces can carry approximately 1.5‑2 A per millimeter of width at a 10°C temperature rise. 그만큼 0.342 mm line width sufficiently meets the current‑carrying demands of range hood control circuits (typically including motor drive currents of 3‑5 A and touch/logic circuit currents below 1 에이), while providing adequate process windows for subsequent PCBA soldering operations.
3.3 작동 원리
The cooker hood motherboard PCB functions as the physical carrier of the control system, operating at three levels:
Electrical Connection Level : The copper traces on the PCB electrically connect the MCU (main control chip), touch sensing modules, motor driver ICs, LED driver circuits, and power management modules according to the schematic diagram, enabling orderly signal transmission.
Signal Processing Level : User commands entered through the touch panel (power on/off, airflow adjustment, lighting control, 등.) travel via touch traces on the PCB to the MCU. 처리 후, the MCU outputs corresponding control signals through the driver traces on the PCB to activate motors, LED 조명, and other actuating components.
Power Management Level : Power traces on the PCB convert the input AC or DC power to the operating voltages required by each component. Proper power/ground plane layout ensures power supply stability.
4. 제품 분류
Based on printed circuit board industry classification standards, 이 제품은 다음 카테고리에 속합니다:
| 분류 차원 | 범주 |
|---|---|
| 구조 별 | Rigid Printed Circuit Board |
| 레이어 수에 의해 | Double‑Sided Board (2‑Layer Board) |
| By Laminate Material | FR‑4.1 Grade Halogen‑Free Glass Fiber Copper‑Clad Laminate (KB6165G) |
| 표면 마감별 | 무전해니켈 / 이머젼 골드 (동의하다) |
| 응용 프로그램에 의해 | Home Appliance Control Board (Cooker Hood Mother Board) |
| 가연성 등급별 | UL94 V-0 |
| 환경 규정 준수 | Halogen‑Free, ROHS 준수 |
당IPC‑6012F, 경질 인쇄 기판의 자격 및 성능 사양 (released September 2023), this product meets수업 2 – 전용 서비스 전자 제품 요구 사항. 수업 2 applies to products where extended life is expected and uninterrupted service is desired, but the operating environment is not extreme—perfectly matching home appliance applications.
5. 사용된 재료
5.1 기판: KB6165G Copper‑Clad Laminate
As detailed above, this product uses Kingboard KB6165G halogen‑free TG150 glass fiber copper‑clad laminate with the following material composition:
- Reinforcement : Electronic‑grade glass fabric
- Matrix Resin : Halogen‑free epoxy resin (150°C)
- 구리 포일 : 1 oz Electrolytic Copper Foil (ED 구리)
- Flame Retardant System : Halogen‑free flame retardant (UL94 V-0)
5.2 표면 마감: 무전해니켈 / 이머젼 골드 (동의하다)
This product uses the Electroless Nickel / 이머젼 골드 (동의하다) surface finish process. 당IPC‑4552B, Specification for Electroless Nickel/Immersion Gold (동의하다) 인쇄 기판용 도금 (published May 2021), ENIG deposit thickness requirements are:
- Nickel Layer Thickness : 3‑6 μm (per IPC‑4552B Class 1/2/3)
- Gold Layer Thickness : 0.05‑0.10 μm (typical range: 0.075‑0.125 μm)
ENIG surface finish offers these advantages:
- 우수한 납땜성, meeting the highest coating durability rating per IPC‑J‑STD‑003
- Superior oxidation and corrosion resistance
- Flat surface suitable for fine‑pitch component soldering
- Suitable for wire bonding and contact finish applications
5.3 솔더 마스크 및 범례
- 솔더 마스크 : Black ink offering excellent insulation and heat resistance
- 전설 : White silkscreen providing high contrast for SMT placement and repair identification
6. 제품 구조 및 성능 특성
6.1 구조적 특징
Double‑Sided Design (2 레이어) : Both the Top Layer and Bottom Layer contain circuit traces, with electrical connections between layers made through Plated Through‑Holes (PTH). The double‑sided structure balances routing density with cost‑effectiveness.
Precision Hole Diameter Control : Minimum hole diameter of 0.296 mm meets the strict requirements of IPC‑6012F for plated through‑holes. Copper plating on hole walls ensures reliable interlayer connections and conductivity.
Compact Dimensions : 그만큼 82.63 × 46.7 mm compact size is specifically tailored for the limited internal space of range hoods, facilitating overall product mechanical design.
기준 1.6 mm Board Thickness : This thickness maintains mechanical strength while matching standard component lead lengths, 촉진 PCB 집회.
6.2 성능 특성
Superior Heat Resistance : With Tg of 150°C and Td of 370°C, the board withstands the high‑temperature impact of lead‑free reflow soldering (최고 260°C).
Excellent Insulation Performance : Surface resistivity of 5.2 × 10⁸ MΩ and volume resistivity of 6.1 × 10⁹ MΩ‑cm ensure reliable signal transmission in high‑humidity kitchen environments.
High CTI Tracking Resistance : The CTI 600 V rating effectively prevents tracking failure in high‑pollution environments (kitchen fume environments fall under Pollution Degree 2‑3).
Good Anti‑CAF Performance : The laminate offers strong resistance to Conductive Anodic Filament (CAF) 형성, reducing the risk of CAF failure in moist‑heat environments.
UL94 V‑0 Flammability Rating : Meets the highest fire safety requirements for home appliances.
7. 제조 공정 흐름
UGPCB manufactures this cooker hood motherboard PCB in strict compliance with IPC‑6012F requirements:
단계 1: 들어오는 품질 관리 (IQC) → Inspect KB6165G copper‑clad laminate, 구리박, 드라이 필름, solder mask ink, 및 기타 원료
단계 2: 절단 → Cut large copper‑clad laminate sheets to working panel size
단계 3: 교련 → CNC drilling machines process the 0.296 mm minimum hole diameter along with other mounting holes and vias
단계 4: 무전해 구리 증착 / 패널 도금 → Metallize hole walls to create conductive through‑holes
단계 5: 패턴 전송 → Apply dry film → Expose → Develop to form the circuit pattern
단계 6: 에칭 → Remove unprotected copper to create the designed circuit traces
단계 7: 솔더 마스크 → Print black solder mask ink → Expose → Develop to expose pads
단계 8: 동의하다 (무전해니켈 / 이머젼 골드) → Electroless nickel plating (3‑6 μm) + 이머젼 골드 (0.05‑0.10 μm)
단계 9: 범례 인쇄 → Print white silkscreen legend identifiers
단계 10: 라우팅 / V‑Cut → CNC routing to final dimensions of 82.63 × 46.7 mm
단계 11: 전기 테스트 → 플라잉 프로브 테스트 / fixture testing to verify open/short circuit integrity
단계 12: 최종 품질 관리 (FQC) → Visual inspection and dimensional inspection per IPC‑6012F Class 2 표준
단계 13: 포장 및 배송 → Vacuum packaging + anti‑static bags, 준수 IPC packaging specifications
8. Application Scenarios and Market Applications
8.1 기본 애플리케이션 시나리오
This cooker hood motherboard PCB is widely used in:
- Residential Range Hoods : Main control circuit boards for touch‑control or button‑type range hoods
- Integrated Cooktop Control Boards : Core control units for integrated cooking appliances
- Smart Kitchen Appliances : Control modules for smart range hood and cooktop integrated systems
- Commercial Kitchen Equipment : Control boards for large commercial exhaust systems
8.2 시장 전망
China’s small appliance control board market is projected to reach approximately RMB 45 10 억입니다 2025, with year‑over‑year growth of 10.3%. Smart control boards now account for over 60% of the market. The Chinese home appliance control board market is in a critical stage of smart transformation and upgrade, driving sustained demand for high‑performance, high‑reliability cooker hood motherboard PCBs.
8.3 Typical Operating Environment
The cooker hood motherboard PCB operates under these conditions:
- Temperature Range : ‑10°C to +85°C (kitchen environment)
- Humidity Range : 20% 에게 90% RH (significant steam generated during cooking)
- 오염도 : Pollution Degree 2‑3 (fume and dust)
- 진동 : Continuous vibration from motor operation
9. Why Choose UGPCB for Your Cooker Hood Mother Board PCB?
✅국제 표준 준수 : Full adherence to IPC‑2221C and IPC‑6012F international standards throughout design, 조작, 및 검사
✅Premium Laminate Materials : Kingboard KB6165G industrial‑grade laminate with Tg 150°C, CTI 600 다섯, and UL94 V‑0 rating
✅정밀 제조 역량 : Minimum hole diameter of 0.296 mm 및 최소 선폭 0.342 mm
✅우수한 표면 마감 : ENIG finish compliant with IPC‑4552B, offering excellent solderability
✅환경 준수 : Halogen‑free materials meeting RoHS and REACH directives
✅맞춤 서비스 : Flexible customization of dimensions, 레이어 수, 라미네이트 재료, 및 표면 마무리
✅빠른 배송 : Quick‑turn capability from prototypes to volume production
견적 요청
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UGPCB is committed to providing high‑quality cooker hood motherboard PCB 제조 services to customers worldwide. 프로토타입 샘플이 필요한지, 대량 생산이 필요한지 여부, we offer professional technical support and competitive pricing.
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💡 Please provide the following information for an accurate quote:
- PCB dimensions, 레이어 수, and laminate material requirements
- Minimum line width/spacing and minimum hole diameter
- Surface finish requirements
- Copper foil thickness requirements
- Quantity requirements (원기 / 작은 배치 / 대량 생산)
- 거버 파일 (가능하다면)
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데이터 소스 선언
The technical data and standards cited in this article are sourced from the following authoritative organizations and publicly available materials:
- IPC‑6012F : 경질 인쇄 기판의 자격 및 성능 사양, 구월 2023, IPC International, Inc.
- IPC‑2221C : 인쇄 기판 설계에 대한 일반 표준, 팔월 18, 2025, IPC International, Inc.
- IPC‑4552B : Specification for Electroless Nickel/Immersion Gold (동의하다) 인쇄 기판용 도금, May 2021, IPC International, Inc.
- KB‑6165G / KB‑6165GMD Technical Data Sheet : Kingboard Laminates Holdings Ltd. official product technical documentation
- UL94 : 기기 및 가전제품 부품용 플라스틱 재료의 난연성 시험에 대한 표준, Underwriters Laboratories Inc.
- IPC‑TM‑650 : 테스트 방법 매뉴얼, IPC International, Inc.
