1. 제품개요
현장에서 고밀도 상호 연결 (HDI) 인쇄 회로 기판, 그만큼12-layer 2+N+2 board represents an important direction in advanced PCB manufacturing technology. UGPCB12-layer 2+N+2 HDI board uses ISOLA high-performance substrate material, with a finished board thickness of 2.0 mm, 1 oz copper on both outer and inner layers, a minimum via diameter of 0.1 mm, line width/spacing of 0.1 mm, BGA pad diameter of 0.15 mm, and electroless nickel/immersion gold (동의하다) 표면 마감.
이것12-층 PCB is a typical high-density interconnect 다층 보드 suitable for electronic products with demanding requirements for signal integrity, routing density, 신뢰성. 로서2+N+2 structure HDI 보드, it features two buildup layers on each side, with N core layers in the middle, supporting stacked or staggered microvia structures.
2. 제품 정의
2.1 What Is a 2+N+2 HDI Board?
에이2+N+2 HDI 보드 is a high-density interconnect printed circuit board manufactured using a sequential lamination process. 그만큼 “2” in its name represents two buildup layers on each side, ~하는 동안 “N” represents the number of core layers in the middle. For this product, the total layer count is 12, meaning a 2+8+2 structure — two buildup layers on each side and eight core layers in the middle.
이것HDI PCB belongs to Type III (as defined by IPC-2226), a commonly used HDI stackup solution supporting medium pin-count, 고밀도 BGA 요소 라우팅. 그만큼2+N+2 PCB stackup design significantly improves routing density, supports successful routing of ultra-fine-pitch BGAs with pitches as small as 0.4 mm, reduces overall layer count, and minimizes signal attenuation.
2.2 Applicable International Standards
The design, 조작, and acceptance of this product strictly comply with the following IPC international standards:
- IPC-6012F -경질 인쇄 기판의 자격 및 성능 사양: This is the internationally recognized performance specification for rigid printed circuit boards, covering the entire process from material selection to finished product, including quality indicators, qualification, and performance requirements for each process step.
- IPC-2221C -인쇄 기판 설계에 대한 일반 표준: This is the foundation design standard for all documents in the IPC-2220 series, establishing generic requirements for printed board design.
- IPC-4101E -경질 및 다층 인쇄 기판용 기본 재료 사양: This specification covers requirements for base materials (laminate or prepreg) used primarily for rigid or multilayer printed boards.
3. 설계 지침
3.1 2+N+2 Stackup Structure Design
그만큼12-layer 2+N+2 PCB stackup design follows the core design principles for HDI boards:
- Priority on ground planes: Ground planes are prioritized because they transmit signals in microstrip configurations.
- Low impedance and low noise: A ground-plane-based 12-layer PCB 설계 achieves low ground impedance and low noise.
- High-speed signal routing: Intermediate layers between planes are used for high-speed signal traces, with tight coupling between signal layers.
- Adjacent plane and signal layers: Plane layers and signal layers should be placed on adjacent layers.
- Tight plane coupling: Large-area power and ground planes should be tightly coupled together.
3.2 신호 무결성 설계
Per IPC-2221C, impedance tolerance and conductor layer isolation areas are critical considerations in 고속 PCB 설계. For the12-layer 2+N+2 HDI board, special attention should be paid to:
- 임피던스 제어: 와 함께 1 온스 구리 (약 35 μm) on both outer and inner layers, precise line width/spacing control is required to achieve target impedance.
- Microvia structure: 그만큼 0.1 mm minimum via diameter falls within the microvia category (≤ 0.15 mm as defined by IPC-2221 and IPC-6012).
- BGA breakout: 그만큼 0.15 mm BGA pad combined with 0.1 mm line width/spacing supports successful breakout for 0.4 mm pitch BGAs.
4. 작동 원리
그만큼12-layer 2+N+2 HDI board operates based on the interconnection and signal transmission of multiple conductive layers. Its core operating mechanisms include:
4.1 Signal Transmission Paths
HDI boards achieve interlayer electrical connections through the following via types:
- 블라인드 비아: Connect from an outer layer to a specific inner layer without penetrating the entire board thickness.
- 매장된 비아: Exist only between inner layers.
- Stacked microvias: Multiple microvias stacked vertically to form a path through multiple buildup layers.
4.2 Power Distribution and Grounding
The power distribution network (PDN) 의12-레이어 PCB is optimized through:
- Large-area power planes tightly coupled with ground planes, forming effective decoupling capacitance.
- Ground layers serving as return paths for signals, reducing loop inductance.
- Signal layers tightly coupled with adjacent plane layers, reducing electromagnetic interference (EMI).
5. 기본 응용 프로그램 및 사용 사례
5.1 Target Application Areas
그만큼12-layer 2+N+2 HDI board, with its high-density interconnect capability and excellent electrical performance, is primarily used in the following areas:
| 적용분야 | Typical Products | Key Requirements |
|---|---|---|
| 5G 인프라 | 5G 기지국, AAU, RRU | High frequency, 고속, 낮은 손실 |
| 데이터 센터 | 서버, 스위치, 저장 장치 | High-speed data transmission, 높은 신뢰성 |
| 고성능 컴퓨팅 | AI 가속기 카드, HPC | High-density BGA, 신호 무결성 |
| Wired/Wireless Communications | Optical modules, 라우터, microwave equipment | High-frequency performance, low insertion loss |
| 자동차 전자 | ADAS, 자동차 레이더 (77 GHz) | 높은 신뢰성, temperature resistance |
| 항공우주 및 국방 | 항공전자공학, 레이더 시스템 | Extreme environment reliability |
ISOLA materials such as TerraGreen® 400G are specifically suited for next-generation 5G infrastructure, data center systems, 고성능 컴퓨팅, wired/wireless communications, and AI applications, supporting extremely high data transmission rates exceeding 100 GB/s.
5.2 Compatible Product Types
- High-end smartphone mainboards
- Communication base station RF boards
- High-performance server backplanes
- AI training/inference accelerator cards
- High-speed optical modules
- Automotive radar sensor boards
6. 제품 분류
Based on standard PCB industry classification methods, this product can be scientifically categorized as follows:
6.1 By Product Structure
Rigid board — Manufactured using rigid substrate materials (FR4/ISOLA).
6.2 레이어 수에 의해
다층 기판 — Featuring 12 전도성 층, bonded by insulating dielectric materials and interconnected through vias.
6.3 By Manufacturing Process
HDI 보드 (고밀도 상호 연결 보드) — Featuring a 2+N+2 sequential lamination structure, classified as a second-order HDI board (2+C+2).
6.4 By IPC-2226 Stackup Type
Type III stackup — 2+N+2 or higher-order stacked/staggered microvia structures.
6.5 By IPC-6012 Quality Class
Available to meet수업 2 (dedicated-service electronic products) 또는수업 3 (신뢰성이 높은 전자제품) requirements as per customer specifications.
7. 사용된 재료
7.1 기판: ISOLA Series Materials
This product uses ISOLA high-performance copper-clad laminates. ISOLA is a leading material supplier in the high-frequency, high-speed PCB sector, with its products widely used in high-speed digital, high-frequency analog, RF/microwave, and other advanced circuit designs.
Typical properties of ISOLA materials (TerraGreen® 400G as an example):
| 재산 | 전형적인 가치 | 테스트 방법 |
|---|---|---|
| 유리전이온도 (Tg DSC) | 200℃ | IPC-TM-650 2.4.25C |
| 유리전이온도 (Tg DMA) | 215℃ | IPC-TM-650 2.4.24.4 |
| 분해 온도 (Td @5% weight loss) | >380℃ | IPC-TM-650 2.4.24.6 |
| 유전 상수 (DK) | 3.15 | IPC-TM-650 2.5.5.5 |
| 소산 인자 (Df) | 0.0017 | IPC-TM-650 2.5.5.5 |
| UL 가연성 등급 | UL 94 다섯-0 | UL File E41625 |
ISOLA materials comply with IPC-4101/134 and offer the following advantages:
- Halogen-free and RoHS compliant
- 우수한 CAF (conductive anodic filament) 저항
- 낮은 수분 흡수
- Withstands up to 6 reflow cycles at 260°C
- FR-4 process compatible — can be processed using standard PCB 장비
7.2 구리 포일
- Inner and outer layer copper thickness: 1 온스 (약 35 μm)
- Copper foil type: HVLP3 (ultra-low profile) or RTF (역처리된) copper foil available upon request
7.3 보드 두께
- 완성된 보드 두께: 2.0 mm
8. 성능 사양
8.1 Key Electrical Specifications
| 매개 변수 | 사양 | 메모 |
|---|---|---|
| 레이어 수 | 12 레이어 | 2+N+2 structure |
| 완성된 보드 두께 | 2.0 mm | - |
| 외층 구리 두께 | 1 온스 (35 μm) | 완성된 구리 |
| 내층 구리 두께 | 1 온스 (35 μm) | - |
| Minimum Via Diameter | 0.1 mm | Laser-drilled microvia |
| 최소 선 너비 | 0.1 mm | - |
| 최소 줄 간격 | 0.1 mm | - |
| BGA Pad Diameter | 0.15 mm | 지원합니다 0.4 mm 피치 BGA |
| 표면 마감 | 동의하다 (전기 니켈/침지 금) | IPC-4552 compliant |
8.2 Reliability Performance
IPC-6012F에 따라, rigid printed boards must meet the following reliability requirements:
- Electrical performance: 단열성 저항, dielectric withstanding voltage, 임피던스 제어, 등.
- Mechanical performance: 박리강도, 뒤틀림, 치수 안정성, 등.
- Environmental performance: 열 사이클링, 습도 테스트, salt spray testing, 등.
IPC-6012F has introduced several new requirements for microvia structure reliability, including copper wrap plating, intermediate target lands, microsection evaluation, inner layer plating, and dielectric spacing and reliability issues for microvia structures.
IPC-6012F has increased the minimum copper thickness requirement for plated-through hole barrel walls — raised to 28 μm for Class 3/A (previously 25 μm).
8.3 열 성능
ISOLA materials with Tg ≥ 200°C and Td > 380°C support lead-free soldering processes and multiple reflow cycles.
9. 제품 구조
그만큼2+N+2 HDI 보드 via structure includes:
- Laser blind vias: From outer layers (L1/L12) to Layer 3/Layer 10 (buildup section), 0.1 mm diameter
- Laser blind vias: From Layer 3/Layer 10 to inner core layers
- Mechanical through vias: Through the core section (레이어 4-9)
- Stacked microvias: Blind vias can be stacked vertically for multi-layer connections
10. 제품 기능
10.1 고밀도 상호 연결 기능
- 0.1 mm microvias: Support ultra-high-density routing
- 0.1 mm line width/spacing: Enable fine-line design
- 0.15 mm BGA pads: 지원하다 0.4 mm pitch ultra-fine-pitch BGAs
10.2 우수한 신호 무결성
- ISOLA low-loss material (Df만큼 낮음 0.0017) ensures low high-frequency signal attenuation
- 2+N+2 structure supports precise impedance control
- Ground planes tightly coupled with signal layers reduce EMI
10.3 높은 신뢰성
- Complies with IPC-6012F Class 2/Class 3 요구 사항
- ISOLA material with Tg ≥ 200°C and Td > 380℃
- ENIG surface finish provides excellent solderability and oxidation resistance
10.4 프로세스 호환성
- ISOLA materials are compatible with standard FR-4 process flows
- 순차적 라미네이션 지원
- Allows multiple reflow cycles
11. 제조 공정 흐름
The 12-layer 2+N+2 HDI board manufacturing process is as follows:
11.1 Core Board Manufacturing (내부 레이어)
- 재료 절단: Cut ISOLA substrate per MI requirements
- 내층 회로 형성: Apply photoresist → expose → develop → etch → strip to form inner layer circuit patterns
- Inner layer AOI: Automated optical inspection to ensure circuit quality
- 브라운 옥사이드 처리: Enhance adhesion between inner layer copper and prepreg
11.2 First Lamination
- 스택업: Stack inner layer cores with prepreg per the stackup structure
- 라미네이션: Bond multiple layers into one unit under high temperature and pressure
11.3 First Drilling and Via Metallization
- 레이저 드릴링: Drill 0.1 mm microvias
- desmear: Remove carbonized residue from laser drilling
- Via metallization: Electroless copper deposition to form conductive layer on via walls
- Panel plating: Build up copper thickness on via walls
11.4 Buildup Layer (외층) 조작
- 외층 회로 형성: Repeat inner layer circuit formation process
- Outer layer AOI: 자동화된 광학 검사
11.5 Second Lamination (필요한 경우)
- Secondary lamination: Multiple sequential lamination steps may be required for 2+N+2 structures
11.6 Final Finishing
- Outer layer drilling: Mechanical through-hole drilling
- Via metallization and plating: Through-hole metallization and copper build-up plating
- 외부 레이어 회로: Form outer layer circuit patterns
- 솔더 마스크: Apply solder mask ink
- 표면 마감: 동의하다 (전기 니켈/침지 금) — electroless nickel (3-6μm) + 침수 금 (0.05-0.1μm) IPC-4552의 경우
- 범례 인쇄: Silk-screen component designators and other markings
- 프로필 라우팅: 라우팅, V- 컷, 등.
- 전기 테스트: 플라잉 프로브 or fixture testing
- Final inspection: Visual inspection and packaging
12. ENIG Surface Finish Advantages
이 제품은동의하다 (전기 니켈/침지 금) 표면 마감, offering the following core advantages:
| 이점 | 설명 |
|---|---|
| 우수한 표면 평탄도 | Ideal for fine-pitch BGA and SMT assembly |
| Superior solderability | Supports multiple reflow cycles (3+ 타임스) |
| 긴 유통기한 | 12+ months storage life |
| Strong oxidation resistance | Gold layer protects copper from oxidation |
| 좋은 전기 전도성 | Suitable for high-frequency signal transmission |
The ENIG process chemically deposits a nickel-phosphorus alloy layer (approximately 3–6 μm thickness) 그리고 금층 (approximately 0.05–0.1 μm thickness) on the PCB copper surface.
13. Why Choose UGPCB’s 12-Layer 2+N+2 HDI Board?
- International standard compliance: Strictly follows IPC-6012F, IPC-2221C, IPC-4101E, 및 기타 국제 표준
- Premium material assurance: Uses ISOLA high-performance substrate for high-frequency, high-speed performance
- 고급 제조 능력: Precision processing for 0.1 mm microvias and 0.1 mm line width/spacing
- Comprehensive quality control: Full-process quality management from incoming material inspection to final product testing
- Professional engineering support: Provides DFM (제조 가능성을위한 설계) reviews and impedance design support
14. 견적 요청
UGPCB is committed to providing high-qualityHDI PCB manufacturing services to customers worldwide. Whether you need a12-layer 2+N+2 HDI board or other layer counts and structures of다층 PCB, we offer professional technical support and competitive pricing.
견적을 받는 방법:
- Submit design files: Gerber 파일 보내기, 드릴 파일, and stackup specifications to our sales team
- Specify technical requirements: Include impedance requirements, material preferences, 표면 마감, 수량, 등.
- Engineering review: Our engineers will perform DFM checks to ensure manufacturability
- Receive a quote: Get a competitive price and lead time quickly
문의하기
Send yourPCB design files to our sales email or submit an inquiry through our website. Our technical team will respond within 24 시간.
데이터 소스 설명
The technical data and standard information cited in this document are sourced from the following authoritative organizations:
- IPC (전자산업을 연결하는 협회) — IPC-6012F경질 인쇄 기판의 자격 및 성능 사양 (구월 2023); IPC-2221C인쇄 기판 설계에 대한 일반 표준 (December 2023); IPC-4101E경질 및 다층 인쇄 기판용 기본 재료 사양 (March 2017); IPC-4552무전해 니켈/침수 금의 성능 사양 (동의하다) 인쇄 기판용 도금
- 이솔라 그룹 — TerraGreen® 400G Product Data Sheet
- UL (보험업자 실험실) — UL 94 다섯-0 가연성 등급, UL File Number E41625
- 산업 기술 문헌 — HDI PCB stackup design and 2+N+2 structure technical documentation
