4-Layer DDR Substrate Board Manufacturer | High-Speed HL832 Material

Lead the High-Speed Era: UGPCB’s 4-Layer DDR Substrate Board – The Superior Interconnect Solution for Your Core ICs

In the booming landscape of high-performance computing, ปัญญาประดิษฐ์, and next-generation communication devices, every advancement in Double Data Rate (DDR) technology places stricter demands on PCB substrates. Leveraging deep expertise in high-end PCB manufacturing และ สารตั้งต้น IC การแก้ปัญหา, UGPCB introduces its premium 4-Layer DDR Substrate Board. Engineered with cutting-edge materials, it is specifically designed to carry high-performance memory chips (เช่น, DDR4, DDR5, LPDDR), serving as your reliable partner in the pursuit of ultimate speed and stability.

ภาพรวมผลิตภัณฑ์ & คำนิยาม

อัน 4-Layer DDR Substrate Board is a High-Density Interconnect (HDI) printed circuit board designed for packaging and connecting Dynamic Random-Access Memory (DDR) chips. It acts as a critical bridge between the chip and the mainboard, responsible for transmitting high-speed signals, distributing power, and providing stable mechanical support. Unlike standard PCB boards, DDR substrates demand near-perfect signal integrity, การจัดการความร้อน, and dimensional accuracy. This product from UGPCB is tailor-made to meet these stringent requirements.

UGPCB's 4-Layer DDR Substrate Board

ข้อควรพิจารณาการออกแบบที่สำคัญ

Precise Impedance Control: Paramount for DDR PCB design, it minimizes signal reflection and distortion during high-speed data transmission.
ความสมบูรณ์ของพลังงาน (PI): Dedicated power and ground plane design ensures clean, stable power delivery, reducing noise interference on critical signals.
1. ความสมบูรณ์ของสัญญาณ (และ): Optimized routing using microstrip and stripline structures minimizes crosstalk and delay, forming the foundation for stable performance post-แอสเซมบลี PCBA.
การจัดการความร้อน: The substrate material must exhibit excellent thermal properties to aid chip dissipation and ensure long-term reliability.

มันทำงานอย่างไร

The 4-Layer DDR Substrate connects the hundreds of micro-pins of a memory chip to the corresponding motherboard circuits via its precise internal layers. ของมัน “sandwich” stack-up (Signal-Ground-Power-Signal) provides clear return paths for high-speed signals, effectively suppressing Electromagnetic Interference (อีเอ็มไอ). The soft gold surface finish ensures a reliable, low-resistance solder joint with the chip’s solder balls (เช่น, in BGA packages).

แอปพลิเคชันหลัก & การจำแนกประเภท

แอปพลิเคชันหลัก: Extensively used in servers, data center switches, high-end GPUs, AI accelerator cards, network storage devices, and any cutting-edge electronic product requiring high-speed, high-capacity memory.
การจำแนกประเภท:
- By Layer Count: Beyond standard 4-layer, designs can extend to 6, 8, or more layers based on complexity.
- โดยวัสดุ: Can be categorized into standard FR-4, Mid-Loss, and this product’s focus – Low-Loss material substrates.

วัสดุ & Performance Specifications

พารามิเตอร์	ข้อมูลจำเพาะ	Performance Advantage
Core Material	Mitsubishi Gas Chemical HL832	Industry-recognized, ประสิทธิภาพสูง, low-loss (Low Df) laminate designed for high-speed digital circuits, significantly reducing signal transmission loss.
จำนวนเลเยอร์	4 เลเยอร์	Optimal “Signal-Ground-Power-Signal” stack-up, balancing design complexity, ค่าใช้จ่าย, และประสิทธิภาพ.
ความหนาสำเร็จรูป	0.25มม	Ultra-thin profile, conforming to compact chip packaging trends for integration into miniaturized devices.
ความหนาของทองแดง	0.5ออนซ์ (17.5μm)	Standard starting weight, suitable for fine-line etching; can be plated up for higher current needs.
สีหน้ากากประสาน	สีเขียว (AUS308)	Provides excellent insulation protection and visual contrast for Optical Inspection (Aoi) หลังจาก การประกอบ PCB.
พื้นผิวเสร็จสิ้น	Soft Gold (เห็นด้วย)	Excellent surface planarity and low hardness, ensures superior compatibility with wire bonding or BGA solder balls for reliable connections.
Minimum Drilled Hole Size	100μm	Supports high-density micro-via design for complex chip pinout interconnection.
นาที. Line Width/Space	50μm / 75μm	High-precision routing capability allows more high-speed lines in limited space, meeting high-density interconnect PCB design needs.

Product Structure & คุณสมบัติที่สำคัญ

โครงสร้าง: Typical 4-layer sequential lamination: Top Layer (Signal/Components) -> Inner Layer 1 (Solid Ground Plane) -> Inner Layer 2 (Solid Power Plane) -> Bottom Layer (Signal/Components). This structure offers optimal shielding for high-speed signals.
คุณสมบัติที่สำคัญ:
- Superior High-Speed Performance: HL832 low-loss material ensures excellent signal integrity for high-frequency DDR signals.
- High-Density Interconnect Capability: 100μm micro-vias and 50μm line width technology support advanced chip packaging.
- ความน่าเชื่อถือสูง: ENIG surface finish offers excellent solderability and oxidation resistance for long-term stability.
- Ultra-Thin & Precise: 0.25mm overall thickness meets stringent space requirements in modern electronics.

Precision Manufacturing Process

ของเรา การผลิต PCB process adheres to the highest quality standards:
Material Prep → Inner Layer Imaging & Etching → Lamination & Drilling → Metallization & Plating → Outer Layer Imaging → Surface Finish (เห็นด้วย) → Solder Mask Application → Profiling → Electrical Test & การตรวจสอบขั้นสุดท้าย.
Each stage is supported by advanced inspection equipment (เช่น, Aoi, Flying Probe Test), ensuring every สารตั้งต้น IC delivered is flawless.

Typical Use Cases

This 4-Layer DDR Substrate is the ideal choice for:

Data Centers & เซิร์ฟเวอร์: Carrying CPU and memory modules for massive data processing.
AI & Machine Learning Hardware: Memory subsystems in GPU, NPU accelerator cards.
High-End Communication Equipment: High-speed memory units in 5G base stations and core network gear.
Flagship Consumer Electronics: Main memory substrates in top-tier gaming consoles and laptops.

DDR Substrate in AI Accelerator Card with Memory

Why Choose UGPCB’s 4-Layer DDR Substrate?

We are more than a ผู้ผลิต PCB; we are your solution provider for high-speed design challenges. With a dedicated PCB design support team, proven capabilities in multilayer PCB prototyping and mass production, and a deep understanding of signal integrity engineering, choosing UGPCB means gaining not just a high-quality substrate, but an accelerator for your product’s success.