Hochleistungsfähige 18-Lagen-Basisstationsplatine | Panasonic M6-Material

Einführung in die 18Layers Communication Base Station PCB

The 18Layers Communication Base Station PCB is a sophisticated and high-performance Leiterplatte designed specifically for use in communication base stations. Das Leiterplatte offers exceptional durability, Zuverlässigkeit, and efficiency, making it an ideal choice for critical communication infrastructure applications.

Key Features and Specifications

Material

• Material: The PCB is made from Panasonic M6, a high-quality material known for its excellent electrical properties and thermal stability. This ensures that the PCB can withstand harsh environmental conditions and maintain optimal performance.

Layers and Copper Thickness

• Schichten: Mit 18 Schichten, this PCB provides extensive space for complex circuit designs required in advanced communication systems.
• Kupferdicke: The copper thickness ranges from 0.5 Zu 1 oz, allowing for robust signal transmission and power distribution across the board.

Dimensions and Surface Treatment

• Fertige Dicke: The PCB has a finished thickness of 2.0mm, which provides structural integrity and mechanical strength.
• Oberflächenbehandlung: It features an immersion gold surface treatment. This not only enhances the aesthetic appeal but also improves solderability, Korrosionsbeständigkeit, and contact reliability.

Precision Design

• Spur/Raum: Featuring precise trace/space measurements of 4mil/4mil (0.1Mm/0,1 mm), this PCB ensures high-density interconnectivity with minimal crosstalk and signal loss.
• Min -Loch: Die minimale Lochgröße beträgt 0,2 mm (8Mil), enabling fine-pitch components and high-density layouts.

Besondere Prozesse

• Spezialprozess: The PCB incorporates a metal edging process, which adds extra strength and protection to the edges, enhancing the overall durability and lifespan of the board.

Anwendungen

The 18Layers Communication Base Station PCB is primarily used in communication base station applications where high reliability and performance are crucial. Dazu gehören:

• Mobile network base stations
• Radio frequency (Rf) transceivers
• Microwave communication systems
• Data center networking devices

Produktionsprozess

The manufacturing process of the 18Layers Communication Base Station PCB involves several meticulous steps to ensure the highest quality standards:

1. Materialauswahl: High-grade Panasonic M6 Material is selected for its superior electrical properties and durability.
2. Schichtstapel: Der 18 layers are carefully stacked and bonded together using advanced laminating techniques.
3. Etching and Drilling: Precision etching and drilling processes create the intricate circuit patterns and holes necessary for component placement.
4. Plating and Soldermask Application: Immersion gold plating and soldermask application provide the final surface treatment, ensuring excellent conductivity and protection against environmental factors.
5. Qualitätskontrolle: Each PCB undergoes rigorous testing and inspection to meet strict quality criteria before being packaged for shipment.

Abschluss

The 18Layers Communication Base Station PCB is a highly specialized product designed to meet the demanding requirements of modern communication infrastructure. Seine fortschrittlichen Materialien, precision design, and stringent manufacturing processes make it a reliable choice for any high-performance communication system. Whether you are building mobile network base stations or data center equipment, this PCB offers unmatched reliability and performance.