26-Hersteller von Layer-Hochleistungs-Server-PCBs | UGPCB | Hoher Tg 170, Kulisse

UGPCB 26-Layer High-Performance Server PCB: The Core Foundation for Data Center Computing Power

In the digital era, servers are the “super-brains” processing massive data, and the Server Leiterplatte (Leiterplatte) is the critical “Neurales Netzwerk” of this brain. A well-designed, precisely manufactured high-end server motherboard PCB directly determines a data center’s processing speed, power efficiency, and long-term operational stability. Leveraging deep expertise in hohe Geschwindigkeit, High-Layer-Count Leiterplattenherstellung, UGPCB has developed this flagship 26-layer server PCB for next-generation High-Performance Computing (HPC), AI -Server, and cloud data centers. It is engineered to deliver exceptional electrical performance and reliable physical structure to support extreme computational loads.

Product Definition & Überblick: What is a High-End Server PCB?

A high-end server PCB is a complex, multi-layer circuit board designed to host core components like CPUs, Erinnerung, high-speed interfaces (z.B., PCIE, CXL), and power management units, and to establish ultra-high-speed, highly reliable electrical connections between them. It is not just a mechanical substrate but a critical platform for ensuring signal integrity and power integrity at GHz frequencies. Das UGPCB product features a sophisticated 26-layer PCB stack-up, utilizing advanced materials and processes specifically engineered for demanding applications like big data processing and AI training.

Core Design Points & Arbeitsprinzip

The primary function of a server PCB is to provide a low-loss, low-interference transmission path for high-speed digital signals and high-current power delivery. Its design revolves around several key principles:

1. Signalintegrität (UND): The use of Hochgeschwindigkeitsmaterialien (Tg 170) and precise control over trace width/spacing of 0.08mm/0.09mm minimizes signal attenuation and distortion, ensuring error-free data transmission at rates of tens of Gb/s.

2. Kraftintegrität (PI): The incorporation of 2oz heavy copper (2/2 oz) for power and internal planes reduces DC resistance and temperature rise, delivering ample and clean power to high-power chips like CPUs/GPUs.

3. Impedanzkontrolle & Kulisse: Strict impedance control is applied to high-speed channels. A key innovation is the use of backdrilling technology to remove the unused conductive stub (barrel) of plated through-holes, eliminating signal reflection points—a core process for enhancing signal quality in Hochgeschwindigkeits-PCBs.

4. Thermalmanagement & Zuverlässigkeit: A finished board thickness of 2.97mm ±10% Und hohe Tg 170 Material provide excellent mechanical strength and heat resistance, ensuring the PCB remains stable and reliable under the prolonged, high-temperature, full-load operation of servers.

Technische Spezifikationen & Materialien

• Schichtzahl & Dicke: 26 Schichten, finished board thickness 2.97mm ±10%.

• Copper Weight Stack-up: Complex configuration: 1/1/H/1/H/1/H/1/H/1/H/2//2/2/H/1/H/1/H/1/H/1/H/1/1 oz. Critical power layers use 2oz heavy copper to balance signal and power needs.

• Kernmaterial: Taiyao TU883 hohe Geschwindigkeit, low-loss laminate mit a Glasübergangstemperatur (Tg) of 170°C. It offers a very low dielectric constant (Dk) and dissipation factor (Df), making it a top-tier choice for high-speed PCB materials.

• Line Precision: Minimum trace width/space of 0.08mm / 0.09mm, enabling high-density routing.

• Micro-Via Technology: Supports a minimum mechanical drill diameter of 0.20mm, meeting high-density interconnection (HDI) Anforderungen.

• Oberflächenbeschaffung: Bio -Lötlichkeitsschutz (OSP) provides a flat, highly solderable surface for high-performance BGA and chip Komponenten, offering excellent cost-effectiveness.

Product Classification, Struktur & Merkmale

• Scientific Classification: This product belongs to the category of “High-End Multi-Layer High-Speed Server Motherboard PCBs”, speziell “Hoher Tg, High-Layer-Count, Backdrilled, Heavy-Copper Power Delivery PCBs”.

• Core Structural Features:

  • Multi-Layer Lamination: Precise arrangement of signal, ground, and power planes creates effective electromagnetic shielding and low-impedance return paths.

  • Backdrill Structure: Through-holes for critical high-speed links (z.B., PCIe lanes, memory slot connections) are backdrilled to significantly enhance high-frequency performance.

  • RTF Copper Foil Application: The use of Reverse Treated Foil provides a smoother copper surface, further reducing signal loss during transmission along the conductor.

Rigorous Production Process

UGPCB’s manufacturing process strictly adheres to IPC-A-600G/6012 Class 2/3 Standards, with enhanced controls for server PCBs:
Material Cutting → Inner Layer Imaging & AOI Inspection → Lamination & Drilling → Electroless & Electrolytic Copper Deposition → Backdrilling Process → Outer Layer Imaging → Secondary AOI & Impedance Testing → Solder Mask & OSP Application → Electrical Test (Flying Probe/Test Fixture) → Final Visual Inspection & Verpackung.
Unter diesen, backdrilling Und Impedanztest are critical control points ensuring the quality of this high-performance server PCB.

Target Applications

This product is specifically designed and manufactured for the following high-end applications:

• Künstliche Intelligenz & Machine Learning Servers: Hosting training and inference GPU/ASIC clusters.

• Cloud Computing & Data Center Servers: For High-Performance Computing (HPC) clusters and virtualization hosts.

• Enterprise Storage Servers: Storage devices requiring high reliability and numerous high-speed data interfaces.

• 5G Core Network Equipment: Network infrastructure handling high-speed data switching.