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Doosan DS-7409 HG (KQ) IC Package substrate material - UGPCB

PCB-Materialliste

Doosan DS-7409 HG (KQ) IC Package substrate material

Einführung

UGPCB DS-7409 HG (KQ) IC Package substrate material is Low Df, Halogen & phosphorous free. Applications include Flip chip BoC & RF module.

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DS-7409 Variants

DS-7409
DS-7409S (N)

Material Properties of DS-7409

Tg (Glasübergangstemperatur)

Property: Tg
Einheit: Grad Celsius
Test Condition: DSC
Typischer Wert: 170
Test Method: IPC-TM-650.2.4.25c

Tma (Thermomechanical Analysis)

Property: Tma
Einheit: Grad Celsius
Test Condition: N/A
Typischer Wert: 165
Test Method: IPC-TM-650.2.4.24c

CTE Z-axis (Wärmeleitkoeffizient)

Property: CTE Z-axis
Einheit: PPM/Grad Celsius
Test Condition: Ambient to Tg
Typischer Wert: 41
Test Method: IPC-TM-650.2.4.41

Z-axis Expansion

Property: Z-axis Expansion
Einheit: %
Test Condition: 50 degree Celsius to 260 Grad Celsius
Typischer Wert: 3.3
Test Method: IPC-TM-650.2.4.41

Decomposition Temperature (5% wt loss)

Property: Decomposition Temperature
Einheit: Grad Celsius
Test Condition: TGA
Typischer Wert: 295
Test Method: IPC-TM-650.2.4.40

T-260 & T-288 (Thermomechanical Analysis)

Property: T-260
Einheit: min
Test Condition: Tma
Typischer Wert: 7
Test Method: IPC-TM-650.2.4.24.1

Property: T-288
Einheit: min
Test Condition: Tma
Typischer Wert: –
Test Method: IPC-TM-650.2.4.24.1

Dielektrizitätskonstante & Dissipationsfaktor

Property: Dielektrizitätskonstante (Harzinhalt 50%)
Einheit: C-24/23/50(1GHz)
Test Condition: N/A
Typischer Wert: 4.2
Test Method: IPC-TM-650.2.5.5.9

Property: Dissipationsfaktor (Harzinhalt 50%)
Einheit: C-24/23/50(1GHz)
Test Condition: N/A
Typischer Wert: 0.015
Test Method: IPC-TM-650.2.5.5.9

Schalenstärke

Property: Schalenstärke (Standard profile 1oz)
Einheit: N/mm
Test Condition: Zustand A
Typischer Wert: 2.0
Test Method: IPC-TM-650.2.4.8

Wasseraufnahme

Property: Wasseraufnahme
Einheit: %
Test Condition: E-24/50+D-24/23
Typischer Wert: 0.12
Test Method: IPC-TM-650.2.6.2.1

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