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F4b-1al(Cu)-Teflon-PCB-Glasstoff-Stoffkupferlaminate - UGPCB

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F4b-1al(Cu)-Teflon-PCB-Glasstoff-Stoffkupferlaminate

F4B-1/Al (Cu): A Microwave Circuit Metal Base Material

F4B-1/Al (Cu) ist eine Art von Mikrowellenschaltungsmetall-Basismaterial, das Teflon-Laminate mit Kupferlaminaten verwendet. This unique construction features copper pressed on one side and an aluminum (or copper) plate on the other side.

F4B-1/AL Technical Specifications

The technical specifications for F4B-1/AL are as follows:

  • Materialzusammensetzung: Copper and aluminum (or copper) plates with Teflon PCB glass fabric.
  • Anwendungen: Suitable for radio/microwave PCBs, hybrid high-frequency applications, und mehr.

UGPCB Products

At UGPCB, we offer a wide range of products tailored to meet various needs:

  • Radio/Microwave PCB /Hybrid High Frequency
  • FR4 Double/Multi-Layer
  • 1~3+N+3 HDI
  • Anylayer HDI
  • Starr-Flex-Leiterplatte
  • Blind Buried PCB
  • Blind Slot PCB
  • Backdrilled PCB
  • IC-Substrat
  • Heavy Copper PCB

Feel free to contact us through any means available for further inquiries or assistance. Our team at UGPCB is committed to providing prompt responses and excellent service.

For sales inquiries, please send an email to sales@ugpcb.com.

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