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F4BK-1/2 Teflon Woven Glass Fabric Copper-Clad Laminates
F4BK-1/2 Teflon woven glass fabric copper-clad laminates is a composite of glass cloth, Polytetrafluorethylenharz und Polytetrafluorethylen, laminated in accordance with scientific formula and strict technological process. This product has certain advantages over the F4B series in terms of electrical performance (a wider range of dielectric constant).
Technische Spezifikationen
Aussehen
Meet the specification requirements for the laminate of microwave PCB by National and Military Standards.
Typen
- F4BK225
- F4BK265
Dielektrizitätskonstante
- 2.25
- 2.65
Dimension(mm)
- 300*250
- 380*350
- 440*550
- 500*500
- 460*610
- 600*500
- 840*840
- 1200*1000
- 1500*1000 For special dimension, customized laminates are available.
Dicke und Toleranz(mm)
| Laminatdicke | Toleranz |
|---|---|
| 0.25 | ± 0,025 |
| 0.5 | ± 0,05 |
| 0.8 | ± 0,05 |
| 1.0 | ± 0,05 |
| 1.5 | ± 0,05 |
| 2.0 | ±0.075 |
| 3.0 | ± 0,09 |
| 4.0 | ±0.10 |
| 5.0 | ±0.10 |
Die Laminatdicke umfasst die Kupferdicke. For special dimensions, customized laminates are available.
Mechanische Stärke
Warp
| Dicke(mm) | Maximale Warp |
|---|---|
| Original board | Single side |
| 0.25～ 0,5 | 0.030 |
| 0.8～ 1.0 | 0.025 |
| 1.5～ 2.0 | 0.020 |
| 3.0～ 5.0 | 0.015 |
Kraft schneiden/Stanzstärke
| Thickness1mm | No Burrs After Cutting | Minimum Space Between Two Punching Holes | No Delamination |
|---|---|---|---|
| 0.55mm | |||
| >1mm | 1.10mm |
Schalenstärke (1Oz Kupfer)
- Normaler Zustand: ≥12N/cm; Keine Blasen oder Delaminierung. Peel strength ≥10N/cm (in constant humidity and temperature, and kept in melting solder at 260°C±2°C for 20 Sekunden).
Chemical Property
According to the properties of the laminate, the chemical etching method for PCB can be used. The dielectric properties of the laminate are not changed. The plating through hole can be done but the sodium treatment or the plasma treatment must be used.
Electrical Property
| Name | Testbedingung | Einheit | Wert |
|---|---|---|---|
| Dichte | Normaler Zustand | g/cm³ | 2.2～ 2.3 |
| Feuchtigkeitsabsorption | Eintauchen in destilliertes Wasser 20 ± 2 ° C für 24 Std. | % | ≤ 0,1 |
| Betriebstemperatur | High-Low-Temperaturkammer | °C | -50°C～+250°C |
| Wärmeleitfähigkeit | W/m/k | 0.3 | |
| CTE (typisch) | ppm/° C. | ||
| εr :2.1~2.3 | 25(X), 34(y), 240(z) | ||
| εr :2.3~2.9 | 16(X), 21(y), 186(z) | ||
| Schrumpfungsfaktor | 2 Stunden im kochenden Wasser | % | ≤ 0.0002 |
| Oberflächenwiderstand | M; Oh | ||
| Normaler Zustand | ≥3*10^4 | ||
| Konstante Luftfeuchtigkeit und Temperatur | ≥8*10^3 | ||
| Volumenwiderstand | Mω · cm | ||
| Normaler Zustand | ≥2*10^6 | ||
| Konstante Luftfeuchtigkeit und Temperatur | ≥2*10^5 | ||
| Oberflächendielektriefestigkeit | d = 1mm(KV/mm) | ||
| Normaler Zustand | ≥ 1,2 | ||
| Konstante Luftfeuchtigkeit und Temperatur | ≥ 1,1 | ||
| Dielektrizitätskonstante | |||
| 10GHz | εr | ||
| 2.25,2.65 | |||
| Dissipationsfaktor | Tgside | ||
| ≤1.5*10^-3 |
This structured format ensures that each section is clearly defined and logically organized, making it easier to understand the key points and specifications of the F4BK-1/2 Teflon woven glass fabric copper-clad laminates.
