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Teflon Woven Glass Fabric Copper-Clad Laminates
Teflon woven glass fabric copper-clad laminates are formulated with varnished glass cloth, Prepreg, and Teflon PCB resin through scientific formulation and strict technology procedures. These materials offer several advantages over the F4B series in terms of electrical performance, including a wider range of dielectric constants, low dielectric loss angle tangent, increased resistance, and more stable performance.
Technische Spezifikationen
Aussehen
The appearance meets the specification requirements for microwave PCB baseplates specified in National and Military Standards.
Typen
- F4BM220
- F4BM255
- F4BM265
- F4BM300
- F4BM350
Permittivity
- 2.20
- 2.55
- 2.65
- 3.0
- 3.50
Dimensions (mm)
- 300*250
- 350*380
- 440*550
- 500*500
- 460*610
- 600*500
- 840*840
- 840*1200
- 1500*1000
For special dimensions, customized lamination is available.
Dicke und Toleranz (mm)
| Plate Thickness | Toleranz |
|---|---|
| 0.25 | ±0.02～±0.04 |
| 0.5 | |
| 0.8 | |
| 1.0 | |
| 1.5 | ±0.05～±0.07 |
| 2.0 | |
| 3.0 | |
| 4.0 | |
| 5.0 |
Plate thickness includes the copper thickness. For special dimensions, customized lamination is available.
Mechanische Eigenschaften
Angularity
| Plate Thickness(mm) | Maximum Angularity mm/mm |
|---|---|
| Original board | Single-sided board |
| 0.25～ 0,5 | 0.03 |
| 0.8～ 1.0 | 0.025 |
| 1.5～ 2.0 | 0.020 |
| 3.0～ 5.0 | 0.015 |
Cutting/ Punching Property
- For plates <1mm, no burrs after cutting, minimum space between two punching holes is 0.55mm, no separation.
- For plates ≥1mm, no burrs after cutting, minimum space between two punching holes is 1.10mm, no separation.
Schalenstärke
- In normal state: ≥18N/cm; no bubbling, no separation, and peel strength ≥15 N/cm when in the environment of constant humidity and temperature and kept in the melting solder of 260 degree Celsius±2 degree Celsius for 20 Sekunden.
Chemische Eigenschaften
According to different properties of baseplates, the chemical etching method for PCB can be used for the circuit processing, the dielectric properties of materials are not changed and the holes can be metallized.
Elektrische Eigenschaften
| Names | Test Conditions | Einheit | Spezifikationen |
|---|---|---|---|
| Gravity | Normaler Zustand | g/cm3 | 2.2～ 2.3 |
| Water absorption rate | Dip in distilled water of 20±2 degree Celsius for 24 Std. | % | ≤0.02 |
| Operating temperature | High-Low-Temperaturkammer | Grad Celsius | -50～+260 |
| Thermal conductivity coefficient | Kcal /m .h. Grad Celsius | 0.8 | |
| Coefficient of thermal expansion | Temperature rise of 96 degree Celsius per hour | Coefficient of thermal expansion*1 | ≤5*10^-5 |
| Shrinkage factor | Two hours in boiling water | % | 0.0002 |
| Surface insulation resistance | 500In DC | Normaler Zustand | Mω |
| Konstante Luftfeuchtigkeit und Temperatur | ≥1*10^3 | ||
| Volume resistance | Normaler Zustand | Mω.cm | ≥1*10^6 |
| Konstante Luftfeuchtigkeit und Temperatur | ≥1*10^5 | ||
| Pin resistance | 500In DC | Normaler Zustand | Mω |
| Konstante Luftfeuchtigkeit und Temperatur | ≥1*10^3 | ||
| Surface dielectric strength | Normaler Zustand | δ=1mm(kV/mm) | ≥ 1,2 |
| Konstante Luftfeuchtigkeit und Temperatur | ≥ 1,1 | ||
| Permittivity | 10GHz | Ist | 2.20 |
| 2.55 | |||
| 2.65(± 2%) | |||
| 3.0 | |||
| 3.5 | |||
| Dielectric loss angle tangent | 10GHz | Tgside | ≤7*10^-4 |
UGPCB has produced Teflon woven glass fabric copper-clad laminates products steadily. If you need them, Bitte wenden Sie sich an UGPCB.
