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Reliable 2-Layer Industrial Rigid PCB Manufacturer | FR-4 TG150, 1.6milímetros, HASL sin plomo - UGPCB

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Reliable 2-Layer Industrial Rigid PCB Manufacturer | FR-4 TG150, 1.6milímetros, HASL sin plomo

Recuento de capas: 2 PCB rígido de capas

Grosor del tablero: 1.60milímetros

Material: FR-4 TG150

Acabado superficial: Nivelación de soldadura por aire caliente sin plomo (HASL), Máscara de soldadura blanca, Leyenda Negra

  • Detalles del producto

Introducción

UGPCB‘s 2-Layer Rigid PCB is a fundamental, alta fiabilidad tarjeta de circuitos solution engineered for demanding applications. Built on a robust Sustrato FR-4 TG150 with a standard 1.60mm thickness, it delivers an optimal balance of performance, durabilidad, and cost-effectiveness. The board features a reliable lead-free Hot Air Solder Leveling (HASL) acabado superficial, a protective black solder mask, and clear white silkscreen legends for identification.

UGPCB‘s 2-Layer Rigid PCB

Descripción general del producto & Clasificación

This double-sided PCB serves as a core interconnect platform for a wide range of electronics. It is scientifically classified as a PCB rígido (by construction), a 2-Layer or Double-Sided Board (by layer count), and is rated for Industrial Grade (Clase IPC 2) applications based on its FR-4 TG150 material specification, making it suitable for extended lifecycle products.

Diseño & Principio operativo

Successful implementation requires attention to electrical and thermal design rules. Adequate trace width for current capacity (p.ej., 1A per 10mil trace width for 1oz copper) and strategic placement of thermal reliefs are critical. The PCB functions as a miniature city: el FR-4 substrate is the foundation, copper traces are the roads carrying signals and power, plated through-holes are interlayer connectors, el máscara de soldadura is a protective coating, and the serigrafía provides navigation.

Construcción, Materiales & Actuación

The symmetrical stack-up ensures mechanical stability. Key materials define its capabilities:

  • Centro: FR-4 TG150 Laminate (Tg ≥ 150°C) provides high thermal endurance and stability.

  • Cobre: Standard 1oz (35µm) electrodeposited copper foil.

  • Acabados: Black LPI solder mask and white epoxy silkscreen.

  • Acabado superficial: Lead-Free HASL for excellent solderability.

This combination yields high heat resistance, superior electrical insulation, strong mechanical rigidity (from the 1.60mm thickness), and excellent solder joint reliability.

Proceso de fabricación & Control de calidad

Our production follows Normas IPC, encompassing CAM engineering, precision drilling, galvanoplastia, LPI solder mask application, legend printing, lead-free HASL surface finishing, and electrical testing. Every board undergoes 100% electrical testing and Inspección óptica automatizada (AOI) to meet stringent quality criteria.

Aplicaciones

This versatile PCB is ideal for:

  • Industrial Control Systems: PLC, unidades de motor, sensor interfaces.

  • Electrónica de potencia: Switch-mode power supplies (SMPS), UPS boards, LED drivers.

  • Automotor & Electrónica de Consumo: Auxiliary control modules, amplificadores de audio, appliance controllers.

LED driver power supply is one of the primary application scenarios for 2-layer PCBs.

Key Specifications Table

Parámetro Especificación
capas 2
Grosor del tablero 1.60 milímetros (Estándar)
Materia prima FR-4, Tg ≥ 150°C
Peso del cobre 1 onz (35 µm) Estándar
Máscara de soldadura Negro, LPI
Platina Blanco
Acabado superficial HASL sin plomo
mín.. Trace/Spacing ≥ 0.15 milímetros (6 mil)
Standard Compliance IPC-A-600, Clase IPC 2

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